Patents by Inventor Paul Brian Hafeli

Paul Brian Hafeli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for securing a semiconductor device to a printed circuit board
    Patent number: 8531821
    Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: September 10, 2013
    Assignee: Raytheon Company
    Inventors: Eli Holzman, Paul Brian Hafeli, Robert Michael Sterns
  • SYSTEM AND METHOD FOR SECURING A SEMICONDUCTOR DEVICE TO A PRINTED WIRE BOARD
    Publication number: 20120195015
    Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 2, 2012
    Applicant: RAYTHEON COMPANY
    Inventors: Eli Holzman, Paul Brian Hafeli, Robert Michael Sterns