Patents by Inventor Patrick Y. H. Cheung

Patrick Y. H. Cheung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7952963
    Abstract: Systems and methods for telescopic data compression in sensor networks are disclosed herein. An exemplary method of the disclosed subject matter for telescopically compressing data received from a plurality of sensors in a network adapted to detect a field includes broadcasting a first set of sampling positions to sensors, forming a first set of clusters of sensors based on the sampling positions, receiving data from the sensors contained within the clusters, performing local interpolation of the received data, reconstructing a representation of the field using the interpolated data, and determining areas of interest based on the reconstructed representation of the field.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: May 31, 2011
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Patrick Y. H. Cheung, Nicholas F. Maxemchuck
  • Publication number: 20100091834
    Abstract: Systems and methods for telescopic data compression in sensor networks are disclosed herein. An exemplary method of the disclosed subject matter for telescopically compressing data received from a plurality of sensors in a network adapted to detect a field includes broadcasting a first set of sampling positions to sensors, forming a first set of clusters of sensors based on the sampling positions, receiving data from the sensors contained within the clusters, performing local interpolation of the received data, reconstructing a representation of the field using the interpolated data, and determining areas of interest based on the reconstructed representation of the field.
    Type: Application
    Filed: November 10, 2009
    Publication date: April 15, 2010
    Applicant: The Trustees of Columbia University in The City of New York
    Inventors: Patrick Y.H. Cheung, Nicholas F. Maxemchuk