Patents by Inventor Patrik Eder

Patrik Eder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240143423
    Abstract: Techniques, described herein, include solutions for evaluating a pre-failure condition of a data link. The techniques described allow for detection of the pre-failure condition before actual failure of the data link. A device may receive a first set of training data and compare the first set of training data to a pre-determined set of training data to obtain a first set of values at a first time. The process may be repeated at a second time with a second set of training data and a second set of values respectively. First and second quality metrics may be obtained using the first and second set of values respectively. Based on the first and second quality metrics and a time interval between the first and second times, the pre-failure condition may be determined.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 2, 2024
    Inventors: Patrik Eder, Christian Mueller
  • Publication number: 20240004992
    Abstract: In an embodiment an integrated circuit comprises a plurality of ports. Of a plurality of gating circuits, each gating circuit blocks or grants access to at least one of the ports depending on a release signal. From a plurality of configuration registers, each configuration register for stores the information to which group a gating circuit of the plurality of gating circuits belongs. A tag evaluation circuit receives an identifier from an access request from a component and outputs a group identifier for the access. There is a plurality of comparison circuits. Each comparison circuit compares the group identifier with the content of one of the configuration registers and outputs the release signal to a gating circuit of the plurality of gating circuits.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 4, 2024
    Inventors: Patrik Eder, Rainer Wolfgang Kaiser
  • Publication number: 20230267094
    Abstract: In various examples, a system on a chip is provided that is configured to be operated in a debug mode. The system on a chip includes a plurality of processor cores including a plurality of virtual machines and a further processor core, configured to, in the debug mode, initially execute first debug instructions after the system on a chip has started operating. The first debug instructions are configured to cause the further processor core to make a debug setting that, after the first debug instructions are executed, prevents a processor core executing second debug instructions from accessing at least one of the virtual machines and allows the processor core executing the second debug instructions to access at least one other of the virtual machines.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Inventors: Albrecht Mayer, Patrik Eder, Kajetan Nuernberger
  • Patent number: 11698412
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: July 11, 2023
    Assignee: Intel Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Publication number: 20220082617
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 17, 2022
    Applicant: Intel Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Patent number: 11193973
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: December 7, 2021
    Assignee: Intel Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Publication number: 20210367366
    Abstract: A circuitry is disclosed having one or more circuits and a connector portion coupled that is to the one or more circuits. The connector portion includes a plurality of pins, at least some of the pins having assigned functionality, and wherein at least one first pin is to activate a mechanism to bring the one or more circuits into an electrically safe state. The circuitry is configured, in case the connector portion is coupled with a first connector in a first orientation, to allow the one or more circuits to operate properly via the connector portion. The circuitry is also configured so that in a case where the connector portion is coupled with a second connector in a second orientation different from the first orientation, the at least one first pin of the plurality of pins receives a reference potential that triggers activation of a safety mechanism.
    Type: Application
    Filed: May 25, 2021
    Publication date: November 25, 2021
    Inventors: Albrecht Mayer, Patrik Eder
  • Patent number: 11171856
    Abstract: An apparatus is provided which comprises: a first network interface (NI) to receive data from a source; a second NI coupled to a target; and a circuitry to generate a sequence of source timestamps and a sequence of target timestamps, wherein the first NI is to receive the sequence of source timestamps, and associate a first source timestamp of the sequence of source timestamps with the data, and wherein the second NI is to receive: the data with the first source timestamp from the first NI and the sequence of target timestamps from the circuitry, the second NI to generate a timestamp for the data, based at least in part on the first source timestamp and a first target timestamp of the sequence of target timestamps.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: November 9, 2021
    Assignee: INTEL CORPORATION
    Inventors: Pradeep Kumar, Amit Badole, Arumugam Vijayaraman, Helmut Reinig, Patrik Eder, Vladimir Todorov, Abhiram Anantharamu
  • Patent number: 11138083
    Abstract: Methods and apparatuses relating to a multiple master capable debug interface are described. In one embodiment, an apparatus includes a device circuit, a wireless connector circuit, and a switching circuit coupled between the device circuit and the wireless connector circuit to switch a debug and test mastership from the wireless connector circuit to a debug and test tool, wirelessly connected to the wireless connector circuit, to perform a debug and test operation on the device circuit.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Patrik Eder, Rolf H. Kuehnis, Enrico D. Carrieri
  • Publication number: 20200348360
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 5, 2020
    Applicant: Intel IP Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Patent number: 10795399
    Abstract: One embodiment provides a master device in a bus system. The master device includes bus interface circuitry to exchange commands and data with a slave device in communication with the master device; and test sequence generation logic to generate at least one test sequence, each test sequence having a corresponding unique clock signal having a unique clock frequency; the test sequence generation logic also to transmit the at least one test sequence and the corresponding unique clock signal to the slave device; the test signal generation logic also to determine, based on feedback from the slave device, if the slave device is capable of communicating with the master device using the unique clock frequency.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Patrik Eder, Rolf Kuehnis, Enrico Carrieri
  • Patent number: 10718812
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: July 21, 2020
    Assignee: Intel IP Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Publication number: 20200034260
    Abstract: Methods and apparatuses relating to a multiple master capable debug interface are described. In one embodiment, an apparatus includes a device circuit, a wireless connector circuit, and a switching circuit coupled between the device circuit and the wireless connector circuit to switch a debug and test mastership from the wireless connector circuit to a debug and test tool, wirelessly connected to the wireless connector circuit, to perform a debug and test operation on the device circuit.
    Type: Application
    Filed: October 8, 2019
    Publication date: January 30, 2020
    Inventors: PATRIK EDER, ROLF H. KUEHNIS, ENRICO D. CARRIERI
  • Patent number: 10481990
    Abstract: Methods and apparatuses relating to a multiple master capable debug interface are described. In one embodiment, an apparatus includes a device circuit, a debug and test access port to debug and test the device circuit, and a switching circuit to switch a debug and test mastership between the debug and test access port and a data access port to the device circuit that is not dedicated to debug and test.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: November 19, 2019
    Assignee: Intel Corporation
    Inventors: Patrik Eder, Rolf H. Kuehnis, Enrico D. Carrieri
  • Publication number: 20190219634
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Application
    Filed: August 20, 2018
    Publication date: July 18, 2019
    Applicant: Intel IP Corporation
    Inventors: Rolf H. KUEHNIS, Sankaran M. MENON, Patrik EDER
  • Publication number: 20190080258
    Abstract: Embodiments of the present disclosure may relate to an apparatus with an observation hub that includes a machine-learning model, where the observation hub is to determine a state of an apparatus based at least in part on the machine-learning model and trace data received from one or more trace sources, and alter an operating condition of the apparatus based at least in part on the determined state of the apparatus. Embodiments may also include a multi-buffer trace unit to change one or more of a sort rule, a trigger rule, an enforcement rule, or a filter rule of the multi-buffer trace unit based at least in part on the determined state of the apparatus. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 13, 2017
    Publication date: March 14, 2019
    Inventors: Patrik Eder, Christian Horak, Joseph F. Cramer
  • Publication number: 20190033910
    Abstract: One embodiment provides a master device in a bus system. The master device includes bus interface circuitry to exchange commands and data with a slave device in communication with the master device; and test sequence generation logic to generate at least one test sequence, each test sequence having a corresponding unique clock signal having a unique clock frequency; the test sequence generation logic also to transmit the at least one test sequence and the corresponding unique clock signal to the slave device; the test signal generation logic also to determine, based on feedback from the slave device, if the slave device is capable of communicating with the master device using the unique clock frequency.
    Type: Application
    Filed: December 27, 2017
    Publication date: January 31, 2019
    Applicant: Intel Corporation
    Inventors: PATRIK EDER, ROLF KUEHNIS, ENRICO CARRIERI
  • Publication number: 20190036803
    Abstract: An apparatus is provided which comprises: a first network interface (NI) to receive data from a source; a second NI coupled to a target; and a circuitry to generate a sequence of source timestamps and a sequence of target timestamps, wherein the first NI is to receive the sequence of source timestamps, and associate a first source timestamp of the sequence of source timestamps with the data, and wherein the second NI is to receive: the data with the first source timestamp from the first NI and the sequence of target timestamps from the circuitry, the second NI to generate a timestamp for the data, based at least in part on the first source timestamp and a first target timestamp of the sequence of target timestamps.
    Type: Application
    Filed: December 7, 2017
    Publication date: January 31, 2019
    Applicant: Intel IP Corporation
    Inventors: Pradeep Kumar, Amit Badole, Arumugam Vijayaraman, Helmut Reinig, Patrik Eder, Vladimir Todorov, Abhiram Anantharamu
  • Patent number: 10054636
    Abstract: Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: August 21, 2018
    Assignee: Intel IP Corporation
    Inventors: Rolf H. Kuehnis, Sankaran M. Menon, Patrik Eder
  • Publication number: 20180225063
    Abstract: Techniques and mechanisms to determine a selective buffering of various trace data to different respective buffers. In an embodiment, sort rules indicate trace data attributes that are each to correspond to a different respective buffer. The sort rules are enforced during a runtime session to concurrently sort different items of trace data, based on associated trace data attributes, for storage each to a corresponding buffer. In another embodiment, trigger rules are enforced during the runtime session to selectively debuffer only some trace data based on trigger conditions variously corresponding to different respective trace data types. In still another embodiment, enforcement of sort rules and/or trigger rules is modified during the runtime session to enable dynamic changes to the buffering or debuffering of trace data.
    Type: Application
    Filed: February 8, 2017
    Publication date: August 9, 2018
    Inventors: Amit Kumar Singhvi, Gerhard Hierl, Patrik Eder, Christian Horak