Patents by Inventor Paul B. Jaynes

Paul B. Jaynes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating non-planar circuit board
    Patent number: 8161633
    Abstract: A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: April 24, 2012
    Assignee: Harris Corporation
    Inventors: Lawrence W. Shacklette, Louis J. Rendek, Paul B. Jaynes, Philip A. Marvin
  • Method and apparatus for sealing flex circuits made with an LCP substrate
    Patent number: 7768619
    Abstract: A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: August 3, 2010
    Assignee: Harris Corporation
    Inventors: C. W. Sinjin Smith, Charles M. Newton, Paul B. Jaynes
  • Apparatus for sealing flex circuits having heat sensitive circuit elements
    Patent number: 7591924
    Abstract: A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
    Type: Grant
    Filed: August 8, 2006
    Date of Patent: September 22, 2009
    Assignee: Harris Corporation
    Inventors: C. W. Sinjin Smith, Charles M. Newton, Paul B. Jaynes
  • Non-Planar Circuit Board and a Method for Fabricating the Same
    Publication number: 20080244898
    Abstract: A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.
    Type: Application
    Filed: April 3, 2007
    Publication date: October 9, 2008
    Applicant: HARRIS CORPORATION
    Inventors: Lawrence W. Shacklette, Louis J. Rendek, Paul B. Jaynes, Philip A. Marvin
  • Method of constructing a structural circuit
    Patent number: 7343675
    Abstract: A method relating to a multi-functional, structural circuit, referred to as a structural circuit, is disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: March 18, 2008
    Assignee: Harris Corporation
    Inventors: C. W. Sinjin Smith, Paul B. Jaynes, Charles J. Newton, Travis L. Kerby
  • Method and apparatus for sealing flex circuits having heat sensitive circuit elements
    Patent number: 7128801
    Abstract: A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: October 31, 2006
    Assignee: Harris Corporation
    Inventors: C. W. Sinjin Smith, Charles M. Newton, Paul B. Jaynes