Abstract: Apparatuses, methods, systems, and program products are disclosed for dynamically loading firmware based on workloads. A workload module determines a workload configured to be executed on a system. A firmware module determines a firmware configuration associated with the workload. A loading module dynamically accesses the firmware configuration associated with the workload from a remote data store, and loads the firmware configuration on the system prior to execution of the workload.

Abstract: A method includes tracking, for each of a plurality of workloads, a wear rate incurred by a component of a given component type as a result of processing an instance of the workload on a compute node that includes the component. The method further comprises determining a remaining lifespan for a plurality of components in a plurality of compute nodes, and identifying a component from among the plurality of components having a remaining lifespan of less than a first threshold amount. Sill further, the method comprises identifying an instance of one of the workloads that needs processing and has a wear rate greater than a second threshold amount, and processing the identified workload instance on the identified component.

Abstract: In one aspect, a device includes at least one processor, storage, a power supply unit (PSU) interlace which connects to a PSU and receives power from the PSU, and a power module (PM) including a power in interface for receiving power from at least one computer and a power out interface for providing power to at least one computer.

Abstract: A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components including one or more processors. The card circuit board has a chassis loading end. A heat sink is provided on the circuit board and thermally coupled to one or more electronic components to dissipate heat therefrom. The heat sink has a three-dimensional envelope having a stepped end profile relative to the chassis loading end. Vent openings are provided in shielding of the electronics card for airflow from the electronics card.

Abstract: An apparatus with deflectable dividers separating peripheral components is disclosed. The apparatus includes a shroud housing coupleable to a circuit board of a computer. In an installed position, the shroud housing facilitates a proper electrical connection between peripheral components and the circuit board. The apparatus also includes at least one deflectable divider that is deflectably mounted to the shroud housing. In the installed position, the at least one deflectable divider is disposed between adjacent peripheral components. The at least one deflectable divider is operably displaced away from a selected peripheral component in a displacement motion by fingers of a user during a component swap operation to allow space for the fingers of the user to grasp the selected peripheral component.

Abstract: Computing devices having slots and components for receipt of different types of peripherals are disclosed. According to an aspect, a computing device includes a body that defines an interior and comprises a rear wall defining a slot that extends into the interior. The slot is sized and shaped for receipt of two or more different types of peripherals. The computing device includes a motherboard that defines another slot being sized and shaped for receipt of the different types of peripherals. The other slot is substantially coplanar with the second slot. The computing device includes a connector operably interfaced with the motherboard and configured to interface with the different types of peripherals.

Abstract: Systems and methods are provided for information handling system thermal control that employ configuration-based temperature feedback, e.g., by using configuration-based fan speed control based on real time individual measured component temperatures. In one example, the disclosed systems and methods may be implemented to allow inputs from one or more hardware temperature sensors to set cooling fan speeds and/or power capping levels in a closed loop fashion, rather than relying solely (or at all) on system inlet ambient temperature.

Abstract: Systems and methods are provided for information handling system thermal control that employ configuration-based temperature feedback, e.g., by using configuration-based fan speed control based on real time individual measured component temperatures. In one example, the disclosed systems and methods may be implemented to allow inputs from one or more hardware temperature sensors to set cooling fan speeds and/or power capping levels in a closed loop fashion, rather than relying solely (or at all) on system inlet ambient temperature.

Abstract: A system and method are provided that comprise a circuit board including one or more processors and a chassis that holds the circuit board. The chassis includes a card receptacle that receives an electronics card. The electronics card comprises a card circuit board having electronic components including one or more processors. The card circuit board has a chassis loading end. A heat sink is provided on the circuit board and thermally coupled to one or more electronic components to dissipate heat therefrom. The heat sink has a three-dimensional envelope having a stepped end profile relative to the chassis loading end. Vent openings are provided in shielding of the electronics card for airflow from the electronics card.

Abstract: In one aspect, a device includes at least one processor, storage, a power supply unit (PSU) interlace which connects to a PSU and receives power from the PSU, and a power module (PM) including a power in interface for receiving power from at least one computer and a power out interface for providing power to at least one computer.

Abstract: An apparatus with deflectable dividers separating peripheral components is disclosed. The apparatus includes a shroud housing coupleable to a circuit board of a computer. In an installed position, the shroud housing facilitates a proper electrical connection between peripheral components and the circuit board. The apparatus also includes at least one deflectable divider that is deflectably mounted to the shroud housing. In the installed position, the at least one deflectable divider is disposed between adjacent peripheral components. The at least one deflectable divider is operably displaced away from a selected peripheral component in a displacement motion by fingers of a user during a component swap operation to allow space for the fingers of the user to grasp the selected peripheral component.

Abstract: A method for managing a fan system in an information handling system (IHS) is disclosed. The method includes providing the fan system comprising a first fan and at least one subsequent fan, wherein the first fan is associated with a first fan speed, the at least one subsequent fan is associated with the at least one subsequent fan speed and the fan system is associated with a system fan speed. The method also includes generating a system fan speed request, adjusting the first fan speed to avoid a critical range when the system fan speed request falls within the critical range, and adjusting the system fan speed to meet the system fan speed request.

Abstract: A method for managing the power consumption of an information handling system including a processor and an associated cooling system. The method may include providing power to the cooling system based on a performance/power balance setting, accepting a user input to adjust the performance/power balance setting, and adjusting the power provided to the cooling system based on the adjusted performance/power balance setting. The performance/power balance setting may define a balance between performance of the processor and power consumption of the associated cooling system.

Abstract: Systems and methods are provided for information handling system thermal control that employ configuration-based temperature feedback, e.g., by using configuration-based fan speed control based on real time individual measured component temperatures. In one example, the disclosed systems and methods may be implemented to allow inputs from one or more hardware temperature sensors to set cooling fan speeds and/or power capping levels in a closed loop fashion, rather than relying solely (or at all) on system inlet ambient temperature.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.

Abstract: Systems and methods for controlling temperature in an information handling system is provided. In certain embodiments, a method may include receiving a desired threshold value, determining if a current real-time system value exceeds the desired threshold value, determining if a power shedding mode is enabled, if the power shedding mode is enabled, adjusting power supplied to the information handling system, and if the power shedding mode is not enabled, dynamically adjusting a fan speed of a cooling fan associated with the information handling system.

Abstract: A method for managing the power consumption of an information handling system including a processor and an associated cooling system. The method may include providing power to the cooling system based on a performance/power balance setting, accepting a user input to adjust the performance/power balance setting, and adjusting the power provided to the cooling system based on the adjusted performance/power balance setting. The performance/power balance setting may define a balance between performance of the processor and power consumption of the associated cooling system.

Abstract: A method for managing the power consumption of an information handling system including a processor and an associated cooling system. The method may include providing power to the cooling system based on a performance/power balance setting, accepting a user input to adjust the performance/power balance setting, and adjusting the power provided to the cooling system based on the adjusted performance/power balance setting. The performance/power balance setting may define a balance between performance of the processor and power consumption of the associated cooling system.

Abstract: A method for managing a fan system in an information handling system (IHS) is disclosed. The method includes providing the fan system comprising a first fan and at least one subsequent fan, wherein the first fan is associated with a first fan speed, the at least one subsequent fan is associated with the at least one subsequent fan speed and the fan system is associated with a system fan speed. The method also includes generating a system fan speed request, adjusting the first fan speed to avoid a critical range when the system fan speed request falls within the critical range, and adjusting the system fan speed to meet the system fan speed request.

Abstract: An information handling system includes a processor, memory coupled to the processor, a cooling fan, and a controller coupled to the processor and configured to control the speed of the cooling fan based on the operation of the memory. The processor is configured to determine a user-selected performance setting for the information handling system; determine a fan speed limit corresponding to the user selected performance setting; limit the speed of the cooling fan based on the determined fan speed limit; and in connection with limiting the speed of the cooling fan, control an operational parameter of the memory to reduce cooling demands generated by the memory.