Patents by Inventor Paul Choiniere

Paul Choiniere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944172
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: April 2, 2024
    Assignee: Apple Inc.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20240098167
    Abstract: Electronic devices may be provided with components such as displays and cameras. A display may be mounted in a housing. The housing may have a sidewall. A bent portion of the display may be embedded in epoxy that is separated from the sidewall by an air gap. Adhesive may attach the epoxy to the housing. A metal support that is chemically bonded to the epoxy may be welded to metal structures such as camera brackets and other metal supports. The housing may have a glass layer that forms a rear wall. The glass layer may have a protruding portion that forms a glass plateau with openings through which cameras operates. A camera may have a protruding portion that is received within one of the glass plateau openings. The protruding portion may extend into a metal camera trim in one of the openings that is attached to the glass plateau.
    Type: Application
    Filed: August 3, 2023
    Publication date: March 21, 2024
    Inventors: Lee E Hooton, Jia Liu, Paul Choiniere, Daniel W Jarvis
  • Publication number: 20230301408
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 28, 2023
    Applicant: APPLE INC.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 11690428
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: July 4, 2023
    Assignee: APPLE INC.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20220161112
    Abstract: A system and method for playing a flying disc game is disclosed. A goal post having a vertical orientation includes a pop-up piston upon which an object can be placed in an armed position is disclosed. The goal post includes a target that when struck by a flying disc ejects the object into the air. A method of playing a flying disc game with such a goal post is further disclosed.
    Type: Application
    Filed: November 22, 2021
    Publication date: May 26, 2022
    Inventors: Clinton Bierman, Paul Choiniere
  • Publication number: 20210274273
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: May 3, 2021
    Publication date: September 2, 2021
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 11026011
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: June 1, 2021
    Assignee: Apple Inc.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 11026010
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: June 1, 2021
    Assignee: APPLE INC.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20210152912
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: December 22, 2020
    Publication date: May 20, 2021
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 10904652
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: January 26, 2021
    Assignee: Apple Inc.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 10880630
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: December 29, 2020
    Assignee: Apple Inc.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20200288229
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: May 22, 2020
    Publication date: September 10, 2020
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20200275184
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: May 8, 2020
    Publication date: August 27, 2020
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 10688624
    Abstract: A composite material is disclosed which includes a plastic layer formed on a layer of metal. The metal layer includes pores into which an adhesive is introduced. The plastic layer is injection molded onto the metal layer so as to contact the adhesive in the pores. The plastic layer is thus bonded to the metal layer.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: June 23, 2020
    Assignee: APPLE INC.
    Inventors: James R. Krogdahl, Derek C. Krass, Paul Choiniere
  • Patent number: 10681446
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: June 9, 2020
    Assignee: Apple Inc.
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Patent number: 10645808
    Abstract: Dielectric such as polyether ether ketone may be used in forming radio-frequency flexible printed circuits. Filler may be incorporated into the dielectric to adjust the coefficient of thermal expansion of the flexible printed circuit. One or more layers of the flexible printed circuit may be unfilled and one or more layers of the flexible printed circuit may be filled. Antennas may be formed from metal traces on the flexible printed circuit, metal electronic device housing structures, or other conductive structures. A transmission line on the flexible printed circuit may couple radio-frequency transceiver circuitry in an electronic device to an antenna. A flexible printed circuit may have a portion with enhanced bendability in a location that overlaps a bend region. The enhanced bendability region may have less filler than other portions of the flexible printed circuit.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: May 5, 2020
    Assignee: Apple Inc.
    Inventors: Kevin M. Froese, Qian Zhang, Paul Choiniere, Derek C. Krass
  • Patent number: 10508350
    Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: December 17, 2019
    Assignee: Apple Inc.
    Inventors: Ken Silverman, Ronald Moller, Peter Russell-Clarke, Christopher D. Prest, Rimple Bhatia, Paul Choiniere, Lucy Elizabeth Browning, Masashige Tatebe
  • Publication number: 20190289382
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: June 4, 2019
    Publication date: September 19, 2019
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20190289383
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: June 4, 2019
    Publication date: September 19, 2019
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
  • Publication number: 20190289381
    Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.
    Type: Application
    Filed: June 4, 2019
    Publication date: September 19, 2019
    Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh