Abstract: To achieve multiple benefits, a high speed computing system is configured in a hierarchical manner with flexibility and re-configurability concerns maximized. This begins with a particular cabinet architecture which is specifically designed to accommodate various needs and considerations. The cabinet or rack is designed to receive various chassis assemblies depending on the particular needs and or functions involved. These may include a compute chassis, a switch chassis, or a rectifier chassis, which can be incorporated into the cabinet. Within each chassis, specific components are then inserted, with each of these components being in a subsystem configuration. For example, the compute chassis is specifically designed to receive a number of compute blades. Similarly, the switch chassis is designed to receive a number of switch blades. Lastly, the rectifier chassis is configured to receive a number of rectifiers.

Abstract: To achieve multiple benefits, a high speed computing system is configured in a hierarchical manner with flexibility and re-configurability concerns maximized. This begins with a particular cabinet architecture which is specifically designed to accommodate various needs and considerations. The cabinet or rack is designed to receive various chassis assemblies depending on the particular needs and or functions involved. These may include a compute chassis, a switch chassis, or a rectifier chassis, which can be incorporated into the cabinet. Within each chassis, specific components are then inserted, with each of these components being in a subsystem configuration. For example, the compute chassis is specifically designed to receive a number of compute blades. Similarly, the switch chassis is designed to receive a number of switch blades. Lastly, the rectifier chassis is configured to receive a number of rectifiers.

Abstract: An example electronic assembly includes a substrate that has a first surface and a second surface. The first surface of the substrate includes a grounding ring. The electronic assembly further includes one or more electronic components that are mounted on the first surface of the substrate such that the grounding ring at least partially surrounds the electronic components(s). A heat sink engages the electronic component(s) and the grounding ring in order provide cooling and EMI shielding to the electronic components(s). In some embodiments, the grounding ring surrounds the entire electronic components(s) and the heat sink engages the entire grounding ring, although in other embodiments, the grounding ring may partially surround the electronic components(s) and/or the heat sink may engage just a portion of the grounding ring.

Abstract: The electronic assembly includes a substrate that has a first side and a second side. The electronic assembly further includes first and second electronic components that are mounted on the first side of the substrate. The first electronic component extends a different height above the first side of the substrate as the second electronic component. The electronic assembly further includes a heat sink that includes a base and fins which extend from the base. The base of the heat sink includes a formation which engages the second electronic component in order to maintain the base of the heat sink in substantially parallel relation to the substrate. In some embodiments, the formation in the base of the heat sink is a detent, while in other embodiments the formation in the base of the heat sink is a projection.

Abstract: This invention relates to computer systems and hardware, and in particular to a radial computer system, hardware for building a radial computer system and a method for building a radial computer system. According to one aspect of the invention, a clustering concept for a scalable computer system includes computer elements aligned by a joiner into an arc shaped configuration. The radial configuration of the cluster and associated hardware provide a computer system that reduces high speed cable lengths, provides additional connection points for the increased number of cable connections, provides electromagnetic interference shielding, and provides additional space for cooling hardware. These features result in an improved scalable computer system.