Abstract: The invention describes a method of predicting a stabilization temperature (T?) of a subject (8) with a heat-flow sensor (1) comprising a plurality of thermistors (S1, S2, S1A, S2A, S1B, S2B), which method comprises the steps of expressing the temperature development of the heat-flow sensor (1) as a stretched exponential equation characterized by a time constant (?) and a sensor characteristic scalar value (m); receiving temperature measurement values (T1, T2, T3, T4) collected by the thermistors (S1, S2, S1A, S2A, S1B, S2B); estimating the time constant (?) on the basis of the temperature measurement values (T1, T2, T3, T4); and deducing the future stabilization temperature (T?) on the basis of the estimated time constant (?). The invention further describes heat-flow sensor (1) and a temperature sensing arrangement (9).

Abstract: A finned heat sink, folded from a single piece of plate material, includes a base part and a plurality of fins. The base part includes a plurality of fin extensions and at least one support element. The support element includes bridging parts bridging the inter-fin distances, wherein the bridging parts comprise length reducing parts to thereby reduce those inter-fin distances.

Abstract: The invention provides a method for 3D printing a heat sink (100) by means of fused deposition modelling, the method comprising layer-wise depositing a 3D printable material to provide a plurality of layers (322) of a 3D printed material (202) whereby a heat receiving face (101) of the heat sink (100) is created, the plurality of layers (322) of 3D printed material (202) being configured parallel to planes (325) perpendicular to the heat receiving face (101), wherein the 3D printable material comprises particles embedded in the 3D printable material, wherein the particles have an anisotropic thermal conductivity, wherein the particles are available in the 3D printable material in an amount selected from the range of 5-40 vol. % relative to the total volume of the 3D printable material, and wherein the layers (322) of 3D printed material (202) have layer heights (H) selected from the range of at maximum 800 ?m.

Abstract: The invention provides a method comprising 3D printing a 3D item (1) by means of fused deposition modelling, the method comprising a 3D printing stage comprising layer-wise depositing an extrudate (321) comprising 3D printable material (201) to provide the 3D item (1) comprising 3D printed material (202), wherein during at least part of the 3D printing stage the extrudate (321) comprises a core-shell extrudate (1321) comprising a core (2321) comprising a core material (2011), and a shell (2322) comprising a shell material (2012), wherein the core material (2011) comprises a first thermoplastic material (111) and the shell material (2012) comprises a second thermoplastic material (112) different from the first thermoplastic material (111), or vice versa, wherein the first thermoplastic material (111) is an elastomeric material having a Young's modulus in the range of 2 to 200 MPa, a first low glass transition temperature TLG1 of at maximum 0° C.

Abstract: The invention provides a finned heat sink (100) comprising a plurality of fins (200) and a base part (300) from which the fins (200) extend, the fins (200) having a thickness (d1) and a height (h1) with d1/h1<1, the fins (200) having inter-fin distances (d2) with d2/h1<1, the base part (300) comprising a plurality of fin extensions (310) and a support element (320), with the fin extensions (310) configured in a plane (P) of the base part (300) and with the fin extensions (310) associated with the support element (320), wherein the support element (320) includes bridging parts (330) bridging the inter-fin distances (d2), wherein the bridging parts (330) comprise length reducing parts (340) selected from the group comprising a roll (341), a curve (342), and an angle (343).

Abstract: The invention describes a method of predicting a stabilization temperature (T?) of a subject (8) by means of a heat-flow sensor (1) comprising a plurality of thermistors (S1, S2, S1A, S2A, S1B, S2B), which method comprises the steps of expressing the temperature development of the heat-flow sensor (1) as a stretched exponential equation characterized by a time constant (?) and a sensor characteristic scalar value (m); receiving temperature measurement values (T1, T2, T3, T4) collected by the thermistors (S1, S2, S1A, S2A, S1B, S2B); estimating the time constant (?) on the basis of the temperature measurement values (T1, T2, T3, T4); and deducing the future stabilization temperature (T?) on the basis of the estimated time constant (?). The invention further describes heat-flow sensor (1) and a temperature sensing arrangement (9).

Abstract: A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallizations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

Abstract: A light emitting device such as luminaire includes one or more light emitting device chips mounted on a board. The light emitting device chips have electrical contacts and are flip chip mounted to board with the electrical contacts connected to contact pads. Sidewall metallisations on the sidewalls of the light emitting device chips are connected by metal heat transfer elements to heat dissipation regions of board. The metal heat transfer elements may be of solder which may be deposited using equipment conventionally used for attaching surface mount devices.

Abstract: A sensor system (100) includes a reader (150) with a sensor unit (155, 156) and an accommodation Space (151) for an exchangeable cartridge (110). The cartridge (110) is held in the accommodation space (151) by at least one contact element (111) which has an increased thermal resistance and/or a contact area of reduced size. Thus a more homogenous temperature distribution can be achieved within the cartridge (110), reducing distortions which might adversely affect optical measurements.

Abstract: A wavelength converting element (100), a light emitting module and a luminaire are provided. The wavelength converting element comprises a luminescent element (104) and a light transmitting cooling support (112). The luminescent element comprises a luminescent material (102) and a light transmitting sealing envelope (108) for protecting the luminescent material against environmental influences. The sealing envelope has a first thermal conductivity. The cooling support has a second thermal conductivity that is at least two times the first thermal conductivity. The cooling support comprises a first surface (113) and the sealing envelope comprises a second surface (105). The first surface and the second surface face towards each other. The first surface is thermally coupled to the second surface for allowing through the second surface a conduction of heat towards the cooling support to enable a redistribution of the heat generated in the luminescent element.

Abstract: The invention relates to a sensor system (100) comprising a reader (150) with a sensor unit (155, 156) and an accommodation Space (151) for an exchangeable cartridge (110). The cartridge (110) is held in said accommodation space (151) by at least one contact element (111) which has an increased thermal resistance and/or a contact area of reduced size. Thus a more homogenous temperature distribution can be achieved within the cartridge (110), reducing distortions which might adversely affect optical measurements.

Abstract: A lithographic projection apparatus arranged to project a pattern from a patterning device onto a substrate. The apparatus is provided with a clamp, including a support part configured to support the patterning device or the substrate and a temperature control part configured to control the temperature of the patterning device or the substrate. The clamp is constructed to mechanically isolate the temperature control part from the support part with a flexible connector so that vibrations, shrink and expansion of the temperature control part will not influence the patterning device and/or the substrate.