Patents by Inventor Paul Alden Farrar

Paul Alden Farrar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallization composite having nickel intermediate/interface
    Patent number: 5719070
    Abstract: A metallization composite comprises a refractory metal, nickel, and copper. The refractory metal is preferably titanium (Ti), but other suitable refractory metals such as zirconium and hafnium can also be utilized. An additional optional layer of gold can overlie the copper. The metallization composite is used to connect a solder contact to a semiconductor substrate.
    Type: Grant
    Filed: October 2, 1996
    Date of Patent: February 17, 1998
    Assignee: International Business Machines Corporaton
    Inventors: Herbert Carl Cook, Paul Alden Farrar, Sr., Robert Michael Geffken, William Thomas Motsiff, Adolf Ernest Wirsing
  • Method for constructing a rom for redundancy and other applications
    Patent number: 3959047
    Abstract: Disclosed is an improved method for manufacturing semiconductor integrated circuitry whereby interconnection pad limiting metallurgy and read only fusible link memory structure is simultaneously formed by first blank depositing a composite metal film followed by in situ forming pad metallurgy and said read only link structure utilizing photoresist and etch techniques. Said read only memory link structure is utilized for directing the use of redundant lines in place of defective array bits.
    Type: Grant
    Filed: September 30, 1974
    Date of Patent: May 25, 1976
    Assignee: International Business Machines Corporation
    Inventors: Gene Stoddard Alberts, Paul Alden Farrar, Robert Lee Hallen