Patents by Inventor Paul Choiniere
Paul Choiniere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11944172Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: GrantFiled: May 3, 2021Date of Patent: April 2, 2024Assignee: Apple Inc.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Publication number: 20240098167Abstract: Electronic devices may be provided with components such as displays and cameras. A display may be mounted in a housing. The housing may have a sidewall. A bent portion of the display may be embedded in epoxy that is separated from the sidewall by an air gap. Adhesive may attach the epoxy to the housing. A metal support that is chemically bonded to the epoxy may be welded to metal structures such as camera brackets and other metal supports. The housing may have a glass layer that forms a rear wall. The glass layer may have a protruding portion that forms a glass plateau with openings through which cameras operates. A camera may have a protruding portion that is received within one of the glass plateau openings. The protruding portion may extend into a metal camera trim in one of the openings that is attached to the glass plateau.Type: ApplicationFiled: August 3, 2023Publication date: March 21, 2024Inventors: Lee E Hooton, Jia Liu, Paul Choiniere, Daniel W Jarvis
-
Publication number: 20230301408Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: May 15, 2023Publication date: September 28, 2023Applicant: APPLE INC.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Patent number: 11690428Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: GrantFiled: December 22, 2020Date of Patent: July 4, 2023Assignee: APPLE INC.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Publication number: 20220161112Abstract: A system and method for playing a flying disc game is disclosed. A goal post having a vertical orientation includes a pop-up piston upon which an object can be placed in an armed position is disclosed. The goal post includes a target that when struck by a flying disc ejects the object into the air. A method of playing a flying disc game with such a goal post is further disclosed.Type: ApplicationFiled: November 22, 2021Publication date: May 26, 2022Inventors: Clinton Bierman, Paul Choiniere
-
Publication number: 20210274273Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: May 3, 2021Publication date: September 2, 2021Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Patent number: 11026011Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: GrantFiled: May 22, 2020Date of Patent: June 1, 2021Assignee: Apple Inc.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Patent number: 11026010Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: GrantFiled: May 8, 2020Date of Patent: June 1, 2021Assignee: APPLE INC.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Publication number: 20210152912Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: December 22, 2020Publication date: May 20, 2021Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Patent number: 10904652Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: GrantFiled: June 4, 2019Date of Patent: January 26, 2021Assignee: Apple Inc.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Patent number: 10880630Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: GrantFiled: June 4, 2019Date of Patent: December 29, 2020Assignee: Apple Inc.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Publication number: 20200288229Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: May 22, 2020Publication date: September 10, 2020Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Publication number: 20200275184Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: May 8, 2020Publication date: August 27, 2020Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Patent number: 10688624Abstract: A composite material is disclosed which includes a plastic layer formed on a layer of metal. The metal layer includes pores into which an adhesive is introduced. The plastic layer is injection molded onto the metal layer so as to contact the adhesive in the pores. The plastic layer is thus bonded to the metal layer.Type: GrantFiled: September 15, 2016Date of Patent: June 23, 2020Assignee: APPLE INC.Inventors: James R. Krogdahl, Derek C. Krass, Paul Choiniere
-
Patent number: 10681446Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: GrantFiled: June 4, 2019Date of Patent: June 9, 2020Assignee: Apple Inc.Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Patent number: 10645808Abstract: Dielectric such as polyether ether ketone may be used in forming radio-frequency flexible printed circuits. Filler may be incorporated into the dielectric to adjust the coefficient of thermal expansion of the flexible printed circuit. One or more layers of the flexible printed circuit may be unfilled and one or more layers of the flexible printed circuit may be filled. Antennas may be formed from metal traces on the flexible printed circuit, metal electronic device housing structures, or other conductive structures. A transmission line on the flexible printed circuit may couple radio-frequency transceiver circuitry in an electronic device to an antenna. A flexible printed circuit may have a portion with enhanced bendability in a location that overlaps a bend region. The enhanced bendability region may have less filler than other portions of the flexible printed circuit.Type: GrantFiled: December 6, 2018Date of Patent: May 5, 2020Assignee: Apple Inc.Inventors: Kevin M. Froese, Qian Zhang, Paul Choiniere, Derek C. Krass
-
Patent number: 10508350Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.Type: GrantFiled: June 17, 2015Date of Patent: December 17, 2019Assignee: Apple Inc.Inventors: Ken Silverman, Ronald Moller, Peter Russell-Clarke, Christopher D. Prest, Rimple Bhatia, Paul Choiniere, Lucy Elizabeth Browning, Masashige Tatebe
-
Publication number: 20190289382Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: June 4, 2019Publication date: September 19, 2019Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Publication number: 20190289383Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: June 4, 2019Publication date: September 19, 2019Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh
-
Publication number: 20190289381Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.Type: ApplicationFiled: June 4, 2019Publication date: September 19, 2019Inventors: Arun D. Chawan, Kurt Stiehl, Benjamin A. Cousins, Jonathan S. Aase, Yacine Azmi, Paul Choiniere, Scott W. Slabaugh