Abstract: A method, system and apparatus for testing an integrated circuit chip. The system including: means for forming a liquid polyalphaolefine layer on a bottom surface of the integrated circuit chip, a top surface of the integrated circuit chip having and a bottom surface not having signal and power pads; means for placing a surface of a heat sink into physical contact with the bottom surface of the polyalphaolefine layer; means for electrically coupling the integrated circuit chip to a tester; means for electrically testing the integrated circuit chip; means for electrically de-coupling the integrated circuit chip from the tester; means for removing the heat sink from contact with the polyalphaolefine layer, all or a portion of the polyalphaolefine layer remaining on the bottom surface of the integrated circuit chip; and means for removing the polyalphaolefine layer from the bottom surface of the integrated circuit chip.

Abstract: A method, system and apparatus for testing an electronic device. The method including: (a) forming a temporary liquid heat transfer layer on a surface of the electronic device; after step (a), (b) placing a surface of a heat sink into physical contact with a surface of the heat transfer layer; after step (b), (c) electrically testing the electronic device; after step (c), (d) removing the heat sink from contact with the heat transfer layer; and after step (d), (e) removing any heat transfer layer remaining on the electronic device from the surface of the electronic device.