Patents by Inventor Paul Alfred Lauro
Paul Alfred Lauro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11541472Abstract: Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.Type: GrantFiled: January 29, 2020Date of Patent: January 3, 2023Assignee: International Business Machines CorporationInventors: Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul Alfred Lauro, Da-Yuan Shih
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Publication number: 20220157657Abstract: Embodiments of the invention include a method of singulating IC chips from a wafer. The method can include receiving the wafer having a substrate formed under active layers. The wafer includes a chip that includes a first portion of the active layers and a first portion of the substrate. A separation trench is formed by using an etch operation to remove a first segment of the active layers and a first segment of the substrate that are beneath a first separation channel of the wafer. The separation trench separates the first portion of the active layers from a remaining portion of the active layers; and separates the first portion of the substrate from a remaining portion of the substrate. The first IC chip is seperated from the wafer by removing a first section of the remaining portion of the substrate that is underneath the first portion of the substrate.Type: ApplicationFiled: November 13, 2020Publication date: May 19, 2022Inventors: Cyril Cabral, JR., Frank Robert Libsch, Chitra Subramanian, Peter Jerome Sorce, Paul Alfred Lauro, John M. Papalia
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Patent number: 11270966Abstract: Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.Type: GrantFiled: November 18, 2019Date of Patent: March 8, 2022Assignee: International Business Machines CorporationInventors: Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul Alfred Lauro, Da-Yuan Shih
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Patent number: 11110534Abstract: In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.Type: GrantFiled: April 8, 2019Date of Patent: September 7, 2021Assignee: International Business Machines CorporationInventors: Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih, Paul Alfred Lauro
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Publication number: 20210229203Abstract: Apparatus and methods are disclosed for transferring solder to a substrate. A substrate belt moves one or more substrates in a belt direction. A decal has one or more through holes in a hole pattern that hold solder. Each of the solder holes can align with respective locations on one of the substrates. An ultrasonic head produces an ultrasonic vibration in the solder in a longitudinal direction perpendicular to the belt direction. The ultrasonic head and substrate can be moved together in the longitudinal direction to maintain the ultrasonic head in contact with the solder while the ultrasonic head applies the ultrasonic vibration. Various methods are disclosed including methods of transferring the solder with or without external heating.Type: ApplicationFiled: January 29, 2020Publication date: July 29, 2021Inventors: Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul Alfred Lauro, Da-Yuan Shih
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Publication number: 20210151402Abstract: Protruding solder structures are created for electrical attachment of semiconductor devices. A rigid mold having one or more mold openings is attached to and used in combination with a decal structure that has one or more decal holes. The decal structure is disposed on the rigid mold so that the decal openings are aligned over the mold openings. Each of the decal hole and mold opening in contact form a single combined volume. The single combined volumes are filled with solder to form protruding solder structures. Various structures and methods of making and using the structures are disclosed.Type: ApplicationFiled: November 18, 2019Publication date: May 20, 2021Inventors: Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Paul Alfred Lauro, Da-Yuan Shih
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Publication number: 20200316702Abstract: In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.Type: ApplicationFiled: April 8, 2019Publication date: October 8, 2020Inventors: Jae-Woong Nah, Stephen L. Buchwalter, Peter A. Gruber, Da-Yuan Shih, Paul Alfred Lauro
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Patent number: 9404942Abstract: Coaxial probe structures include a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: February 7, 2014Date of Patent: August 2, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Publication number: 20140191775Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: ApplicationFiled: February 7, 2014Publication date: July 10, 2014Applicant: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8754666Abstract: Structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: March 21, 2008Date of Patent: June 17, 2014Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8561880Abstract: A process and tools for forming and/or releasing metal preforms, metal shapes and solder balls is described incorporating flexible molds or sheets, injection molded metal such as solder and in the case of solder balls, a liquid or gaseous environment to reduce or remove metal oxides prior to or during metal (solder) reflow to increase surface tension to form spherical or substantially spherical solder-balls.Type: GrantFiled: February 11, 2012Date of Patent: October 22, 2013Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Patent number: 8491772Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: August 21, 2009Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8486250Abstract: The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.Type: GrantFiled: February 1, 2002Date of Patent: July 16, 2013Assignee: International Business Machines CorporationInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih
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Patent number: 8241957Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: GrantFiled: October 18, 2010Date of Patent: August 14, 2012Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 7906420Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: GrantFiled: November 30, 2009Date of Patent: March 15, 2011Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20110034047Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: ApplicationFiled: October 18, 2010Publication date: February 10, 2011Applicant: International Business Machines CorporationInventors: Gareth Geoffrey HOUGHAM, S. Jay CHEY, James Patrick DOYLE, Xiao Hu LIU, Christopher V. JAHNES, Paul Alfred LAURO, Nancy C. LaBIANCA, Michael J. ROOKS
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Patent number: 7883919Abstract: A method for fabricating a negative thermal expanding system device includes coating a wafer with a thermally decomposable polymer, patterning the decomposable polymer into repeating disk patterns, releasing the decomposable polymer from the wafer and forming a sheet of repeating patterned disks, suspending the sheet into a first solution with seeding compounds for electroless decomposition, removing the sheet from the first solution, suspending the sheet into a second solution to electrolessly deposit a first layer material onto the sheet, removing the sheet from the second solution, suspending the sheet into a third solution to deposit a second layer of material having a lower TCE value than the first layer of material, separating the patterned disks from one another, and annealing thermally the patterned disks to decompose the decomposable polymer and creating a cavity in place of the decomposable polymer.Type: GrantFiled: July 6, 2009Date of Patent: February 8, 2011Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, S. Jay Chey, James Patrick Doyle, Xiao Hu Liu, Christopher V. Jahnes, Paul Alfred Lauro, Nancy C. LaBianca, Michael J. Rooks
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Patent number: 7867842Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: GrantFiled: July 29, 2008Date of Patent: January 11, 2011Assignee: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20100072263Abstract: A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receivinType: ApplicationFiled: November 30, 2009Publication date: March 25, 2010Applicant: International Business Machines CorporationInventors: Peter Alfred Gruber, Paul Alfred Lauro, Jae-Woong Nah
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Publication number: 20100052715Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.Type: ApplicationFiled: August 27, 2009Publication date: March 4, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George Frederick Walker