Abstract: A stencil printer includes a frame, a stencil coupled to the frame, and a support assembly coupled to the frame, with the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil. The stencil printer further includes a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil. The stencil printer further includes an end effector configured to pick up and release items from a tooling tray. The stencil printer further includes a movable cart configured to interface with the stencil printer to deliver changeover and/or replacement items within a stencil printer.

Abstract: A stencil printer includes a frame, a stencil coupled to the frame, and a support assembly coupled to the frame, with the support assembly including tooling configured to support the electronic substrate in a print position beneath the stencil. The stencil printer further includes a print head assembly coupled to the frame in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a squeegee blade assembly and at least one paste cartridge to deposit solder paste on the stencil. The stencil printer further includes an end effector configured to pick up and release items from a tooling tray. The stencil printer further includes a movable cart configured to interface with the stencil printer to deliver changeover and/or replacement items within a stencil printer.

Abstract: A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.

Abstract: A system or method of fully automating a changeover and/or a replacement process within a stencil printer includes a stencil printer having at least one item scheduled for replacement within the stencil printer, a stockroom configured to store a plurality of items, and a delivery device. The delivery device is configured to transport an item of the plurality of items to the stencil printer, remove a used item scheduled for replacement, install the item of the plurality of items on the stencil printer, transport the used item to a station configured to inspect and perform one or more functions on the used item to render the used item ready for use, and transport the used item to the stockroom for future use within the stencil printer.

Abstract: A dispensing system includes an optional pre-heat station configured to receive an electronic substrate, a dispense station configured to dispense material on the electronic substrate received from the optional pre-heat station, an optional post-heat station configured to receive the electronic substrate from the dispense station, and a non-contact sensor positioned above the electronic substrate on at least one of the optional pre-heat station, the dispense station, and the optional post-heat station.

Abstract: A print head assembly of a stencil printer includes a print head frame and a wiper blade assembly coupled to the print head frame. The wiper blade assembly includes wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The wiper blades are configured to force solder paste through the apertures of the stencil. The print head assembly further includes a dispensing unit coupled to the print head frame. The dispensing unit is disposed between the wiper blades to deposit solder paste between the wiper blades. The dispensing unit includes a cartridge receiver. The print head assembly further includes a cartridge positioned in the cartridge receiver and a sensor coupled to the print head frame proximate the cartridge. The sensor is configured to measure a temperature of the cartridge.

Abstract: A system for dispensing material on a substrate includes a dispensing unit having a dispensing piston. The dispensing piston is pneumatically driven from a first lower position to a second upper position. The system further includes a solenoid valve coupled to the dispensing unit, with the solenoid valve being configured to control air flow to and from the dispensing piston. The solenoid valve includes a solenoid coil and an amplifier connected to the solenoid coil. The system further includes a controller coupled to the amplifier, with the controller being configured to generate a command signal to the amplifier to control current in the solenoid coil.

Abstract: A stencil printer includes a stencil, a material applicator to apply material on the stencil, and a stencil wiper assembly to selectively wipe the stencil. The stencil wiper assembly includes has a quick-change material module having a supply roller to receive a roll of material, a take-up roller to receive used material, a drive to move the material across the stencil from the supply roller to the take-up roller, and a controllable tension device configured to vary a tension of the material when driving the material from the supply roller to the take-up roller.

Abstract: A system for dispensing material on a substrate includes a dispensing unit having a dispensing piston. The dispensing piston is pneumatically driven from a first lower position to a second upper position. The system further includes a solenoid valve coupled to the dispensing unit, with the solenoid valve being configured to control air flow to and from the dispensing piston. The solenoid valve includes a solenoid coil and an amplifier connected to the solenoid coil. The system further includes a controller coupled to the amplifier, with the controller being configured to generate a command signal to the amplifier to control current in the solenoid coil.

Abstract: A dispenser, configured to dispense material on a substrate, includes a dispensing unit having a housing with a chamber, a piston disposed in the chamber and axially movable within the chamber, and a nozzle coupled to the housing. The nozzle has an orifice co-axial with the chamber of the housing. The dispenser further includes an actuator coupled to the dispensing unit and configured to drive the up- and down movement of the piston, and a compliant assembly coupled to the actuator and the piston. The compliant assembly is configured to permit limited relative travel between the actuator and the piston. A method of dispensing is further disclosed.

Abstract: A dispenser includes a frame, a substrate support assembly, and a gantry system to move a dispensing pump in x-axis, y-axis, and z-axis directions. The dispensing pump includes a local supply reservoir, a dispensing nozzle, a first line to provide fluid communication between the local supply reservoir and the dispensing nozzle. The dispenser further includes a remote bulk feed system coupled to the local supply reservoir of the dispensing pump. The bulk feed system includes a first remote supply container configured to contain viscous material, a second line to provide fluid communication between the remote bulk feed system and the local supply reservoir, and a first valve disposed in the second line and operable to deliver viscous material to and to cut off viscous material from the remote supply container.

Abstract: A dispenser, configured to dispense material on a substrate, includes a dispensing unit having a housing with a chamber, a piston disposed in the chamber and axially movable within the chamber, and a nozzle coupled to the housing. The nozzle has an orifice co-axial with the chamber of the housing. The dispenser further includes an actuator coupled to the dispensing unit and configured to drive the up- and down movement of the piston, and a compliant assembly coupled to the actuator and the piston. The compliant assembly is configured to permit limited relative travel between the actuator and the piston. A method of dispensing is further disclosed.

Abstract: A dispenser, configured to dispense material on a substrate, includes a dispensing unit having a housing with a chamber, a piston disposed in the chamber and axially movable within the chamber, and a nozzle coupled to the housing. The nozzle has an orifice co-axial with the chamber of the housing. The dispenser further includes an actuator coupled to the dispensing unit and configured to drive the up- and down movement of the piston, and a compliant assembly coupled to the actuator and the piston. The compliant assembly is configured to permit limited relative travel between the actuator and the piston. A method of dispensing is further disclosed.

Abstract: A dispenser, configured to dispense material on a substrate, includes a dispensing unit having a housing with a chamber, a piston disposed in the chamber and axially movable within the chamber, and a nozzle coupled to the housing. The nozzle has an orifice co-axial with the chamber of the housing. The dispenser further includes an actuator coupled to the dispensing unit and configured to drive the up- and down movement of the piston, and a compliant assembly coupled to the actuator and the piston. The compliant assembly is configured to permit limited relative travel between the actuator and the piston. A method of dispensing is further disclosed.

Abstract: A material deposition system for depositing materials on an electronic substrate with a material deposition system is disclosed. The deposition system includes a frame, a gantry system coupled to the frame, a deposition head coupled to the gantry system and configured to deposit dots of low viscous and semi-viscous material on the electronic substrate, and a controller configured to control the operation of the material deposition system, including the operation of the gantry system and the deposition head. The system is capable of depositing a line or a pattern of material on the electronic substrate by moving the deposition head along an axis of motion that is substantially non-parallel to a direction of the line or pattern. Other deposition systems and methods are further disclosed.

Abstract: A method of depositing materials on an electronic substrate with a material deposition system is disclosed. The deposition system includes a frame, a gantry system coupled to the frame, a deposition head coupled to the gantry system and configured to deposit dots of low viscous and semi-viscous material on the electronic substrate, and a controller configured to control the operation of the material deposition system, including the operation of the gantry system and the deposition head. The method includes depositing a line or a pattern of material on the electronic substrate by moving the deposition head along an axis of motion that is substantially non-parallel to a direction of the line or pattern. Other methods and deposition systems are further disclosed.