Patents by Inventor Pau Martin Vidal

Pau Martin Vidal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11872763
    Abstract: In one example, an apparatus for supplying material to an additive manufacturing platform comprises a rotatable delivery module comprising a vane; and a plurality of distribution elements. In use, the rotatable delivery module is controllable to rotate the vane to a supply position to enable material to be supplied to an additive manufacturing platform from the vane. The vane and the plurality of distribution elements are arranged such that during the rotation: the vane provides a dose amount of material from a material supply module for supply to an additive manufacturing platform and at least one of the plurality of distribution elements distributes material within the material supply module so that the vane supplies a substantially uniform dose of material along the length of the vane to the additive manufacturing platform.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: January 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Pau Martin Vidal, Fernando Juan Jover, Gerard Mosquera Donate
  • Patent number: 11707890
    Abstract: In example implementations, an apparatus includes a storage unit, an auger screw, a housing enclosing the auger screw and at least one heater coupled to the housing. The auger screw receives a build material from the storage unit and delivers the build material to a build platform via movement of the auger screw. The build material is heated by the at least one heater as the build material is being moved by the auger screw.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: July 25, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Cristian Ferris, Elena Laso Plaza, Esteve Comas, Pau Martin Vidal, Gerard Mosquera, Anna Torrent, Adrien Chiron
  • Patent number: 11642847
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: May 9, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Patent number: 11613081
    Abstract: A material management apparatus for an additive manufacturing system comprises a build material supply system to supply build material to a building area for building an object by additive manufacturing. The build material supply system includes a first build material supply unit to supply build material from a first side of a building area and a second build material supply unit to supply build material from a second side of the building area, the second side opposing the first side. The material management apparatus also includes a controller to control the build material supply system to vary an amount of build material to be supplied via the first build material supply unit based on a detected difference between a first amount of material available for supply via the first build material supply unit and a second amount of material available for supply via the second build material supply unit.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: March 28, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gabriel De La Cal, Pablo Dominguez Pastor, Pau Martin Vidal, Anna Torrent, Albert Mora Murciano
  • Publication number: 20220371278
    Abstract: A 3D printing apparatus is disclosed herein. The 3D printing apparatus comprises a build compartment defining a build chamber within which a 3D object is to be generated; and a non-powered platform, moveable within the build chamber, comprising a platform drive interface to engage with an external drive mechanism to cause the platform to move. The 3D printing apparatus further comprises a powder compartment located laterally adjacent to the build compartment, within which build material is to be stored for use in the generation of the 3D object. The 3D printing apparatus also comprises a locking interface to couple the 3D printing apparatus with an external hosting device.
    Type: Application
    Filed: January 30, 2020
    Publication date: November 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Pau MARTIN VIDAL, Marius VALLES GONZALEZ, Gerard MOSQUERA DONATE, Albert RODRIGUEZ FERNANDEZ, Gabriel DE LA CAL MENDOZA, Francesc MELIA SUNE
  • Patent number: 11485074
    Abstract: According to one example there is provided an apparatus for supplying build material to a three-dimensional printing system. The apparatus comprises a rotatable vane.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: November 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jose Manuel Grases, Pau Martin Vidal, Fernando Juan, Pablo Dominguez Pastor, Gerard Mosquera
  • Publication number: 20220176629
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Application
    Filed: February 25, 2022
    Publication date: June 9, 2022
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Patent number: 11325312
    Abstract: There is disclosed a build material supply unit, comprising: a supply chamber body enclosing a supply volume to contain a build material for additive manufacture; an electromagnetic distance sensor to determine a length parameter relating to a length of a beam pathway extending from an emitter of the sensor to a surface level of build material in the supply volume; and a reflector to reflect the beam pathway between the emitter and the surface level of build material; wherein the reflector is spaced apart from the emitter.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: May 10, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Miguel Angel Lopez, Pau Martin Vidal, Carlos Perez, Anna Torrent, Guillermo Garcia Marcos, Marius Valles, Albert Mora Murciano
  • Publication number: 20220111594
    Abstract: In example implementations, an apparatus includes a storage unit, an auger screw, a housing enclosing the auger screw and at least one heater coupled to the housing. The auger screw receives a build material from the storage unit and delivers the build material to a build platform via movement of the auger screw. The build material is heated by the at least one heater as the build material is being moved by the auger screw.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Inventors: Cristian Ferris, Elena Laso Plaza, Esteve Comas, Pau Martin Vidal, Gerard Mosquera, Anna Torrent, Adrien Chiron
  • Patent number: 11285668
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: March 29, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Patent number: 11260591
    Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: March 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles
  • Patent number: 11235527
    Abstract: In example implementations, an apparatus includes a storage unit, an auger screw, a housing enclosing the auger screw and at least one heater coupled to the housing. The augers screw receives a build material from the storage unit and delivers the build material to a build platform via movement of the auger screw. The build material is heated by the at least one heater as the build material is being moved by the auger screw.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: February 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Cristian Ferris, Elena Laso Plaza, Esteve Comas, Pau Martin Vidal, Gerard Mosquera, Anna Torrent, Adrien Chiron
  • Publication number: 20210362414
    Abstract: In one example, a rotatable delivery module is controlled to rotate in a first direction to a supply position to enable material to be supplied to an additive manufacturing platform. During such rotation to the supply position the rotatable delivery module contacts and collects respective portions of said material contained by the material supply module. An amount of material within the material supply module is determined based on a resistive force exerted on the rotatable delivery module as the rotatable delivery module collects said respective portions of material.
    Type: Application
    Filed: August 7, 2018
    Publication date: November 25, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Luis Vega Lastra, Pau Martin Vidal, Joan Mach Beneyto, Gerard Mosquera Donate
  • Publication number: 20210354386
    Abstract: Mechanisms to spread build material on a print bed are disclosed. In example apparatuses a conveyor, having an endless belt, is used. A build material reservoir deposits build material on the endless belt, in a build material receiving area of the conveyor. A build material preheater is used to preheat build material transported by the endless belt in a build material preheating area of the conveyor. The preheated build material is then deposited on the print bed.
    Type: Application
    Filed: April 27, 2018
    Publication date: November 18, 2021
    Inventors: Pablo Antonio Murciego Rodriguez, Pau Martin Vidal, Esteve Comas Cespedes
  • Publication number: 20210354385
    Abstract: In one example, an apparatus for supplying material to an additive manufacturing platform comprises a rotatable delivery module comprising a vane; and a plurality of distribution elements. In use, the rotatable delivery module is controllable to rotate the vane to a supply position to enable material to be supplied to an additive manufacturing platform from the vane. The vane and the plurality of distribution elements are arranged such that during the rotation: the vane provides a dose amount of material from a material supply module for supply to an additive manufacturing platform and at least one of the plurality of distribution elements distributes material within the material supply module so that the vane supplies a substantially uniform dose of material along the length of the vane to the additive manufacturing platform.
    Type: Application
    Filed: July 12, 2018
    Publication date: November 18, 2021
    Inventors: Pau Martin Vidal, Fernando Juan Jover, Gerard Mosquera Donate
  • Patent number: 11167492
    Abstract: A build platform (100, 200, 300) for a printing station is described comprising a trolley (105, 205, 305, 405) and a print bucket (110, 210, 310, 410). The print bucket may be mounted on the trolley and may comprise coupling elements (115A, 115B, 215A, 215B, 315A, 315B, 415A, 415B), respectively engageable to receiving elements (120A, 120B, 220A, 220B, 320A, 320B, 420A, 420B) of the printing station (150, 250, 350, 450). The coupling elements may cause the print bucket to at least partially disengage from the trolley when the coupling elements engage with the receiving elements of the printing station.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: November 9, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Pol Morral, Fernando Juan, Pau Martin Vidal
  • Publication number: 20210291454
    Abstract: A material management apparatus for an additive manufacturing system comprises a build material supply system to supply build material to a building area for building an object by additive manufacturing. The build material supply system includes a first build material supply unit to supply build material from a first side of a building area and a second build material supply unit to supply build material from a second side of the building area, the second side opposing the first side. The material management apparatus also includes a controller to control the build material supply system to vary an amount of build material to be supplied via the first build material supply unit based on a detected difference between a first amount of material available for supply via the first build material supply unit and a second amount of material available for supply via the second build material supply unit.
    Type: Application
    Filed: September 29, 2016
    Publication date: September 23, 2021
    Inventors: Gabriel DE LA CAL, Pablo DOMINGUEZ PASTOR, Pau MARTIN VIDAL, Anna TORRENT, Albert MORA MURCIANO
  • Patent number: 11072027
    Abstract: A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: July 27, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Fernando Juan, Pau Martin Vidal, Esteve Comas, Jordi Gimenez Manent, Pol Morral, Pablo Dominguez Pastor
  • Publication number: 20200290274
    Abstract: In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
    Type: Application
    Filed: May 12, 2016
    Publication date: September 17, 2020
    Inventors: Marius Valles, Pau Martin Vidal, Rafel Texido, Joan Mach
  • Publication number: 20200147885
    Abstract: According to one example there is provided a method of delivering build material from a build material store to a supply module. The method comprises moving, using a rotatable vane, a portion of build material from the supply module to the top of the supply module, and spreading the moved portion of build material across the support platform.
    Type: Application
    Filed: January 14, 2020
    Publication date: May 14, 2020
    Inventors: Jordi Gimenez Manent, Jose Manuel Grases, Francisco Jaime, Fernando Juan, Pau Martin Vidal, Marius Valles