Abstract: A metal connector profile for the electrical connection and interconnection of back-contact solar cells is described. In addition, a solar module as well as a method for manufacturing such a solar module are described as well.

Abstract: A method for producing a photovoltaic module having backside-contacted semiconductor cells which have contact regions provided on a contact side includes: providing a foil-type, non-conducting substrate having an at least one-sided and at least sectionally electrically conductive substrate coating on a first substrate side; placing the contact sides of the semiconductor cells on a second substrate side; implementing a local perforation which penetrates the substrate and the substrate coating, to generate openings at the contact regions of the semiconductor cells; applying a contact element to fill the openings and to form a contact point between the substrate coating on the first substrate side and the semiconductor cells on the second substrate side.

Abstract: A method for producing a photovoltaic module having backside-contacted semiconductor cells which have contact regions provided on a contact side, the method including providing a non-conducting foil-type substrate, placing the contact sides of the semiconductor cells on the substrate, implementing laser drilling which penetrates the substrate to produce openings in the contact regions of the contact sides of the semiconductor cells, depositing a contacting means on the substrate to fill the openings and to form a contacting layer extending on the substrate.

Abstract: A two-dimensional vertical heteroepitaxial strain controlled composite is grown. The strain-controlling phase can be benign in all other respects so that the functional properties of the parent phase are unchanged, improved/enhanced, and/or manipulated. The new composite is advantageous because there is no need for expensive specialized crystals and because there are no thickness limitations.

Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.