Abstract: A connector for electrically and mechanically interconnecting multiple pairs of small coaxial conductor pairs includes a shield bus layer and signal conductor traces on opposite sides of a flexible dielectric substrate. Terminal portions of the signal conductor traces span an opening through the connector giving access to each signal conductor trace for soldering the traces to arrayed terminals on a circuit assembly, and are located accurately, so that mass soldering techniques can be utilized, with the connector located with respect to the circuit assembly by registration pins and holes. Portions of the shield bus are exposed to be soldered to a respective terminal on a circuit assembly, and to allow the shield conductors of the coaxial pairs to be soldered to the shield bus layer. Thermal breaks are defined in the shield bus layer to protect soldered junctions between the signal conductor traces and the signal conductors of coaxial pairs and the terminals of the circuit assembly.

Abstract: A carrier, or transfer frame, includes a pair of support portions located on opposite sides of an opening defined by the frame to receive portions of individual conductors of a cable, with the conductors extending across the opening and held in desired positions relative to each other during transportation prior to installation in an electrical circuit. Each conductor is connected electrically to a respective test contact pad of electrically conductive material located on one of the support portions. The transfer frame is placed and held in a desired position adjacent a circuit while the conductors are soldered, with access to the individual conductors, including shield conductors, being gained through the opening defined by the transfer frame.