Abstract: Disclosed are methods of forming alternating phase shift circuitry fabrication masks, methods of forming circuitry fabrication masks having a subtractive alternating phase shift region, and alternating phase shift masks. In one implementation, a method of forming an alternating phase shift circuitry fabrication mask incudes combining circuitry pattern data biasing and wet undercut etching of light transmissive substrate material adjacent phase shift regions of the mask in fabricating the mask. In one implementation, a method of forming an alternating phase shift circuitry fabrication mask includes combining circuitry pattern data biasing and wet undercut etching of light transmissive substrate material adjacent phase shift regions of the mask effective to achieve a first data biased pattern when using the mask to fabricate circuitry of a desired circuit pattern on another substrate.

Abstract: A method and apparatus evaluates the runability of a photomask inspection tool that inspects plural sets of die, each die having a standard simulated industrial device feature at plural technology nodes. A technology node size is determined for each feature at which inspection by the tool provides no false detection of faults. A sensitivity module included on a photomask test plate along with a runability module allows determination of inspection tool sensitivity and runability in a single test sequence.

Abstract: A method and apparatus evaluates the runability of a photomask inspection tool that inspects plural sets of die, each die having a standard simulated industrial device feature at plural technology nodes. A technology node size is determined for each feature at which inspection by the tool provides no false detection of faults. A sensitivity module included on a photomask test plate along with a runability module allows determination of inspection tool sensitivity and runability in a single test sequence.