Patents by Inventor Paul A. Templin

Paul A. Templin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slotted semiconductor substrate having microelectronics integrated thereon
    Patent number: 6767089
    Abstract: The exemplary embodiments describe a semiconductor substrate having microelectronics integrated thereon. In one exemplary embodiment, the semiconductor substrate comprises a plurality of fluid ejecting elements positioned over a substrate. The semiconductor substrate can further comprise one or more fluid feed channel(s) formed in the substrate. The one or more fluid feed channel(s) being configured to deliver fluid to the plurality of fluid ejecting elements. The one or more fluid feed channel(s) are defined at least in part by first and second substantially parallel side walls and first and second non-parallel end walls.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: July 27, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shen Buswell, Paul A. Templin, Conrad Jenssen, Mark H. MacKenzie