Abstract: Various embodiments of an electronic system and method for removing a power module from an electronic system are provided. The electronic system includes a power module that supplies power to a load and is movable along an axis from an enabling position to a disconnected position. The electronic system also includes a release control that restricts the movement of the power module along the axis when the power module is moved beyond a disabling position located between the enabling position and the disconnected position.

Abstract: A method and apparatus for distributing electrical power is provided. In one embodiment, the apparatus includes: a semiconductor switch adapted to receive input power from a DC power source, adapted to distribute power to a DC/DC module, and adapted to receive a control signal, a charge storage device in operative communication with the semiconductor switch and a return path associated with the DC power source, and a reverse current monitoring logic in operative communication with the semiconductor switch. In this embodiment, the reverse current monitoring logic is adapted to detect reverse current flowing in the semiconductor switch and, in response to detecting the reverse current, is adapted to open the semiconductor switch. Several embodiments of a method of distributing electrical power to a DC load are also provided.

Abstract: A power module includes a plurality of converters having outputs for coupling to a supply voltage. The power module further includes a connector having a pin to provide a signal indicative of whether the power module is being disconnected from a system. A controller is responsive to the signal indicating that the power module is being disconnected by sequentially deasserting enable signals to the converters to disable the converters in a sequential order.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: A method and apparatus for distributing electrical power is provided. In one embodiment, the apparatus includes: a semiconductor switch adapted to receive input power from a DC power source, adapted to distribute power to a DC/DC module, and adapted to receive a control signal, a charge storage device in operative communication with the semiconductor switch and a return path associated with the DC power source, and a reverse current monitoring logic in operative communication with the semiconductor switch. In this embodiment, the reverse current monitoring logic is adapted to detect reverse current flowing in the semiconductor switch and, in response to detecting the reverse current, is adapted to open the semiconductor switch. Several embodiments of a method of distributing electrical power to a DC load are also provided.

Abstract: An electronic processing system contains a power supply subsystem and a multi-processor module. Programmable control circuitry manages power consumption in the electronic system by allocating priority among a plurality of competing demands, such as total power consumption, power consumption at any one of the processors, and thermal measurements. Analog sense measurements of incoming power are transmitted to the control circuits, which are protected from noise through use of an isolation barrier established by a linear isolation amplifier.

Abstract: In accordance with one embodiment, the present invention relates to a support structure for an electronic component, such as a voltage regulator module for a computer device. The exemplary support structure has a body and a leg extending askew from the body, the leg and body cooperating to define a receiving region for receiving the electronic component. The leg has a resilient securement portion that is configured to releasably engage with an electronics substrate.

Abstract: Various embodiments of an electronic system and method for removing a power module from an electronic system are provided. The electronic system includes a power module that supplies power to a load and is movable along an axis from an enabling position to a disconnected position. The electronic system also includes a release control that restricts the movement of the power module along the axis when the power module is moved beyond a disabling position located between the enabling position and the disconnected position.

Abstract: Circuits and methods of providing power to an electric load are disclosed. The method includes the steps of, for example, generating power via at least first and second parallel power supplies, in response to the first power supply exhibiting an over-voltage, disabling a reverse current threshold on the second power supply, turning off the first power supply when the over-voltage exceeds a threshold value, and continuing to generate power via the second power supply.

Abstract: A power module includes a plurality of converters having outputs for coupling to a supply voltage. The power module further includes a connector having a pin to provide a signal indicative of whether the power module is being disconnected from a system. A controller is responsive to the signal indicating that the power module is being disconnected by sequentially deasserting enable signals to the converters to disable the converters in a sequential order.

Abstract: Embodiments of a routing system for electronic module assemblies are disclosed that may incorporate a module base having at least one routing end and a channel formed across a length of the at least one routing end, wherein the channel has a dimension that allows a wire to be routed from the module base to a connection point external to the module base and allows the wire to be bent within the channel in a direction of the connection point.

Abstract: An electrical connector assembly for electrically coupling two components, such as two circuit boards, comprises a socket coupled to a first component and a blade coupled to a second component. The socket includes at least a first and a second conductive engagement member arranged on opposite sides of a spatial gap. The blade includes at least a first and a second conductive pad arranged on opposite sides of an insulator. The blade has a width complementary to the socket's spatial gap such that when inserted into the spatial gap the blade's first conductive pad forms an electrical contact with the socket's first conductive engagement member and the blade's second conductive pad forms an electrical contact with the socket's second conductive engagement member. The blade comprises first and second connector mechanisms that are arranged off-set from each other for electrically coupling the first and second conductive pads, respectively, to the second component.

Abstract: Embodiments of a routing system for electronic module assemblies are disclosed that may incorporate a module base having at least one routing end and a channel formed across a length of the at least one routing end, wherein the channel has a dimension that allows a wire to be routed from the module base to a connection point external to the module base and allows the wire to be bent within the channel in a direction of the connection point.

Abstract: An electrical connector assembly for electrically coupling two components, such as two circuit boards, comprises a socket coupled to a first component and a blade coupled to a second component. The socket includes at least a first and a second conductive engagement member arranged on opposite sides of a spatial gap. The blade includes at least a first and a second conductive pad arranged on opposite sides of an insulator. The blade has a width complementary to the socket's spatial gap such that when inserted into the spatial gap the blade's first conductive pad forms an electrical contact with the socket's first conductive engagement member and the blade's second conductive pad forms an electrical contact with the socket's second conductive engagement member. The blade comprises first and second connector mechanisms that are arranged off-set from each other for electrically coupling the first and second conductive pads, respectively, to the second component.

Abstract: A test method characterizes current behavior of power components (e.g., semiconductor packages) within an electronic system. One or more electrically conductive loops are formed with a first printed circuit board of the electronic system; these loops surround, at least in part, one or more electrical vias of the first printed circuit board. One or more power components connect to the vias to obtain power therethrough. Current characteristics are measured from one or more vias to assess transient and steady-state currents of components within the system. Power dissipation may be determined from the current. The loops may be formed within tracks of internal layers of the first printed circuit board, or a second printed circuit board may form the tracks.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: An electronic processing system contains a power supply subsystem and a multi-processor module. Programmable control circuitry manages power consumption in the electronic system by allocating priority among a plurality of competing demands, such as total power consumption, power consumption at any one of the processors, and thermal measurements. Analog sense measurements of incoming power are transmitted to the control circuits, which are protected from noise through use of an isolation barrier established by a linear isolation amplifier.

Abstract: A test method characterizes current behavior of power components (e.g., semiconductor packages) within an electronic system. One or more electrically conductive loops are formed with a first printed circuit board of the electronic system; these loops surround, at least in part, one or more electrical vias of the first printed circuit board. One or more power components connect to the vias to obtain power therethrough. Current characteristics are measured from one or more vias to assess transient and steady-state currents of components within the system. Power dissipation may be determined from the current. The loops may be formed within tracks of internal layers of the first printed circuit board, or a second printed circuit board may form the tracks.