Abstract: Provided herein are devices and methods for isolation and detection of an analyte from a sample. In some embodiments, provided herein are devices and methods of use thereof for vertical flow-based isolation and detection of analytes in a liquid sample, such as a urine sample.

Abstract: A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.

Abstract: A system, method and computer program product for performing detailed planning functions for businesses, enterprises and other types of organizations. According to an embodiment, the system comprises a graphical user interface configured to allow a user to define calculations based on data associated with an entity that may have scalar attributes for each entity, and/or a time series, and execution of the defined calculation generates time series result. According to another aspect, a calculation definition may be configured to be adjustable allowing a user to adjust parameter value(s) for each entity associated with the calculation definition. According to another aspect, a calculation definition may be configured to be discretionary allowing a user to attach or assign a calculation to each entity individually. According to another aspect, multiple calculations may be created and have the same name.

Abstract: According to various aspects and embodiments, a support structure for packaging an electronic device is provided. In one example, a packaged electronic device includes a substrate, at least one electronic device disposed on the substrate, an encapsulation structure disposed on the substrate and having a wall that forms a perimeter around the at least one electronic device, and at least one support structure formed from a photosensitive polymer and disposed adjacent the wall of the encapsulation structure. The at least one support structure has a configuration that provides at least one of increased adhesion and mechanical strength to the encapsulation structure.

Abstract: A sizer tooth assembly for a mineral sizer is described. The tooth assembly includes a horn protrusion extending from a rotatable support, the horn protrusion having a pair of opposed front and rear faces; and a shell structure encapsulating the horn protrusion and defining the outer shape of the sizer tooth; wherein the shell structure comprises exactly two cover formations which are non-releasably secured to one another but not to the horn protrusion, to define when so secured a unitary tooth assembly. Each of the two cover formations seats upon and presents an inward engagement face to a respective one of the pair of opposed front and rear faces of the horn protrusion; and each such engagement face of a cover formation and its corresponding face of the horn protrusion are provided with a complementary arrangement of projections and recesses configured such that when the two cover formations are non-releasably secured to one another the shell structure is releasably connected upon the horn protrusion.

Abstract: A method of forming a bonding element including a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value, and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

Abstract: A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.

Abstract: A method of forming a bonding element including a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value, and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

Abstract: A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.

Abstract: A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

Abstract: According to various aspects and embodiments, a support structure for packaging an electronic device is provided. In one example, a packaged electronic device includes a substrate, at least one electronic device disposed on the substrate, an encapsulation structure disposed on the substrate and having a wall that forms a perimeter around the at least one electronic device, and at least one support structure formed from a photosensitive polymer and disposed adjacent the wall of the encapsulation structure. The at least one support structure has a configuration that provides at least one of increased adhesion and mechanical strength to the encapsulation structure.

Abstract: According to various aspects and embodiments, a support structure for packaging an electronic device is provided. In one example, a packaged electronic device includes a substrate, at least one electronic device disposed on the substrate, an encapsulation structure disposed on the substrate and having a wall that forms a perimeter around the at least one electronic device, and at least one support structure formed from a photosensitive polymer and disposed adjacent the wall of the encapsulation structure. The at least one support structure has a configuration that provides at least one of increased adhesion and mechanical strength to the encapsulation structure.

Abstract: A sizer tooth assembly for a mineral sizer is described. The tooth assembly includes a horn protrusion extending from a rotatable support, the horn protrusion having a pair of opposed front and rear faces; and a shell structure encapsulating the horn protrusion and defining the outer shape of the sizer tooth; wherein the shell structure comprises exactly two cover formations which are non-releasably secured to one another but not to the horn protrusion, to define when so secured a unitary tooth assembly. Each of the two cover formations seats upon and presents an inward engagement face to a respective one of the pair of opposed front and rear faces of the horn protrusion; and each such engagement face of a cover formation and its corresponding face of the horn protrusion are provided with a complementary arrangement of projections and recesses configured such that when the two cover formations are non-releasably secured to one another the shell structure is releasably connected upon the horn protrusion.

Abstract: A system, method and computer program product for performing detailed planning functions for businesses, enterprises and other types of organizations. According to an embodiment, the system comprises a graphical user interface configured to allow a user to define calculations based on data associated with an entity that may have scalar attributes for each entity, and/or a time series, and execution of the defined calculation generates time series result. According to another aspect, a calculation definition may be configured to be adjustable allowing a user to adjust parameter value(s) for each entity associated with the calculation definition. According to another aspect, a calculation definition may be configured to be discretionary allowing a user to attach or assign a calculation to each entity individually. According to another aspect, multiple calculations may be created and have the same name.

Abstract: According to various aspects and embodiments, a support structure for packaging an electronic device is provided. In one example, a packaged electronic device includes a substrate, at least one electronic device disposed on the substrate, an encapsulation structure disposed on the substrate and having a wall that forms a perimeter around the at least one electronic device, and at least one support structure formed from a photosensitive polymer and disposed adjacent the wall of the encapsulation structure. The at least one support structure has a configuration that provides at least one of increased adhesion and mechanical strength to the encapsulation structure.

Abstract: A system and method for packaging an electronic device are provided. The packaged electronic device may include a structure material having one portion with a first lateral cross-section, and at least one other portion with a second lateral cross-section, where at least one of a dimension and a shape of the second lateral cross-section is different than in the first lateral cross-section.

Abstract: According to various aspects and embodiments, a system and method for forming a packaged electronic device is disclosed. One example of the method comprises treating a surface of a first substrate to create a first surface having a low bond strength, at least a portion of the first surface defined by at least one three-dimensional structure and a layer of optical masking material, depositing a layer of structure material onto at least a portion of the first surface, bonding a second substrate to at least a portion of the layer of structure material, and separating the first substrate from the second substrate along the first surface.

Abstract: A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

Abstract: A mineral breaker is described having a breaker unit (1) with at least one rotary drive shaft (15), a rotary electric motor (13), and a drive gear box (17). The breaker unit drive shaft is coupled for rotation to an output shaft of the drive gear box, the rotary electric motor is coupled to rotatably drive an input shaft of the main drive gear box. The rotary electric motor is a switched reluctance motor.

Abstract: An imaging module for data collection devices, such as bar code scanners. The module includes an aiming or illumination light source or sources, seated on a support is mounted in a housing. The support is fixed in the housing to provide for its precise placement therein, in a predetermined position.