Abstract: A system for retrofitting a trailer having a crank jack with a jack housing and a drop leg includes a hydraulic cylinder including a main cylinder and a ram piston extending outwardly therefrom as the main cylinder is filled with pressurized fluid, a first mounting ear on the hydraulic cylinder and a second mounting ear on the hydraulic cylinder, the first mounting ear opposite the second mounting ear, a cylinder port positioned orthogonally to the first mounting ear and the second mounting ear and positioned between the first mounting ear and the second mounting ear, and a conversion foot sized and shaped to fit within the jack housing and adapted to support the hydraulic cylinder.

Abstract: A breathing mask adapted to be placed over a wearer's face, comprises a mask body including a gas inlet port to be disposed in flow communication with the wearer's breathing passage for flow of a gas in a predetermined flow stream there through upon inhalation by the wearer; a communications microphone (30) mounted to said mask body to capture the voice of the wearer, said communications microphone generating sound signals; an attenuation device (34) for attenuating said sound signals; a sound monitor (36) for monitoring the intensity of sound near the communications microphone in a predetermined frequency range, connected to a controller device (38) for activating the attenuation device when the sound intensity monitored by the sound monitor is in a predetermined level range.

Abstract: Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) is described. In an example, a method of fabricating a thin metal film involves introducing precursor molecules proximate to a surface on or above a substrate, each of the precursor molecules having one or more metal centers surrounded by ligands. The method also involves depositing a metal layer on the surface by dissociating the ligands from the precursor molecules using a photo-assisted process.

Abstract: A system for retrofitting a trailer having a crank jack with a jack housing and a drop leg includes a hydraulic cylinder including a main cylinder and a ram piston extending outwardly therefrom as the main cylinder is filled with pressurized fluid, a first mounting ear on the hydraulic cylinder and a second mounting ear on the hydraulic cylinder, the first mounting ear opposite the second mounting ear, a cylinder port positioned orthogonally to the first mounting ear and the second mounting ear and positioned between the first mounting ear and the second mounting ear, and a conversion foot sized and shaped to fit within the jack housing and adapted to support the hydraulic cylinder.

Abstract: The present disclosure relates to methods of reducing the formation of acrylamide in a thermally processed food product and to cooked food products with reduced acrylamide. The method comprises providing a food product or food intermediate in need of reduction of formation of acrylamide during thermal processing and applying a bran composition to the food product or food intermediate in an amount effective to reduce formation of acrylamide during thermal processing to a level that is lower than if the composition had not been applied.

Abstract: Techniques are disclosed for forming through-silicon vias (TSVs) implementing a negative thermal expansion (NTE) material such as zirconium tungstate (ZrW2O8) or hafnium tungstate (HfW2O8). In some cases, the NTE material is disposed between the substrate and conductive core material of the TSV and serves to offset, at least in part, the coefficient of thermal expansion (CTE) mismatch there between, thus reducing heat-induced stresses and/or protrusion (pumping) of the conductive core material. The NTE material also may protect against leakage, voltage breakdown, and/or diffusion of the conductive core material. Furthermore, the NTE material may reduce radial stresses in high-aspect-ratio TSVs. In some cases, techniques disclosed herein may improve TSV reliability, enhance three-dimensional integration, and/or enhance performance in three-dimensional integrated circuits and/or other three-dimensional packages.

Abstract: Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD) is described. In an example, a method of fabricating a thin metal film involves introducing precursor molecules proximate to a surface on or above a substrate, each of the precursor molecules having one or more metal centers surrounded by ligands. The method also involves depositing a metal layer on the surface by dissociating the ligands from the precursor molecules using a photo-assisted process.

Abstract: Techniques are disclosed for forming through-silicon vias (TSVs) implementing a negative thermal expansion (NTE) material such as zirconium tungstate (ZrW2O8) or hafnium tungstate (HfW2O8). In some cases, the NTE material is disposed between the substrate and conductive core material of the TSV and serves to offset, at least in part, the coefficient of thermal expansion (CTE) mismatch there between, thus reducing heat-induced stresses and/or protrusion (pumping) of the conductive core material. The NTE material also may protect against leakage, voltage breakdown, and/or diffusion of the conductive core material. Furthermore, the NTE material may reduce radial stresses in high-aspect-ratio TSVs. In some cases, techniques disclosed herein may improve TSV reliability, enhance three-dimensional integration, and/or enhance performance in three-dimensional integrated circuits and/or other three-dimensional packages.

Abstract: Light emitting diode assemblies having transparent covers that exhibit high indexes of refraction adjacent are provided. Covers comprise polymer composites comprising inorganic nanoparticles. Inorganic nanoparticles include nanoparticles of zirconium dioxide, hafnium dioxide, titanium dioxide, and combinations thereof.

Abstract: A well system for forming a window in a casing string positioned in a wellbore. The system includes first and second steel casing joints (462, 464) interconnectable within the casing string. An aluminum exit joint (460) is positioned between the first and second steel casing joints (462, 464). The aluminum exit joint (460) has a first interconnection with the first steel casing joint (462) and a second interconnection with the second steel casing joint (464). The aluminum exit joint (460) is operable to have the window formed therethrough. A first sleeve (470) is positioned within the first interconnection to provide galvanic isolation between the aluminum exit joint (460) and the first steel casing joint (462). A second sleeve (472) is positioned within the second interconnection to provide galvanic isolation between the aluminum exit joint (460) and the second steel casing joint (464).

Abstract: A method and system for cleaning lithography components including contacting a substrate having residue including organic compounds and graphitic carbon deposited on a surface thereof with hydrogen peroxide vapor. The hydrogen peroxide vapor is irradiated with electromagnetic radiation having a wavelength in the range of 100 nm to 350 nm forming hydroxyl radicals. The hydroxyl radicals react with the residue to remove the residue from the surface of the substrate.

Abstract: Techniques are disclosed for forming through-silicon vias (TSVs) implementing a negative thermal expansion (NTE) material such as zirconium tungstate (ZrW2O8) or hafnium tungstate (HfW2O8). In some cases, the NTE material is disposed between the substrate and conductive core material of the TSV and serves to offset, at least in part, the coefficient of thermal expansion (CTE) mismatch there between, thus reducing heat-induced stresses and/or protrusion (pumping) of the conductive core material. The NTE material also may protect against leakage, voltage breakdown, and/or diffusion of the conductive core material. Furthermore, the NTE material may reduce radial stresses in high-aspect-ratio TSVs. In some cases, techniques disclosed herein may improve TSV reliability, enhance three-dimensional integration, and/or enhance performance in three-dimensional integrated circuits and/or other three-dimensional packages.

Abstract: A pellicle membrane is mounted between an outer frame and an inner frame. At least one of the frames is attached to the reticle without using conventional adhesives. The pellicle and reticle may be used in a lithography system. The pellicle allows radiation to pass through the pellicle to the reticle and may prevent particles from passing through the pellicle.

Abstract: A new, effective and cost-efficient method of introducing Fluorine into Hf-based dielectric gate stacks of planar or multi-gate devices (MuGFET), resulting in a significant improvement in both Negative and Positive Bias Temperature Instabilities (NBTI and PBTI) is provided. The new method uses an SF6 based metal gate etch chemistry for the introduction of Fluorine, which after a thermal budget within the standard process flow, results in excellent F passivation of the interfaces. A key advantage of the method is that it uses the metal gate etch for F introduction, requiring no extra implantations or treatments. In addition to the significant BTI improvement with the novel method, a better Vth control and increased drive current on MuGFET devices is achieved.

Abstract: A well system for forming a window in a casing string positioned in a wellbore. The system includes first and second steel casing joints (462, 464) interconnectable within the casing string. An aluminum exit joint (460) is positioned between the first and second steel casing joints (462, 464). The aluminum exit joint (460) has a first interconnection with the first steel casing joint (462) and a second interconnection with the second steel casing joint (464). The aluminum exit joint (460) is operable to have the window formed therethrough. A first sleeve (470) is positioned within the first interconnection to provide galvanic isolation between the aluminum exit joint (460) and the first steel casing joint (462). A second sleeve (472) is positioned within the second interconnection to provide galvanic isolation between the aluminum exit joint (460) and the second steel casing joint (464).

Abstract: One inventive aspect relates to a method for fabricating a high-k dielectric layer. The method comprises depositing onto a substrate a layer of a high-k dielectric material having a first thickness. The high-k dielectric material has a bulk density value and the first thickness is so that the high-k dielectric layer has a density of at least the bulk density value of the high-k dielectric material minus about 10%. The method further comprises thinning the high-k dielectric layer to a second thickness. Another inventive aspect relates to a semiconductor device comprising a high-k dielectric layer as fabricated by the method.

Abstract: This invention provides, but is not limited to, methods for synthesizing graphene film from liquid hydrocarbons using deep ultraviolet light. Specifically, methods for synthesizing a graphene film from an alicyclic- or liquid aromatic-hydrocarbon are presented. Methods for forming a graphene film comprising a dopant are also presented.

Abstract: An actuator and associated method is provided, the actuator having an arm defining an aperture, an electrical circuit supported by the arm and terminating at a contact, a flexure assembly defining a boss and supporting a second electrical circuit terminating at a second contact, wherein the contacts are resultingly positioned in operable mating engagement with each other placing the electrical circuit in electrical communication with the second electrical circuit when the boss is operably disposed within the aperture and there affixed to the arm.

Abstract: Method and devices for use in a centralized wireless network are provided. The centralized wireless network employs a wireless communication protocol to communicate with various devices throughout the network. In addition to communication, the protocol may be used to control and monitor various aspects of the devices throughout the network.

Abstract: Method, apparatus, and composition of matter suited for use with, for example, immersion lithography. The composition of matter includes hafnium dioxide nanoparticles having diameters less than or equal to about 15 nanometers. The apparatus includes the composition of matter, a light source, a platform for supporting a work piece, and a lens element. The method includes providing a light source, providing a lens element between the light source and a work piece, providing the composition of matter between the lens element and the work piece, and exposing the work piece to light provided by the light source by passing light from the light source through the lens element and the composition of matter to the work piece.