Abstract: An integrated solder preform array is composed of a metal or metal alloy suitable for use in a soldering or bonding process. The preform includes a series of discrete solder islands disposed in a desired matrix. Each island contains a hole for receiving a pin, and bridging strands for joining each of said islands in a matrix. The bridging strands are formed of the same solder material as the islands, with the solder preform containing a substantially uniform coating of tin over its entire outer surface for the purpose of improving solder wetting and therefore elimination of unwanted shorting of circuits and other electrical components being soldered.

Abstract: An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined conductive pad arrangements. The integral solder preform has first and second pluralites of solder pads having respective first and second solder pad arrangements which are maintained in position by a plurality of bridging solder bands. The first and second solder pad arrangements correspond to the first and second predetermined conductive pad arrangements and are spaced apart by a predetermined distance by spacing solder bands.

Abstract: A solder preform containing a series of islands that are joined together in a matrix by bridging bands. Each band has a reduced cross-sectional area in its midregion. In one form of this invention, at least some of the islands contain pin receiving holes formed therein and solder tabs that are arranged to frictionally engage a pin that is passed into the hole to prevent the preform from being misaligned or dislodged from the pins and which at the time of bonding, prewets the pins to promote flowing of solder to the pins from the islands to form a superior solder joint.

Abstract: An indium-metal braid-indium sandwich is formed by applying indium ribbons to upper and lower surfaces of a metal braid and then working the sandwich, e.g., between rollers. The resulting product has enhanced tensile strength and stiffness, yet retains the attributes of indium for application as a gasket, gland, or seal.

Abstract: An indium-metal braid-indium sandwich is formed by applying indium ribbons to upper and lower surfaces of a metal braid and then working the sandwich, e.g., between rollers. The resulting product has enhanced tensile strength and stiffness, yet retains the attributes of indium for application as a gasket, gland, or seal.