Abstract: According to one embodiment of the present invention an amplification module comprises a housing containing a plurality of optical ports. This housing: (i) at least partially encloses at least one amplification medium, (ii) provides at least one position for at least one optical filter, and (iii) includes a first optical port configured to provide both signal and pump light to the amplification module. According to an embodiment of the present invention the amplification module does not include a WDM for multiplexing pump light and signal light.

Abstract: An apparatus and method for making n different types of optical amplifiers on one manufacturing line, n being equal to 2 or more. The method includes providing a supply of at least four functional groups of subunits for each of the circuits which comprise each of the optical amplifiers to be made, where at least one functional group contains at least n different types of sub-units, and where each of the sub-units in three of the functional groups includes a pluggable optical connector half and where each of the sub-units of the fourth of the functional groups includes three pluggable optical connector halves. The method further includes selecting a specific sub-unit from each of the four functional groups and plugging together each of the selected subunits to form an optical amplifier having the desired specification.

Abstract: According to the present invention modular optical amplifier assembly, comprises at least one first module and at least one second module. The first and second modules are optically connected to one another. The first module is an Optical Power Supply module. The first module comprises an optical circuit including: (i) at least two optical ports, (ii) at least a one light source having a first wavelength known to cause amplification in rare earth doped optical fiber located between the optical ports; (iii) at least one bidirectional light combiner/separator optically coupled to the light source, and (iv) at least one position for a directional optical attenuator, located between the two optical ports. The second module is an amplification module. The second module comprises an optical circuit including (i) at least two optical ports, and (ii) at least one amplification medium.

Abstract: According to one embodiment of the present invention an amplification module comprises a housing containing a plurality of optical ports. This housing: (i) at least partially encloses at least one amplification medium, (ii) provides at least one position for at least one optical filter, and (iii) includes a first optical port configured to provide both signal and pump light to the amplification module. According to an embodiment of the present invention the amplification module does not include a WDM for multiplexing pump light and signal light.

Abstract: An optical amplifier including a gain fiber, first and second sources of pump light for providing pump light through the gain fiber, first and second optical couplers coupling the first and second sources of pump light to different points along the gain fiber, and a cut-off filter coupled to one or the other of the first and second optical connections for preventing pump light generated by one of the sources from reflecting off the second of the sources and reentering the first source. The gain fiber also includes dopant atoms such as erbium. The cut-off filter is preferably one of a wavelength division multiplexer and an optical isolator.

Abstract: The variables and parameters previously understood to affect the gain spectrum of an optical amplifier 13 were: (1) the wavelengths to be amplified; (2) the input power levels at those wavelengths; (3) the characteristics of the amplifying medium 20; (4) the insertion loss spectra of the amplifier's components, including any filter(s) used for gain flattening; (5) the pump band chosen to pump the amplifying medium 20; and (6) the total amount of pump power supplied in the chosen pump band. An additional fundamental variable has been identified which can be used to control the gain spectrum of an optical amplifier 13, namely, the center wavelength of the spectrum of the pump's output power within the chosen pump band. Methods and apparatus for using this variable for this purpose are disclosed.For example a, transmission system is disclosed having a transmitter 11 and a receiver 10 connected by an optical fiber 12.

Abstract: A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas. The package also includes a getter for organic impurities, e.g., a getter composed of a porous silica or a zeolite. The hydrogen content of the materials used to form the package are reduced by baking at an elevated temperature for an extended period of time, e.g., at 150.degree. C. for 200 hours.

Abstract: Apparatus for packaging a fiber optic device along with electronic and opto-electronic components upon a printed circuit board. Bend members having arcuate shaped guide surfaces for directing fibers between various components are strategically mounted upon the top surface of the board. Passive fiber optic components are also mounted upon support means between bend members so that the fibers entering and exiting the passive component run tangent to the bend radius of the bend members. The radius of curvature of the bend members is within the bend tolerance of the fibers used in the device. The bend members and support members are formed of a material having a thermal coefficient of expansion that is about equal to that of the board material whereby thermally induced stresses on the board mounted components are minimized.

Abstract: A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas. The package also includes a getter for organic impurities, e.g., a getter composed of a porous silica or a zeolite. The hydrogen content of the materials used to form the package are reduced by baking at an elevated temperature for an extended period of time, e.g., at 150.degree. C. for 200 hours.

Abstract: A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas. The package also includes a getter for organic impurities, e.g., a getter composed of a porous silica or a zeolite. The hydrogen content of the materials used to form the package are reduced by baking at an elevated temperature for an extended period of time, e.g., at 150.degree. C. for 200 hours.

Abstract: A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas.

Abstract: Apparatus for packaging a fiber optic device along with electronic and opto-electronic components upon a printed circuit board. Bend members having arcuate shaped guide surfaces for directing fibers between various components are strategically mounted upon the top surface of the board. Passive fiber optic components are also mounted upon support means between bend members so that the fibers entering and exiting the passive component run tangent to the bend radius of the bend members. The radius of curvature of the bend members is within the bend tolerance of the fibers used in the device. The bend members and support members are formed of a material having a thermal coefficient of expansion that is about equal to that of the board material whereby thermally induced stresses on the board mounted components are minimized.