Patents by Inventor Paul B. Jones

Paul B. Jones has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5246884
    Abstract: Metallized semiconductor chips, such as are intended for VLSI, are coated with a first layer of SiO2 followed by a second layer of CVD diamond or DLC as an etch stop. The resulting structure is reproducibly and controllably planarized using a chem-mech slurry and an appropriate polishing pad, enabling subsequent layers to be built up similarly.
    Type: Grant
    Filed: October 30, 1991
    Date of Patent: September 21, 1993
    Assignee: International Business Machines Corporation
    Inventors: Mark A. Jaso, Paul B. Jones, Bernard S. Meyerson, Vishnubhai V. Patel