Abstract: Two system boards may be connected by a blind plug connector assembly. The top system board supports a first connector and has a hole adjacent the first connector that secures a guide bracket. The blind plug connector assembly is selectively received in the guide bracket to position a proximal connector on the assembly for connecting to the first connector on the top system board and position a distal connector on the assembly for connecting to a second connector on the lower system board. A flexible wired connection extends within the assembly between the proximal connector and the distal connector, and may form a scalability cable. The interaction between the assembly and the guide bracket provide alignment of the connectors.

Abstract: A memory module socket and a terminating resistor assembly. The terminating resistor assembly provides an elongate conductive bus bar and a plurality of conductive branches, wherein each conductive branch is in electronic communication with the elongate conductive bus bar through a resistor, wherein each conductive branch has a distal end disposed for contacting a signal pin within a memory module socket installed on a printed circuit board. A distal end of each conductive branch is inserted into a window on the connector shoulder adjacent to the slot of an empty memory module socket and engages a plurality of signal pins within the socket in response to the absence of a memory module in the slot. The plurality of signal pins engage contact pads on the memory module and are pushed out of contact with the conductive branch in response to the presence of a memory module in the slot.

Abstract: A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

Abstract: A land grid array (LGA) and a method of forming the LGA are disclosed. The method comprises plating a printed circuit board to form a grid array of copper pads, and soldering a discrete pad over each of the plated copper pads in the grid array. The discrete pad is a solid object that can be handled and positioned independent of other discrete pads. Optionally, the method may further comprise measuring variations in flatness of the printed circuit board as a function of location in the grid array, and selecting individual discrete pads that each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

Abstract: A memory module includes persistent-storage memory chips and an auxiliary voltage connector for powering the persistent-storage memory chips. An auxiliary power cable has a first end coupled to an electronic power source on the system board and has a second end having connector that plugs in to the auxiliary voltage connector on the memory module to provide power to the persistent-storage memory chips. The auxiliary power cable also resists movement of a latch lever to require disconnecting the auxiliary power cable before ejecting the memory module.

Abstract: An apparatus includes a socket that receives a memory module that includes a card having card edge voltage pads along the lower card edge, auxiliary voltage pads along at least one of the vertical card edges, and one or more persistent, solid-state memory chips on one or both card faces. A latch pivotally coupled to the socket is movable between a latched position and an unlatched position. The latch includes electrical latch contacts positioned for being engaged with the auxiliary voltage pads when that latch is in the latched position and being disengaged from the auxiliary voltage pads when the latch is in the unlatched position. The electrical latch contacts may provide a different voltage to the auxiliary voltage pads than the socket provides to the card edge voltage pads along the lower card edge.

Abstract: A memory module socket and a terminating resistor assembly. The terminating resistor assembly provides an elongate conductive bus bar and a plurality of conductive branches, wherein each conductive branch is in electronic communication with the elongate conductive bus bar through a resistor, wherein each conductive branch has a distal end disposed for contacting a signal pin within a memory module socket installed on a printed circuit board. A distal end of each conductive branch is inserted into a window on the connector shoulder adjacent to the slot of an empty memory module socket and engages a plurality of signal pins within the socket in response to the absence of a memory module in the slot. The plurality of signal pins engage contact pads on the memory module and are pushed out of contact with the conductive branch in response to the presence of a memory module in the slot.

Abstract: A memory module includes persistent-storage memory chips and an auxiliary voltage connector for powering the persistent-storage memory chips. An auxiliary power cable has a first end coupled to an electronic power source on the system board and has a second end having connector that plugs in to the auxiliary voltage connector on the memory module to provide power to the persistent-storage memory chips. The auxiliary power cable also resists movement of a latch lever to require disconnecting the auxiliary power cable before ejecting the memory module.

Abstract: An apparatus includes a socket that receives a memory module that includes a card having card edge voltage pads along the lower card edge, auxiliary voltage pads along at least one of the vertical card edges, and one or more persistent, solid-state memory chips on one or both card faces. A latch pivotally coupled to the socket is movable between a latched position and an unlatched position. The latch includes electrical latch contacts positioned for being engaged with the auxiliary voltage pads when that latch is in the latched position and being disengaged from the auxiliary voltage pads when the latch is in the unlatched position. The electrical latch contacts may provide a different voltage to the auxiliary voltage pads than the socket provides to the card edge voltage pads along the lower card edge.

Abstract: A method of forming an assembly for tool-less backplane retention and insertion thereof into a housing including a housing mating device through which an installation path for an assembly is defined with a space in which a first part is positioned is provided. The method includes coupling a hub and a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed. The coupling includes inserting a backplane mating device protruding from one of the opposing faces of the backplane body through a hub mating device defined in the hub. The method further includes forcing a first stage of a two-stage mating device, which includes first and second elastically coupled stages and which extends from the hub, to elastically hook onto the backplane body during a near-completion of the insertion.

Abstract: A memory module connector includes a dynamically-assisted latch that facilitates connecting and releasing a memory module. The latch includes a lever pivotably coupled to the connector for urging the memory module into and out of a fully seated position within the connector. The lever provides a mechanical advantage for lowering and raising the memory module. A latch assist member urges the latch into engagement with the memory module in response to an insertion of the memory module, and dynamically positions the lever in response to movement of the memory module within the connector.

Abstract: A memory module connector includes a dynamically-assisted latch that facilitates connecting and releasing a memory module. The latch includes a lever pivotably coupled to the connector for urging the memory module into and out of a fully seated position within the connector. The lever provides a mechanical advantage for lowering and raising the memory module. A latch assist member urges the latch into engagement with the memory module in response to an insertion of the memory module, and dynamically positions the lever in response to movement of the memory module within the connector.

Abstract: A pin and a method of establishing contact between a pin and plating of a circuit board hole is provided. Embodiments include a pin comprising a pair of outwardly biased flexible beams that each extend from a body of the pin, the flexible beams connected at one end to one another at the body of the pin and separated from each other at an end opposite the end connected to the body, the separation between the pair of flexible beams forming an open slot, each flexible beam including a contact point that contacts the plating of the hole when the pin is inserted into the circuit board hole.

Abstract: An edge connector is provided that accommodates printed circuit boards (PCB) of varying thickness. Embodiments include a body; a set of card connector engagement pins coupled to the body, the set of card connector engagement pins coupling with a circuit card connector; and the set of PCB engagement pins coupled to the body, the set of PCB engagement pins receiving contact pads of the PCB, wherein each PCB engagement pin includes a contact point that slopes away from the body of the edge connector, wherein the contact point of each PCB engagement pin slopes in an opposite direction from the contact point of the other PCB engagement pin in the set, wherein each PCB engagement pin is flexible inward toward the body of the edge connector.

Abstract: A land grid array (LGA) and a method of forming the LGA are disclosed. The method comprises plating a printed circuit board to form a grid array of copper pads, and soldering a discrete pad over each of the plated copper pads in the grid array. The discrete pad is a solid object that can be handled and positioned independent of other discrete pads. Optionally, the method may further comprise measuring variations in flatness of the printed circuit board as a function of location in the grid array, and selecting individual discrete pads that each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

Abstract: An apparatus is provided to remove heat from a heat-generating component of a computer, such as a processor. The apparatus comprises a first heat sink having a plurality of leader fins, wherein the first heat sink is thermo-conductively coupled to a heat-generating component that is coupled to a first portion of a chassis; and a second heat sink having a plurality of follower fins, wherein the second heat sink is thermo-conductively coupled to a second portion of the chassis, and wherein the plurality of follower fins are disposed in an interlaced configuration with the plurality of follower fins to promote radiative heat transfer from the leader fins to the follower fins. Optionally, one or more alignment structures may be used to facilitate the relative movement of the first and second chassis portions into an operative position in which the leader and follower fins are in the interlaced configuration.

Abstract: A low resistance, multi-contact point pin, configured for insertion into a pin receptacle having an electrically conductive plating, where the pin includes: a surface and more than one electrically conductive extrusion from the surface of the pin, with each extrusion extruding substantially orthogonal to a direction of insertion of the pin into the pin receptacle, and where the extrusions configured to electrically couple, with parallel resistance, the pin to the electrically conductive plating of the pin receptacle.

Abstract: An apparatus is provided and includes a housing, including a housing mating device, through which an installation path for an assembly is defined with a space in which a first part is positioned, a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed, and a hub, in which a hub mating device is defined, and from which a two-stage mating device extends, the two-stage mating device including first and second elastically coupled stages. The hub and the backplane body are coupled to form the assembly and the assembly is installed/removed in/from the space with the second stage of the two-stage mating device elastically hooked by the housing mating device or released from the housing mating device and the first and second stages of the two-stage mating device biasing the hub and the backplane body to remain coupled.

Abstract: A pin and a method of establishing contact between a pin and plating of a circuit board hole is provided. Embodiments include a pin comprising a pair of outwardly biased flexible beams that each extend from a body of the pin, the flexible beams connected at one end to one another at the body of the pin and separated from each other at an end opposite the end connected to the body, the separation between the pair of flexible beams forming an open slot, each flexible beam including a contact point that contacts the plating of the hole when the pin is inserted into the circuit board hole.

Abstract: An apparatus is provided and includes a housing, including a housing mating device, through which an installation path for an assembly is defined with a space in which a first part is positioned, a backplane body having opposing faces on which a second part and a backplane mating device are respectively disposed, and a hub, in which a hub mating device is defined, and from which a two-stage mating device extends, the two-stage mating device including first and second elastically coupled stages. The hub and the backplane body are coupled to form the assembly and the assembly is installed/removed in/from the space with the second stage of the two-stage mating device elastically hooked by the housing mating device or released from the housing mating device and the first and second stages of the two-stage mating device biasing the hub and the backplane body to remain coupled.