Patents by Inventor Patrick William Tierney

Patrick William Tierney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7735279
    Abstract: A building flooring system includes a plurality of polymer-based composite structural underlayment boards overlaying and secured to a building subfloor to form an underlayment layer over the building subfloor and a nonstructural finish-flooring layer overlaying and bonded to the underlayment layer. The polymer-based composite structural underlayment boards each have a polymer material core layer or a predominantly polymer material core layer that typically contains from 1% to 40% by weight filler(s) and a density between 1.6 lbs/ft3 and 25 lbs/ft3. At least the top or bottom major surface of each of the polymer-based composite structural underlayment boards is overlaid by a facer that reinforces and strengthens the polymer-based composite structural underlayment board and that is generally coextensive with and bonded to the overlaid major surface of the polymer-based composite structural underlayment board.
    Type: Grant
    Filed: September 22, 2006
    Date of Patent: June 15, 2010
    Assignee: Johns Manville
    Inventors: Duane R. Paradis, Patrick William Tierney
  • Publication number: 20080124530
    Abstract: A building flooring system includes a plurality of polymer-based composite structural underlayment boards overlaying and secured to a building subfloor to form an underlayment layer over the building subfloor and a nonstructural finish-flooring layer overlaying and bonded to the underlayment layer. The polymer-based composite structural underlayment boards each have a polymer material core layer or a predominantly polymer material core layer that typically contains from 1% to 40% by weight filler(s) and a density between 1.6 lbs/ft3 and 25 lbs/ft3. At least the top or bottom major surface of each of the polymer-based composite structural underlayment boards is overlaid by a facer that reinforces and strengthens the polymer-based composite structural underlayment board and that is generally coextensive with and bonded to the overlaid major surface of the polymer-based composite structural underlayment board.
    Type: Application
    Filed: September 22, 2006
    Publication date: May 29, 2008
    Inventors: Duane R. Paradis, Patrick William Tierney