Abstract: A cleaning apparatus (20, 200) that includes a conductive path (84, 208, 212) from an article (24, 216) being cleaned to a ground (88, 220). The conductive path allows a static electrical charge present on the article to be drawn off the article so as to reduce the likelihood the article will be damaged by the static electrical charge. In one embodiment, the electrical path includes an electrically conductive brush (36). In another embodiment, the electrical path includes at least one contact (224, 228) spaced from a cleaning member.

Abstract: Disclosed in a cleaning apparatus (e.g., clean station) used during the production of semiconductor wafers. The clean station includes a holder for holding and rotating a semiconductor wafer, a shield surrounding the semiconductor wafer, and a dispenser positioned to dispense a cleaning fluid on the semiconductor wafer. The surface of the shield facing the semiconductor wafer comprises a semi-permeable material. The semi-permeable material prevents cleaning fluid ejected from the surface of the rotating semiconductor wafer from forming into a mist and being re-deposited back on the semiconductor wafer. The mist is harmful because it contains foreign material particles. The semi-permeable material comprises an absorptive material, a screen material, a perforated material, a finned material, etc. and is de-signed such that cleaning fluid ejected from the surface of the rotating semiconductor wafer is collected by and/or drains down the semi-permeable material.

Abstract: A system and method implemented by the system controls a process acting on a moving object by providing a plurality of “stop-action” reference images of a feature of a reference object. The plurality of reference images represent a range of periodic process results relating to the feature at various process sample times. While the process is acting on the moving object, a first image of a feature of the moving object at a first sample time is obtained, and the first image is compared to one or more of the plurality of reference images, which may represent various nominal and out of tolerance process conditions. From this comparison, the necessity for making a process adjustment of one or more process parameters of the process acting on the moving object is determined, and process control may be essentially effected in real time.

Abstract: A semiconductor wafer chemical mechanical treatment apparatus having a sectional extended arm carrying a head. The sectional arm is comprised of a fixed yoke and an elongated arm positioned in said yoke on a pivot. The elongated arm carries a first means thereon for establishing and maintaining a given loading or pressure on the head. A second means, is positioned on the yoke, adjacent to the elongated arm for temporarily altering the given loading or pressure on the head established by the first means without disturbing the setting of the first means such that when the second means is reset the given head load or pressure established by said first means is automatically restored.

Abstract: An apparatus and method of planarizing objects, particularly electronic components. The off-concentric polishing system of the present invention comprises at least two polishing platens positioned adjacent each other such that the polishing portions of the platens are substantially co-planar. At least one wafer carrier is moveably mounted over the at least two platens such that a wafer may be polished by more than one platen substantially simultaneously. The platen configurations may be in a linear or non-linear configuration such that the wafer being polished is no longer centrally disposed over a single platen but is off-concentrically positioned over multiple platens. The off-concentric positioning of the wafer provides enhanced slurry distribution and endpoint detection. The present invention reduces time and cost in manufacturing electronic components by engaging several polishing conditions simultaneously without the need for sequential polishing.

Abstract: An apparatus and method of planarizing objects, particularly electronic components. The off-concentric polishing system of the present invention comprises at least two polishing platens positioned adjacent each other such that the polishing portions of the platens are substantially co-planar. At least one wafer carrier is moveably mounted over the at least two platens such that a wafer may be polished by more than one platen substantially simultaneously. The platen configurations may be in a linear or non-linear configuration such that the wafer being polished is no longer centrally disposed over a single platen but is off-concentrically positioned over multiple platens. The off-concentric positioning of the wafer provides enhanced slurry distribution and endpoint detection. The present invention reduces time and cost in manufacturing electronic components by engaging several polishing conditions simultaneously without the need for sequential polishing.

Abstract: A semiconductor wafer chemical mechanical treatment apparatus having a sectional extended arm carrying a head. The sectional arm is comprised of a fixed yoke and an elongated arm positioned in said yoke on a pivot. The elongated arm carries a first means thereon for establishing and maintaining a given loading or pressure on the head. A second means, is positioned on the yoke, adjacent to the elongated arm for temporarily altering the given loading or pressure on the head established by the first means without disturbing the setting of the first means such that when the second means is reset the given head load or pressure established by said first means is automatically restored.

Abstract: A method and apparatus for chemical mechanical polishing a semiconductor wafer by providing a novel high pressure mixture of gas and liquid in a pulsation mode for eliminating residual slurry, by-products, and slurry abrasive particles on or in the polishing pad.

Abstract: A method and apparatus for chemical mechanical polishing a semiconductor wafer by providing a novel high pressure mixture of gas and liquid in a pulsation mode for eliminating residual slurry, by-products, and slurry abrasive particles on or in the polishing pad.

Abstract: Semiconductor materials are prepared by CMP with a first rough polishing step using an acidic slurry followed by cleaning a the pad and wafer separately. After cleaning a second polishing step with a basic slurry is used which buffs the wafer. Finally the pad and wafer are rinsed while a low pressure is applied to complete the process.

Abstract: A carrier rinse unit comprising a plurality of nozzles prepositioned to eject a cleaning fluid against a surface of a wafer while the wafer is rotated within a wafer carrier. The prepositioned nozzles may be angled to spray a leading edge, a trailing edge, an outer edge of the wafer, or any desired point on the surface of the wafer.

Abstract: A carrier rinse unit comprising a plurality of nozzles prepositioned to eject a cleaning fluid against a surface of a wafer while the wafer is rotated within a wafer carrier. The prepositioned nozzles may be angled to spray a leading edge, a trailing edge, an outer edge of the wafer, or any desired point on the surface of the wafer.

Abstract: An apparatus for polishing a semiconductor wafer is provided comprising a wafer carrier to provide a force against a wafer and a rotating polishing pad during the polishing operation and a polishing slurry dispenser device disposed to dispense the slurry toward the pad preferably as a stream or more preferably drops toward the pad surface and a curtain of air to intersect the slurry at or near the polishing pad surface. The wafer is polished using less slurry than a conventional polishing apparatus while still maintaining the polishing rates and polishing uniformity of the prior art polishing apparatus. A preferred dispenser is an elongated housing having a slurry tube and air tube therein each tube having a plurality of spaced apart slurry openings and air openings along its longitudinal axis which tube is preferably positioned radially over at least one-half the diameter of the polishing pad.

Abstract: An apparatus and method of conditioning a CMP polishing pad to ensure consistent polishing throughout the polishing process. In particular, the apparatus consists of a translatable wedge-shaped conditioning plate, having a three point adjustable contact to ensure proper alignment with the polishing pad; a high pressure conditioning spray nozzle to clean the polishing pad and conditioning assembly throughout polishing; and a slurry dispensing nozzle to enhance planarization of the wafer. Further, the frequency of oscillation may be varied by the operator to prevent grooves from forming in the polishing pad.

Abstract: In a chemical mechanical polishing process for planarization of semiconductor wafers, a pair of opposed grippers are used to move the wafer from one station to another. During this movement, the wafer is rotated and brushes along the periphery are placed in contact with the edge of the wafer to remove foreign material and residue which builds up along the edge of the wafer. Cleaning fluid may be introduced to flush away and/or breakup the residue buildup.

Abstract: A brush conditioner for a semiconductor wafer cleaning tool including a pair if opposed, rotating flexible brushes. The conditioner is a wing-like structure having a leading edge and a trailing edge. The leading edge is forced against the rotating brushes flexing them to assist in removal of foreign material. The trailing edge tapers to a point and provides stability to the wing.

Abstract: Disc shaped cleaning/polishing pads are disclosed for use on a cleaning/polishing apparatus wherein the surface of the cleaning/polishing pad comprises resilient members arranged in patterns which will facilitate the movement of fluids (deoinized water, chemical slurry, etc.) from the center region of the pad to the periphery of the pad. Arrangement of the resilient members on the pads may be spiral, swirl, concentric or any other suitable pattern which will direct fluids to the periphery of the pad upon rotation of the pad.

Abstract: Disclosed is a brush conditioning apparatus for attachment to a wafer cleaning tool having a cylindrical brush. The brush conditioning apparatus includes a freely rotatable, cylindrically shaped brush conditioner that can be adjustably mounted onto an existing wafer cleaning tool. The apparatus also includes a fluid injection system that has an intake port on at least one end of the cylindrical brush conditioner and includes fluid dispensing outlets along the radial surface of the brush conditioner. Because the brush conditioner is freely mounted onto the brush cleaning tool and in contact with the cleaning brush, a counter rotation of the brush conditioner will occur as the cleaning brush is rotated.