Abstract: A semiconductor surface-emitting laser array can be provided with a group of independently addressable light-emitting pixels arranged in at least two rows and in a linear array on a common substrate chip and including a common cathode and a dedicated channel associated with an address trace line for each pixel. An aggregate linear pitch can be achieved between pixels of the at least two rows along the linear array in a cross process direction that is less than the size of a pixel. The semiconductor laser array can include more than one common substrate chip tiled and stitched together in a staggered arrangement to provide an at least 11-inch wide, 1200 dpi imager with timing delays associated with each of the more than one common substrate chip in the staggered arrangement.

Abstract: An additive manufacturing device includes a stage configured to support a substrate. The device also includes a printhead disposed above the stage. The printhead is configured to heat a build material to a molten build material and to deposit the molten build material on the substrate in the form of droplets to fabricate an article. The device also includes a controlled heating and ablation system disposed proximal the printhead. The controlled heating and ablation system is configured to heat the substrate and ablate oxides on a surface of the substrate.

Abstract: A method for controlling temperature in a liquid metal three-dimensional (3D) printing system is disclosed, including ejecting a liquid metal drop from a nozzle onto a deposition location to form a portion of a three-dimensional object. The method also includes measuring a temperature at a measurement spot location offset from the deposition location, and comparing the measured temperature with a set point temperature in the deposition location, adjusting a cooling rate of the liquid metal drop. The deposition follows a toolpath to form the portion of the three-dimensional object. The measurement spot location can be located within the toolpath or outside of a toolpath of the three-dimensional object being formed. An additive manufacturing device configured to perform the method includes a printhead that includes a nozzle having an inner cavity, where the nozzle is configured for ejecting droplets of liquid metal drops to form a three-dimensional object.

Abstract: A system for measuring surface heights during three-dimensional fabrication is disclosed, including a point z-height sensor configured to measure a position of a tool fabrication spot on a surface being printed, an attachment mechanism for attaching the point z-height sensor to a tool assembly such that movement of the point z-height sensor remains in sync with a toolpath that may include movement of the tool assembly, and a control system configured to optimize a scan path of the tool based on measured height data and movement of the tool assembly. Implementations of system for measuring surface heights during three-dimensional fabrication may include where the tool is a printhead. Methods for measuring z-height during three-dimensional fabrication using a z-height point sensor and measuring surface height in a three-dimensional printing process are also disclosed.

Abstract: Focusing optics can include optical elements disposed and bonded in a linear arrangement (linear array) in at least two rows. A transparent bonding agent can secure alignment of the at least two rows of the optical elements. Scattering elements can also be disposed in the transparent polymer to cause light diffusion. Diffused or un-diffused light from a semiconductor laser array can then be caused to pass through the optical element and illuminate a target substrate such as an imaging member in a printing system.

Abstract: A system and method of three-dimensional printing that includes heating a portion of a build surface by impinging multiple laser pulses onto the build surface in a time controlled pattern to provide a desired heated build surface prior to depositing a molten material onto the build surface. The time controlled pattern of laser pulses includes at least one heating period and at least one cooling period, and the time for the cooling period is determined by the cooling time of the build surface material, and the temperature differences between the original temperature of the build surface and the desired temperature of the build surface material.

Abstract: Techniques for laser-assisted additive manufacturing are disclosed. An example three-dimensional (3D) printer includes a platen having a surface to support a part during fabrication of the part. The 3D printer also includes an ejector head arranged above the surface of the platen. The ejector head is to eject build material toward the surface of the platen to fabricate the part. The 3D printer also includes a laser heating system to heat a target portion of the part during the fabrication of the part to improve a bond between the build material and the target portion of the part. The laser heating system includes a laser to output a laser beam that exhibits a non-gaussian beam profile.

Abstract: A 3D printing system includes an ejector configured to receive a build material. The ejector includes a nozzle. The ejector is configured to eject a plurality of drops of the build material through the nozzle. The 3D printing system also includes a substrate positioned below the nozzle. The drops fall toward the substrate after being ejected from the nozzle. The drops form a 3D object on the substrate. The 3D printing system also includes a power source configured to generate an alternating electrical current. The 3D printing system also includes an electrode configured to generate a plasma in response to receiving the alternating electrical current. The drops, the 3D object, the substrate, or a combination thereof are positioned at least partially within the plasma.

Abstract: An additive manufacturing device includes a stage configured to support a substrate. The device also includes a printhead disposed above the stage. The printhead is configured to heat a build material to a molten build material and to deposit the molten build material on the substrate in the form of droplets to fabricate an article. The device also includes a controlled heating and ablation system disposed proximal the printhead. The controlled heating and ablation system is configured to heat the substrate and ablate oxides on a surface of the substrate.

Abstract: A laser imager for a printing system, comprising a plurality of independently addressable surface emitting lasers arranged in a linear array on a common substrate chip and including a common cathode and a dedicated control channel associated with an address trace line for each laser of the plurality of independently addressable surface emitting lasers, and optical elements arranged in a linear lens array configured to capture and focus light from the plurality of independently addressable surface emitting lasers onto a imaging member, wherein the plurality of independently addressable surface emitting lasers arranged in a linear array and the optical elements arranged in a linear lens array operate together to image the imaging member.

Abstract: A 3D object printer is disclosed. The 3D object printer advantageously incorporates one or more optical systems and optical devices that improve the operation and output of the 3D object printer including, for example, a laser heating system or an optical monitoring system. A variety of arrangements of optical structures and systems are provided to guide light beam(s), such as laser beams, illumination beams, reflected light beams, etc., into or out of the fabrication environment of the 3D object printer. These optical structures and systems overcome structural and spatial constraints of the 3D object printer, which might otherwise prevent effective operation of the laser heating system or the optical monitoring system.

Abstract: A structure can be provided for collimating light from a light source (e.g., vertical cavity surface emitting diodes). The structure can include at least one light source, a pit formed at an output of the at least one light source and a microbead formed in the pit. Microbeads can function as a lens to collimate light emitting from the at least one light source. The structure can provide by forming an array of VCSELs on a substrate, forming a pit in front of each VCSEL of the array of VCSELs, and assembling a microbead in each pit formed in front of each VCSEL. The microbeads can thereby function as lenses to collimate light emitted from the VCSELs.

Abstract: Additive manufacturing devices and methods for the same are provided. The additive manufacturing device may include a stage configured to support a substrate, a printhead disposed above the stage, and a targeted heating system disposed proximal the printhead. The printhead may be configured to heat a build material to a molten build material and deposit the molten build material on the substrate in the form of droplets to fabricate the article. The targeted heating system may be configured to control a temperature or temperature gradient of the droplets deposited on the substrate, an area proximal the substrate, or combinations thereof.

Abstract: A structure can be provided for collimating light from a light source (e.g., vertical cavity surface emitting diodes). The structure can include at least one light source, a pit formed at an output of the at least one light source and a microbead formed in the pit. Microbeads can function as a lens to collimate light emitting from the at least one light source. The structure can provide by forming an array of VCSELs on a substrate, forming a pit in front of each VCSEL of the array of VCSELs, and assembling a microbead in each pit formed in front of each VCSEL. The microbeads can thereby function as lenses to collimate light emitted from the VCSELs.

Abstract: Focusing optics can include optical elements disposed and bonded in a linear arrangement (linear array) in at least two rows. A transparent bonding agent can secure alignment of the at least two rows of the optical elements. Scattering elements can also be disposed in the transparent polymer to cause light diffusion. Diffused or un-diffused light from a semiconductor laser array can then be caused to pass through the optical element and illuminate a target substrate such as an imaging member in a printing system.

Abstract: A laser imager for a printing system, comprising a plurality of independently addressable surface emitting lasers arranged in a linear array on a common substrate chip and including a common cathode and a dedicated control channel associated with an address trace line for each laser of the plurality of independently addressable surface emitting lasers, and optical elements arranged in a linear lens array configured to capture and focus light from the plurality of independently addressable surface emitting lasers onto a imaging member, wherein the plurality of independently addressable surface emitting lasers arranged in a linear array and the optical elements arranged in a linear lens array operate together to image the imaging member.

Abstract: A semiconductor surface-emitting laser array can be provided with a group of independently addressable light-emitting pixels arranged in at least two rows and in a linear array on a common substrate chip and including a common cathode and a dedicated channel associated with an address trace line for each pixel. An aggregate linear pitch can be achieved between pixels of the at least two rows along the linear array in a cross process direction that is less than the size of a pixel. The semiconductor laser array can include more than one common substrate chip tiled and stitched together in a staggered arrangement to provide an at least 11-inch wide, 1200pdi imager with timing delays associated with each of the more than one common substrate chip in the staggered arrangement.

Abstract: An optical imager system and method of operating the optical imager system, can include one or more imager modules including a laser light source, a collimator, an illumination optical system, a grating light valve, a spatial light modulator and a projection optical system. A group of imager modules can include the one or more imager modules. The group of imager modules is operable in a stacked arrangement to produce an image from in-line stitching of individual images generated by the one or more imager modules. The illumination optical system can homogenize, shape, and direct a beam from the laser light source onto the grating light valve, and homogenization can occur in a cross-process direction.

Abstract: Additive manufacturing devices and methods for the same are provided. The additive manufacturing device may include a stage configured to support a substrate, a printhead disposed above the stage, and a targeted heating system disposed proximal the printhead. The printhead may be configured to heat a build material to a molten build material and deposit the molten build material on the substrate in the form of droplets to fabricate the article. The targeted heating system may be configured to control a temperature or temperature gradient of the droplets in a flight path interposed between the printhead and the substrate.

Abstract: Additive manufacturing devices and methods for the same are provided. The additive manufacturing device may include a stage configured to support a substrate, a printhead disposed above the stage, and a targeted heating system disposed proximal the printhead. The printhead may be configured to heat a build material to a molten build material and deposit the molten build material on the substrate in the form of droplets to fabricate the article. The targeted heating system may be configured to control a temperature or temperature gradient of the droplets in a flight path interposed between the printhead and the substrate.