Patents by Inventor Paul A. Sant

Paul A. Sant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11951682
    Abstract: A thermoresponsive suspension composition for use in additive manufacturing includes an aqueous suspension of a thermosetting resin, a crosslinking agent configured to react with the thermosetting resin, and a mineral particulate, wherein the thermosetting resin and crosslinking agent react at or above a trigger temperature.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: April 9, 2024
    Assignees: The Regents of the University of California, Technical University of Munich, Master Builders Solutions Admixtures US, LLC
    Inventors: Gaurav Sant, Sharu Bhagavathi Kandy, Torben Gädt, Iman Mehdipour, Thiyagarajan Ranganathan, Samanvaya Srivastava, Paul Seiler
  • Patent number: 8124172
    Abstract: There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; treating the first layer with a reactive surface-active composition to form a treated first layer having a second surface energy which is lower than the first surface energy; exposing the treated first layer with radiation; and forming the second layer. There is also provided an organic electronic device made by the process.
    Type: Grant
    Filed: April 10, 2006
    Date of Patent: February 28, 2012
    Assignees: E.I. du Pont de Nemours and Company
    Inventors: Charles D. Lang, Stephen Sorich, Charles K. Taylor, Douglas R. Anton, Alberto Goenaga, Paul A. Sant
  • Publication number: 20080067473
    Abstract: There is provided a composition for the liquid deposition of organic active materials. In the composition the organic active material is dispersed in a liquid medium. The liquid medium is made up of 5-35% by weight of a first liquid having a boiling point greater than 160° C. and 65-95% by weight of a second liquid having a boiling point less than 130° C.
    Type: Application
    Filed: June 5, 2007
    Publication date: March 20, 2008
    Inventors: DENNIS WALKER, Paul Sant, Stephen Sorich, Charles MacPherson, Alberto Goenaga
  • Publication number: 20070221885
    Abstract: Compositions for improved liquid deposition of active material in manufacturing processes of electronic devices are provided. The compositions comprise at least one active material for liquid deposition, at least one first solvent, at least one second solvent, and at least one third solvent, with a fourth solvent optional. The solvents are selected on the basis of their co-miscibility, ability to form a composition with each other and with active material without significant precipitation of active material from the composition, and at least one of the solvents having a surface tension equal to or less than that of the substrate upon which active material is to be deposited.
    Type: Application
    Filed: December 22, 2006
    Publication date: September 27, 2007
    Inventors: Alberto Goenaga, Paul Sant
  • Publication number: 20070075626
    Abstract: An electronic device includes a substrate, a first layer, a first pixel, and a patterned reactive surface-active layer. The first pixel includes a first pixel driving circuit that overlies the substrate and includes a first electronic component. The first electronic component includes a first electrode and a second layer. The first electrode overlies at least a part of the first pixel driving circuit. The patterned reactive surface-active layer has a lower surface energy than the first layer. A process for forming an electronic device includes forming a first pixel driving circuit over a substrate, forming a first electrode of a first electronic component over the substrate, forming a first layer, forming a patterned reactive surface-active layer, and forming a second layer over the first electrode of the first electronic component.
    Type: Application
    Filed: June 5, 2006
    Publication date: April 5, 2007
    Inventors: Gang Yu, Charles Lang, Stephen Sorich, Alberto Goenaga, Matthew Stainer, Paul Sant, Dennis Walker, Charles MacPherson, Gordana Srdanov
  • Publication number: 20060027800
    Abstract: An electronic device includes a substrate, a structure having openings, and a first electrode overlying the structure and lying within the openings. From a cross-sectional view, the structure, at the openings, has a negative slope. From a plan view, each opening has a perimeter that may or may not substantially correspond to a perimeter of an organic electronic component. The portions of the first electrode overlying the structure and lying within the openings are connected to each other. In a process for forming the electronic device, an organic active layer may be deposited within the opening, wherein the organic active layer has a liquid composition.
    Type: Application
    Filed: August 3, 2004
    Publication date: February 9, 2006
    Inventors: Charles MacPherson, Matthew Stainer, Michael Anzlowar, Paul Sant, Sughosh Venkatesh