Patents by Inventor Paul A. Guillotte

Paul A. Guillotte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor die and mounting assembly
    Patent number: 5012322
    Abstract: A uniformly thick dielectric polyimide coating is provided on the back face of an integrated circuit and the die is mounted to a copper lead frame finger by interposing an epoxy resin bonding agent between the uniformly thick polyimide coating and the copper support finger. The die coating is provided before separating die from the precursive water. Liquid polyimide is poured onto the back side of the water which is spun, in a manner similar to that usually used for obtaining uniformly thick photoresist films. After curing the polyimide, the die are cut from the wafer by sawing.
    Type: Grant
    Filed: May 18, 1987
    Date of Patent: April 30, 1991
    Assignee: Allegro Microsystems, Inc.
    Inventors: Paul A. Guillotte, Paul Panaccione, Thomas J. Martiska, Jay J. Gagnon