Abstract: A thermochromic indicator is vertically disposed on a rack. Such that the thermochromic indicator is visible from a distance. In some examples, the thermochromic indicator indicates a bulk air temperature and a gradient air temperature. The thermochromic indicator provides a real-time visual of air temperatures of computing equipment and devices housed within a computing facility. The thermochromic indicator may be vertically disposed on a front-face and/or a back-face or a rack. A plurality of thermochromic indicators may be disposed on a plurality of front-faces and/or back-faces of racks of an array of racks.

Abstract: A low-resistance telecommunications power distribution panel provides a lower electrical resistance than traditional telecommunications power distribution panels, where the lower electrical resistance provides a reduced amount of waste heat. The low-resistance telecommunications power distribution panel may comprise a single unitary metal busbar configured to directly interconnect a power input cable to a plurality of fuse holders. A plurality of single unitary metal strips may directly connect to each fuse holder, each single unitary metal strip configured to directly connect to a power output lead. A single unitary metal return busbar may directly connect a return input to a plurality of return outputs.

Abstract: A high-density telecommunications patch/splitter system to allow a user to access multiple adapters disposed on even high-density splitter modules and odd high-density splitter modules. The even high-density splitter modules have an even adapter array and the odd high-density splitter modules have an odd adapter array that, when installed in the chassis, allow a user access to the adapters.

Abstract: The present invention uses multiple global cooling chambers for providing liquid cooling to a plurality of electronic components. The global cooling chambers utilize a non-electrically conductive fluid which is in direct contact with the components to be cooled. The system provides very effective heat transfer rates, environmental isolation of the electronics components and can be deployed in a wide range of applications. Multiple global cooling chambers allows for the hot swapping of cards during operation of the system. Valves provide the ability to minimize the amount of interaction between the cooling fluid and air outside the chambers.

Abstract: An exterior housing, which can be mounted directly to a real estate sign, provides an interior cavity for the storage of a supply of real estate brochures. A hand actuated wheel allows users to remove a single brochure from the holder by means of a shaft and rollers. The supply of brochures maintains contact with the rollers by means of a spring assembly. Dispensed brochures are pushed upwards and out a dispensing slot which is sized sufficiently to reduce the ability of bugs entering the cavity. The dispensing slot also keeps the elements from entering into the interior cavity and from ruining the supply brochures. The front of the housing contains a window which allows the realtor to always maintain one sheet visible to customers even when the supply of flyers is empty.

Abstract: A hybrid thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The hybrid thermal management system includes a chassis having a global spray chamber, a hybrid chamber, a first opening within a rear portion of the chassis extending into the global spray chamber, a second opening within the rear portion of the chassis extending into the hybrid chamber, and a backplane secured and sealed to the rear portion of the chassis. A dry chamber may be attached to the chassis for air cooling electrical components. The cards within the global spray chamber are typically high heat flux components with increased cooling requirements and the cards in the hybrid chamber are comprised of dry/air cooling and zone cooling components.

Abstract: A dual sided board thermal management system for efficiently thermally managing a printed circuit board having electronic components on opposing sides thereof. The dual sided board thermal management system generally includes a housing surrounding a portion of a printed circuit board, and a plurality of coolant dispensing units within the housing directed towards opposite sides of the printed circuit board to thermally manage electronic components on opposite sides of the printed circuit board.

Abstract: A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the chassis extending into the spray chamber, a second opening within the rear portion of the chassis extending into the dry chamber, and a main backplane secured and sealed to the rear portion of the chassis. Electronic cards may be electrically coupled within sockets of the main backplane within both the dry chamber and the spray chamber. The cards within the spray chamber are typically high heat flux components with increased cooling requirements and the cards within the dry chamber are typically low heat flux components with reduced cooling requirements. A spray cool system is within the spray chamber and a dry cool system is within the dry chamber.

Abstract: The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled through evaporation. The resulting liquid and vapor mixture exits the spray modules via return branches. Each individual return branch feeds into a return manifold wherein the manifold is sized sufficiently for the separation of liquid and vapor under the influences of gravity. In addition, a heat exchanger is located within the return manifold and provides for the condensation of vapor. The heat exchanger may also provide liquid subcooling.

Abstract: An atomizer for thermal management system for efficiently thermally managing one or more heat producing devices. The atomizer for thermal management system includes a housing having a coolant passage and a dispensing end, an orifice within the dispensing end, and an actuator manipulating a plunger within the housing. The plunger includes a head that is sealable within a recessed portion of the orifice to open or close the orifice. The coolant passes through the coolant passage into the orifice for spraying upon a heat producing device. The actuator may reciprocate so that the coolant spray emitted through the orifice is pulsating. The pulsing frequency may be increased to increase cooling or decreased to decrease cooling of the heat producing device.

Abstract: A microchannel thermal management system for thermally managing a heat producing device. The microchannel thermal management system includes a housing having an interior surface, a cap having a plurality of microchannels attached to the interior surface of the housing, and an inlet port and an outlet port extending through the housing in fluid communication with the microchannels. Alternatively, the microchannels may also extend into the interior surface of the housing. The cap is preferably thermally attached to a heat producing device by a thermal interface layer. Thermally managed coolant enters the inlet port passing through the microchannels conducting heat transferred to the cap by the heat producing device and exits through the outlet port.

Abstract: A two-phase liquid cooling system includes an active venting system for regulating an amount of non-condensable gas within the cooling system. Various venting structures may be used to remove gases from the cooling system, some of which are designed to remove the non-condensable gases and avoid removing the vapor-phase coolant. A control system activates the venting system to achieve a desired pressure, which may be based on measured process conditions within the cooling system. A venting and refilling system may serve multiple cooling systems in a parallel arrangement. A return path of the cooling system can be tested for coolant leaks by increasing the pressure in the return path and placing a coolant detector near the path.

Abstract: A spray cool system with a dry access chamber for providing convenient access to specific spray system components in a dry chamber separate from the wet chamber. The spray cool system with a dry access chamber includes a chassis having a dry chamber and a wet chamber. A dry access door and a wet access door are removably attached about the dry chamber and the wet chamber respectively for providing access to the same. Spray cool components such as a card cage and a spray unit are positioned within the wet chamber. Spray cool components such as but not limited to filters, pumps, heaters, sensors, separators and the like are positioned within the dry chamber for efficient dry access.

Abstract: The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.

Abstract: A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the chassis extending into the spray chamber, a second opening within the rear portion of the chassis extending into the dry chamber, and a main backplane secured and sealed to the rear portion of the chassis. Electronic cards may be electrically coupled within sockets of the main backplane within both the dry chamber and the spray chamber. The cards within the spray chamber are typically high heat flux components with increased cooling requirements and the cards within the dry chamber are typically low heat flux components with reduced cooling requirements. A spray cool system is within the spray chamber and a dry cool system is within the dry chamber.

Abstract: A spray coolant reservoir system for increasing the efficiency and performance of a spray thermal management system. The spray coolant reservoir system includes a reservoir capable of storing a volume of coolant, a chassis with a spray chamber, a pump unit, an intake valve fluidly connected to the pump unit for providing coolant from the reservoir or the spray chamber, an output valve fluidly connected to the pump unit for controlling coolant flow from the pump unit to either the spray unit or the reservoir. The reservoir preferably includes a vent port, a fill port, and a chamber port. The chamber port is fluidly connected to the spray chamber for allowing control of the internal pressure within the spray chamber.

Abstract: A liquid thermal management socket system for thermally managing an electronic device in a socket. The liquid thermal management socket system includes a thermal management unit having a chamber for receiving one or more electronic devices, a plurality of first connectors within the thermal management unit for electrically coupling with the electronic device, and a plurality of second connectors electrically coupled to the first connectors, wherein the second connectors extend from the thermal management unit for electrically coupling within a socket unit on a board. The thermal management unit may have a cap member attachable to a base portion in a sealed manner. The chamber within the thermal management unit may thermally manage an electronic device within via spray cooling, liquid immersion or other liquid cooling method.

Abstract: The present invention is directed to fuel dispensing nozzles and more particularity to a spout of a fuel dispensing nozzle that reduces the amount of harmful emissions created during a fueling cycle. The spout of the nozzle has an inside surface that is in direct contact with a flow of fuel. After the flow of fuel is stopped, the residual amount of fuel adhered to the inside spout surface is encouraged to collect and drip from at least one fuel collection channel. The at least one fuel channel results in less fuel dripping on the ground and less residual fuel, both of which harmfully evaporate into the air.

Abstract: A fuel dispensing nozzle having a valve for controlling the flow of fuel to a spout attached to the nozzle. The nozzle spout includes three or more spaced apart protrusions that extend from an outer surface of the spout. If the outer spout surface is made from a non-electrically conductive material, the plurality of protrusions may be made from a electrically conductive material, and thus, provide electrical grounding to the nozzle. If the outer spout surface is made from a material having less than ideal wear properties, the plurality of protrusions may be used to provide wear protection to the outer surface.

Abstract: A tubular spout is fluidly connected to a nozzle body. The nozzle body having a main valve for regulating the flow of a supply of fuel to the spout. Within the tubular spout is a dripless valve that moves to an open position allowing for the flow of fuel out the spout and to a closed position shutting off the flow of fuel out of the spout. According to the present invention at least a portion of the dripless valve surface has a surface energy less than the surface tension of the fuel being dispensed.