Abstract: A set of calibration/reference standard components are used to calibrate and/or validate the calibration of a material analyzer of the type that has a measurement region and measurement apparatus for measuring properties of a material specimen occupying a given portion of the measurement region. The analyzer is calibrated or the calibration is validated by taking measurements while a calibration/reference standard of known chemical composition is disposed within the measurement region of the analyzer to simulate the occupancy of the given portion of the measurement region by the material specimen. The set includes elongated calibration/reference standard components that are individually packaged in a hard shell for being so combined with each other in the measurement region as to simulate the occupancy within the given portion of the measurement region by the material specimen, and are further individually packaged for unaided handling of individual components by one or two persons.

Abstract: According to the present invention, a material handling system for transporting a device to or from a radiation chamber in which the device is inspected is provided. The system includes a shuttle carriage having a base and two opposing walls, a conveyor mounted between the two opposing walls of the shuttle carriage, and means for moving the shuttle carriage along a path between a loading position and an unloading position. The system also includes a housing that encloses the shuttle carriage and the moving means. The housing has an internal cavity that is fitted to the two opposing walls. The housing also has a first opening coincident with the loading position and a second opening coincident with the unloading position. Further, a drive mechanism is provided for extending the conveyor partially through the first opening and the second opening.

Abstract: A method and apparatus for measuring structural characteristics of a manufactured circuit board containing solder joints by automated real-time digital X-ray radiographic inspection techniques. A circuit board under examination is automatically positioned by a digitally controlled multi-axis positioning system between an electronic X-ray source and an electronic X-ray imaging system. X-rays, in a beam of X-rays from the X-ray source, are directed towards the circuit board. The X-rays are absorbed, scattered and transmitted through the circuit board. The X-rays transmitted through the circuit board are directed upon the X-ray imaging system. The X-ray imaging system converts the transmitted X-rays into digital images which represent the radiographic density of the portion of the circuit board under examination. The digital images are stored within a digital image processor.

Abstract: A method and apparatus for measuring structural characteristics of a manufactured circuit board containing solder joints by automated real-time digital X-ray radiographic inspection techniques. A circuit board under examination is automatically positioned by a digitally controlled multi-axis positioning system between an electronic X-ray source and an electronic X-ray imaging system, X-rays, in a beam of X-rays from the X-ray source, are directed towards the circuit board. The X-rays are absorbed, scattered and transmitted through the circuit board. The X-rays transmitted through the circuit board are directed upon the X-ray imaging system. The X-ray imaging system converts the transmitted X-rays into digital images which represent the radiographic density of the portion of the circuit board under examination. The digital images are stored within a digital image processor.