Abstract: Offline metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

Abstract: A retainment assembly that includes a proximal retainer member that is movable between a first retracted position, a second retracted position and a deployed position, a distal retainer member that is movable between a retracted position and a deployed position. When the proximal retainer member moves from the deployed position to the first retracted position the distal retainer member does not move, and when the proximal retainer member moves from the deployed position to the second retracted position the distal retainer member moves from the deployed position to the retracted position.

Abstract: Offline metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

Abstract: A retainment assembly that includes a proximal retainer member that is movable between a first retracted position, a second retracted position and a deployed position, a distal retainer member that is movable between a retracted position and a deployed position. When the proximal retainer member moves from the deployed position to the first retracted position the distal retainer member does not move, and when the proximal retainer member moves from the deployed position to the second retracted position the distal retainer member moves from the deployed position to the retracted position.

Abstract: A container extraction assembly that includes an extractor assembly and a retainer assembly. The extractor assembly includes a pull member and an extractor member. The extractor member is movable between a distal position and a proximal position and the pull member is movable between first, second third positions. Moving the pull member from the first position to the third position moves the extractor member from the distal to the proximal position. The retainer assembly includes a proximal leg member and a distal leg member that are hingedly connected to one another. The retainer assembly is movable between a deployed position, a folded position and a finish position. Moving the pull member from the first position to the second position moves the retainer assembly from the deployed to the folded position, and moving the pull member from the second position to the third position moves the retainer assembly from the folded to the finish position.

Abstract: A container extraction assembly that includes an extractor assembly and a retainer assembly. The extractor assembly includes a pull member and an extractor member. The extractor member is movable between a distal position and a proximal position and the pull member is movable between first, second third positions. Moving the pull member from the first position to the third position moves the extractor member from the distal to the proximal position. The retainer assembly includes a proximal leg member and a distal leg member that are hingedly connected to one another. The retainer assembly is movable between a deployed position, a folded position and a finish position. Moving the pull member from the first position to the second position moves the retainer assembly from the deployed to the folded position, and moving the pull member from the second position to the third position moves the retainer assembly from the folded to the finish position.

Abstract: Offline metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

Abstract: Embodiments of the present disclosure relate generally to improved braking systems for slide extractors. Slide extractors are generally used in aircraft galleys in order to move containers forward. The disclosed slide extractor braking system provides cooperation between magnets and corresponding conductive material in order to manage and appropriately slow retraction of the slide extractor in use.

Abstract: Sample stage, e.g. for use in a scanning electron microscope. The sample stage includes a base, a sample carrier, and an actuator assembly arranged for moving the sample carrier in at least one direction substantially parallel to the base. The actuator assembly is arranged so as not to contribute to the mechanical stiffness of the sample stage from the sample carrier to the base.

Abstract: Method of providing a boron doped region (8, 8a, 8b) in a silicon substrate (1), includes the steps of: (a) depositing a boron doping source (6) over a first surface (2) of the substrate (1); (b) annealing the substrate (1) for diffusing boron from the boron doping source (6) into the first surface (2), thereby yielding a boron doped region; (c) removing the boron doping source (6) from at least part of the first surface (2); (d) depositing undoped silicon oxide (10) over the first surface (2); and (e) annealing the substrate (1) for lowering a peak concentration of boron in the boron doped region (8, 8a) through boron absorption by the undoped silicon oxide. The silicon oxide (10) acts as a boron absorber to obtain the desired concentration of the boron doped region (8).

Abstract: Offline metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

Abstract: Sample stage, e.g. for use in a scanning electron microscope. The sample stage includes a base, a sample carrier, and an actuator assembly arranged for moving the sample carrier in at least one direction substantially parallel to the base. The actuator assembly is arranged so as not to contribute to the mechanical stiffness of the sample stage from the sample carrier to the base.

Abstract: Embodiments of the present disclosure relate generally to improved braking systems for slide extractors. Slide extractors are generally used in aircraft galleys in order to move containers forward. The disclosed slide extractor braking system provides cooperation between magnets and corresponding conductive material in order to manage and appropriately slow retraction of the slide extractor in use.

Abstract: A method including: providing a reference substrate with a first mark pattern; providing the reference substrate with a first resist layer on the reference substrate, wherein the first resist layer has a minimal radiation dose needed for development of the first resist; using a reference patterning device to impart a radiation beam with a second mark pattern in its cross-section to form a patterned radiation beam; and exposing a target portion of the first resist layer of the reference substrate n times to said patterned radiation beam to create exposed areas in the target portion of the first resist layer in accordance with the second mark pattern that have been subjected to an accumulated radiation dose above the minimal radiation dose of the first resist layer, wherein n is an integer with a value of at least two.

Abstract: A method including: providing a reference substrate with a first mark pattern; providing the reference substrate with a first resist layer on the reference substrate, wherein the first resist layer has a minimal radiation dose needed for development of the first resist; using a reference patterning device to impart a radiation beam with a second mark pattern in its cross-section to form a patterned radiation beam; and exposing a target portion of the first resist layer of the reference substrate n times to said patterned radiation beam to create exposed areas in the target portion of the first resist layer in accordance with the second mark pattern that have been subjected to an accumulated radiation dose above the minimal radiation dose of the first resist layer, wherein n is an integer with a value of at least two.

Abstract: Sample stage, e.g. for use in a scanning electron microscope. The sample stage includes a base, a sample carrier, and an actuator assembly arranged for moving the sample carrier in at least one direction substantially parallel to the base. The actuator assembly is arranged so as not to contribute to the mechanical stiffness of the sample stage from the sample carrier to the base.

Abstract: Metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.

Abstract: Embodiments of the present invention provide a laminated glass surface for an aircraft or other passenger transportation vehicle surface. Specific features may include a glass substrate that is associated with an adhesive layer to form a laminated glass. The glass substrate may be an ultrathin glass substrate and/or a strengthened glass substrate. The laminated glass may then be secured to an aircraft surface.

Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.

Abstract: A method of calculating process corrections for a lithographic tool, and associated apparatuses. The method comprises measuring process defect data on a substrate that has been previously exposed using the lithographic tool; fitting a process signature model to the measured process defect data, so as to obtain a model of the process signature for the lithographic tool; and using the process signature model to calculate the process corrections for the lithographic tool.