Abstract: A controller communicates with a plurality of multi-chip memory packages. Each multi-chip memory package comprises a plurality of memory dies, each having a respective plurality of memory blocks, some of which are good and some of which are bad. The controller determines a number of good blocks in each memory die. Based on the determined number of good blocks in each memory die, the controller selects a memory die from each of the multi-chip memory packages to access in parallel, wherein the selected memory dies are not necessarily all in the same relative position in each multi-chip package. The controller then creates a metablock from a set of good blocks from each of the selected memory dies, wherein a maximum number of metablocks that can be created across the selected memory dies is determined by a lowest number of good blocks in the selected memory dies.

Abstract: The embodiments described herein provide a controller with an extended status register and a method of use therewith. In one embodiment, a controller is provided with a first interface through which to communicate with a host and a second interface through which to communicate with a plurality of flash memory devices. The controller also comprises a status register, an extended status register, and a processor. The processor is operative to store, in the extended status register, status information of a plurality of events in time across the plurality of flash memory devices. The extended status register stores event status information, whereas the ONFI status register stores command status information. In response to a request from the host, the processor sends the status information of the plurality of events to the host for analysis.

Abstract: Disclosed are apparatus and techniques for managing power in a memory system having a controller and nonvolatile memory array. In one embodiment, prior to execution of each command with respect to the memory array, a request for execution of such command is received with respect to the memory array. In response to receipt of each request for each command, execution of such command is allowed or withheld with respect to the memory array based on whether such command, together with execution of other commands, is estimated to exceed a predetermined power usage specification for the memory system.

Abstract: The embodiments described herein provide a controller, storage device, and method for power throttling memory operations. In one embodiment, a controller is provided in a storage device with a plurality of flash memory devices. The controller determines how much power will be consumed (or heat will be generated) by each of a plurality of commands and dynamically alters when each of the commands operating on one or more of the flash memory devices is performed based on the determination of how much power would be consumed (or heat will be generated), so that performance of the plurality of commands does not exceed a predetermined average power limit over a period of time (or a predetermined temperature). In some embodiments, the storage device also has a thermal sensor, and a reading from the thermal sensor can be used, instead of or in addition to the power or thermal costs of each command, to dynamically alter when the commands are performed.

Abstract: The embodiments described herein provide a controller and method for performing a background commands or operations. In one embodiment, a controller is provided with interfaces through which to communicate with a host and a plurality of flash memory devices. The controller contains a processor operative to perform a foreground command received from the host, wherein the processor performs the foreground command to completion without interruption. The processor is also operative to perform a background commands or operations stored in the controller's memory, wherein the processor performs the background command until completed or preempted by a foreground command. If the background command is preempted, the processor can resume performing the background command at a later time until completed.

Abstract: Methods and systems for forming a variety of integrated circuits, having quite different interfaces and packages, from a single manufactured die. Preferably the die has bond pads for at least a first mode of operation positioned along only two of its four sides, and these bond pads are sufficient to construct a multi-chip module in which the die is functional in the first mode of operation. Many of the pads on these two sides are duplicated on third and/or fourth sides, except that power management circuitry prevents wasteful capacitive current onto whichever of the duplicated pads is not connected out. Optionally the third and/or fourth sides can be used for connections needed for a mode which is not available with two sides only.

Abstract: A multi-interface integrated circuit in which, during the chip's lifetime in use, only one interface is active at a time. However, special test logic powers up all of the on-chip interface modules at once, so that a complete test cycle can be performed. All of the interfaces are exercised in one test program. Since some pads are inactive in some interface modes, mask bits are used to select which pads are monitored during which test cycles.

Abstract: A multi-interface integrated circuit in which, during the chip's lifetime in use, only one interface is active at a time. However, special test logic powers up all of the on-chip interface modules at once, so that a complete test cycle can be performed. All of the interfaces are exercised in one test program. Since some pads are inactive in some interface modes, mask bits are used to select which pads are monitored during which test cycles.