Abstract: A method of fabricating a fluid feed slot in a print head substrate includes making a cut into a first surface of a substrate using a cutting disk having a generally planar surface oriented generally perpendicular to the first surface, and removing material from a second surface of the substrate. Making the cut and removing the material form, in combination, the fluid feed slot in the substrate at least a portion of which passes entirely through the substrate, with a full length of the fluid feed slot extending less than a full length of the substrate, and making the cut into the first surface includes providing a first completed portion of the fluid feed slot with curved surfaces at opposite end walls thereof converging from the first surface toward the second surface.

Abstract: The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate.

Abstract: The exemplary embodiments describe a semiconductor substrate having microelectronics integrated thereon. In one exemplary embodiment, the semiconductor substrate comprises a plurality of fluid ejecting elements positioned over a substrate. The semiconductor substrate can further comprise one or more fluid feed channel(s) formed in the substrate. The one or more fluid feed channel(s) being configured to deliver fluid to the plurality of fluid ejecting elements. The one or more fluid feed channel(s) are defined at least in part by first and second substantially parallel side walls and first and second non-parallel end walls.

Abstract: The described embodiments relate to methods and systems of forming slots in a semiconductor substrate. In one exemplary embodiment, a slot is formed by cutting with a disk into a semiconductor substrate into one of a first and second surfaces. A trench is created in the semiconductor substrate into the other of the first and second surfaces to form in combination with said cutting a slot through the substrate.