Patents by Inventor Paul Bantz

Paul Bantz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sheet-molded chip-scale package
    Patent number: 8487435
    Abstract: Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having a first surface and a second surface opposite the first surface, a conductive pillar formed on the first surface of the die, and an encapsulant material encasing the die, including covering the first surface, the second surface, and at least a portion of a side surface of the conductive pillar. Methods for making the same also are described.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: July 16, 2013
    Assignee: TriQuint Semiconductor, Inc.
    Inventors: Frank J. Juskey, Paul Bantz, Otto Berger
  • SHEET-MOLDED CHIP-SCALE PACKAGE
    Publication number: 20120080768
    Abstract: Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having a first surface and a second surface opposite the first surface, a conductive pillar formed on the first surface of the die, and an encapsulant material encasing the die, including covering the first surface, the second surface, and at least a portion of a side surface of the conductive pillar. Methods for making the same also are described.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 5, 2012
    Applicant: TRIQUINT SEMICONDUCTOR, INC.
    Inventors: Frank J. Juskey, Paul Bantz, Otto Berger