Patents by Inventor Patrick Whiting

Patrick Whiting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371777
    Abstract: Embodiments disclosed herein include an interposer. In an embodiment, the interposer comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a via is provided through the substrate, where a portion of the via extends past the second surface. In an embodiment, a first layer is over the substrate, where the first layer is an electrically insulating material. In an embodiment, a second layer is over the first layer and over the portion of the via that extends past the second surface.
    Type: Application
    Filed: May 1, 2023
    Publication date: November 7, 2024
    Inventors: Arijit KOLEY, Ashish BHATIA, Wayne M. LYTLE, Stephen SUDIRGO, Nora BERG, Patrick WHITING, Michael MUSORRAFITI, Olawale Taiwo OLADEINDE, Emily TIMMINS, Beatrice MURIUNGI, Matthew TAYLOR
  • Patent number: 11901164
    Abstract: A method is disclosed, which comprises estimating a first value of a parameter of a component, prior to a use of the component in a reactor. In an example, the parameter of the component is to change during the use of the component in the reactor. The component may be treated, subsequent to the use of the component in the reactor. A second value of the parameter of the component may be estimated, subsequent to treating the component. The second value may be compared with the first value, where a reuse of the component in the reactor is to occur in response to the second value being within a threshold range of the first value.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Patrick Whiting, Jeffrey L. Young, Ryan Wood, Eric Scott, David Laube, Alex Collins
  • Publication number: 20220028668
    Abstract: A method is disclosed, which comprises estimating a first value of a parameter of a component, prior to a use of the component in a reactor. In an example, the parameter of the component is to change during the use of the component in the reactor. The component may be treated, subsequent to the use of the component in the reactor. A second value of the parameter of the component may be estimated, subsequent to treating the component. The second value may be compared with the first value, where a reuse of the component in the reactor is to occur in response to the second value being within a threshold range of the first value.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Applicant: Intel Corporation
    Inventors: Patrick Whiting, Jeffrey L. Young, Ryan Wood, Eric Scott, David Laube, Alex Collins
  • Patent number: 11139151
    Abstract: A method is disclosed, which comprises estimating a first value of a parameter of a component, prior to a use of the component in a reactor. In an example, the parameter of the component is to change during the use of the component in the reactor. The component may be treated, subsequent to the use of the component in the reactor. A second value of the parameter of the component may be estimated, subsequent to treating the component. The second value may be compared with the first value, where a reuse of the component in the reactor is to occur in response to the second value being within a threshold range of the first value.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Patrick Whiting, Jeffrey L. Young, Ryan Wood, Eric Scott, David Laube, Alex Collins
  • Patent number: 11112430
    Abstract: A probe head may be utilized to test an electronic device. The probe head may include a probe axis extending along a length of the probe head. The probe head may include a probe core including a first metal. The probe core may include a core surface having a first dimension. The first dimension may be perpendicular to the probe axis. The probe core may include a probe tip, for instance extending from the core surface along the probe axis. The probe tip has a second dimension that may be perpendicular to the probe axis. The second dimension may be less than the first dimension of the core surface. The probe head may include a cladding layer that includes a second metal. The cladding layer may be coupled around a perimeter of the probe core. The probe tip may extend beyond the cladding layer.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: September 7, 2021
    Assignee: Intel Corporation
    Inventors: Anil Kaza, Donald E. Edenfeld, Todd P. Albertson, Patrick Whiting
  • Publication number: 20210265137
    Abstract: Following use of a reactive process chamber, a component of the chamber, such as an edge ring that is to surround a workpiece during an etching process, may be refurbished through one or more residue removal operations followed by a surface texturing operation. The texturing operation may entail media blasting with a gaseous media propellant comprising a smaller fraction of O2 than air, such as high purity dry N2. The more inert gaseous media propellant may advantageously control oxygen contamination of a bulk metal, such as aluminum. Reconditioning may further entail a chemical treatment, which thins or completely removes, a surface oxide present after the texturing operation. The conditioned surface may then have a surface composition and texture that is capable of matching the performance of a previously unused chamber component.
    Type: Application
    Filed: February 9, 2021
    Publication date: August 26, 2021
    Applicant: Intel Corporation
    Inventors: Jeffrey Young, Patrick Whiting, David Laube
  • Publication number: 20200309818
    Abstract: A probe head may be utilized to test an electronic device. The probe head may include a probe axis extending along a length of the probe head. The probe head may include a probe core including a first metal. The probe core may include a core surface having a first dimension. The first dimension may be perpendicular to the probe axis. The probe core may include a probe tip, for instance extending from the core surface along the probe axis. The probe tip has a second dimension that may be perpendicular to the probe axis. The second dimension may be less than the first dimension of the core surface. The probe head may include a cladding layer that includes a second metal. The cladding layer may be coupled around a perimeter of the probe core. The probe tip may extend beyond the cladding layer.
    Type: Application
    Filed: March 27, 2019
    Publication date: October 1, 2020
    Inventors: Anil Kaza, Donald E. Edenfeld, Todd P. Albertson, Patrick Whiting