Patents by Inventor Paul D. Butterfield
Paul D. Butterfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6988942Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.Type: GrantFiled: July 20, 2004Date of Patent: January 24, 2006Assignee: Applied Materials Inc.Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai
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Patent number: 6977036Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.Type: GrantFiled: May 3, 2004Date of Patent: December 20, 2005Assignee: Applied Materials, Inc.Inventors: Ralph Wadensweiler, Alain Duboust, Liang-Yuh Chen, Manoocher Birang, Ratson Morad, Paul D. Butterfield
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Patent number: 6962524Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.Type: GrantFiled: August 15, 2003Date of Patent: November 8, 2005Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust
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Patent number: 6884153Abstract: A method and apparatus for electrically biasing a substrate in an electrochemical processing system is generally provided. In one embodiment, an apparatus for electrochemical processing includes a polishing pad and a conductive element disposed therein. The polishing pad has an upper surface adapted to support a substrate thereon during processing. The conductive element disposed in the polishing pad is movable between a first position having at least a portion of the conductive element exposed above the upper surface and a second position below the upper surface, wherein the conductive element is magnetically biased towards the first position.Type: GrantFiled: May 23, 2003Date of Patent: April 26, 2005Assignee: Applied Materials, Inc.Inventors: Antoine P. Manens, Paul D. Butterfield
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Patent number: 6841057Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.Type: GrantFiled: March 13, 2002Date of Patent: January 11, 2005Assignee: Applied Materials Inc.Inventors: Ralph Wadensweiler, Alain Duboust, Liang-Yuh Chen, Manoocher Birang, Ratson Morad, Paul D. Butterfield
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Publication number: 20040266327Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.Type: ApplicationFiled: July 20, 2004Publication date: December 30, 2004Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai
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Publication number: 20040200733Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.Type: ApplicationFiled: May 3, 2004Publication date: October 14, 2004Applicant: Applied Materials, Inc.Inventors: Ralph Wadensweiler, Alain Duboust, Liang-Yuh Chen, Manoocher Birang, Ratson Morad, Paul D. Butterfield
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Publication number: 20040134792Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.Type: ApplicationFiled: June 26, 2003Publication date: July 15, 2004Applicant: Applied Materials, Inc.Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler
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Publication number: 20040082289Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.Type: ApplicationFiled: August 15, 2003Publication date: April 29, 2004Inventors: Paul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler, Lizhong Sun, Siew S. Neo, Alain Duboust
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Publication number: 20040053499Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.Type: ApplicationFiled: June 26, 2003Publication date: March 18, 2004Applicant: Applied Materials, Inc.Inventors: Feng Q. Liu, Liang-Yuh Chen, Stan D. Tsai, Alain Duboust, Siew S. Neo, Yongqi Hu, Yan Wang, Paul D. Butterfield
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Publication number: 20040023610Abstract: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.Type: ApplicationFiled: June 6, 2003Publication date: February 5, 2004Applicant: Applied Materials, Inc.Inventors: Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens, Siew S. Neo, Stan D. Tsai, Liang-Yuh Chen, Paul D. Butterfield, Yuan A. Tian, Sen-Hou Ko
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Patent number: 6679755Abstract: A processing system and method for processing a workpiece is generally provided. In one embodiment, the system includes a processing module and a substrate transfer shuttle. The processing module includes a polishing surface and at least one polishing head disposed above the polishing surface. The substrate transfer shuttle is movable between at least a first position and a second position where the second position is disposed adjacent the polishing head. At least one nest is disposed therein to receive and align the substrate. The nest also facilitates transfer of the workpiece to the processing head.Type: GrantFiled: November 22, 2000Date of Patent: January 20, 2004Assignee: Applied Materials Inc.Inventors: Phillip R. Sommer, Paul D. Butterfield, Joshua T. Oen, Ching-Ling Meng
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Publication number: 20030220053Abstract: A method and apparatus for electrically biasing a substrate in an electrochemical processing system is generally provided. In one embodiment, an apparatus for electrochemical processing includes a polishing pad and a conductive element disposed therein. The polishing pad has an upper surface adapted to support a substrate thereon during processing. The conductive element disposed in the polishing pad is movable between a first position having at least a portion of the conductive element exposed above the upper surface and a second position below the upper surface, wherein the conductive element is magnetically biased towards the first position.Type: ApplicationFiled: May 23, 2003Publication date: November 27, 2003Applicant: Applied Materials, Inc.Inventors: Antoine P. Manens, Paul D. Butterfield
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Publication number: 20030213703Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a pad assembly having a conductive pad, a backing and a conductive layer adapted to be biased by a power source. In another embodiment, an apparatus for polishing a substrate includes a pad assembly disposed in a basin. The basin has two electrodes coupled to opposite poles of a power source. Each electrode extends partially through a respective aperture formed in the pad assembly. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.Type: ApplicationFiled: May 16, 2002Publication date: November 20, 2003Applicant: Applied Materials, Inc.Inventors: Yan Wang, Feng Q. Liu, Yongqi Hu, Alain Duboust, Liang-Yuh Chen, Paul D. Butterfield, Ralph M. Wadensweiler
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Patent number: 6645050Abstract: Generally, a method and apparatus for retaining a substrate is provided. In one embodiment, a carrier for retaining a substrate comprises a carrier plate having a lower surface, at least one first fluid outlet and a second fluid outlet. The first fluid outlet is fluidly coupled to the lower surface of the carrier plate. The second fluid outlet is fluidly coupled to the lower surface of the carrier plate. A first fluid circuit is coupled to the first fluid outlet and is adapted to flow a fluid forms a fluidic layer between the carrier plate and the substrate. A second fluid circuit is coupled to the second fluid outlet and is separate from the first fluid circuit.Type: GrantFiled: November 20, 2000Date of Patent: November 11, 2003Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Phillip R. Sommer
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Publication number: 20030173230Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electrochemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.Type: ApplicationFiled: March 13, 2002Publication date: September 18, 2003Applicant: Applied Materials, Inc.Inventors: Ralph Wadensweiler, Alain Duboust, Liang-Yuh Chen, Manoocher Birang, Ratson Morad, Paul D. Butterfield
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Publication number: 20030032380Abstract: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between the polishing media and the support surface to form dimples in the polishing media upon the application of vacuum. An alternative arrangement draws the polishing media against a carrier and the substrate to be polished.Type: ApplicationFiled: October 1, 2002Publication date: February 13, 2003Applicant: Applied Materials, Inc.Inventors: Phillip R. Sommer, Paul D. Butterfield
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Publication number: 20020119286Abstract: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.Type: ApplicationFiled: December 27, 2001Publication date: August 29, 2002Inventors: Liang-Yuh Chen, Yuchun Wang, Yan Wang, Alain Duboust, Daniel A. Carl, Ralph Wadensweiler, Manoocher Birang, Paul D. Butterfield, Rashid Mavliev, Stan D. Tsai
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Patent number: 5525766Abstract: A portable acoustical shell for the performing arts and the like, and which includes a plurality of generally quadrilateral, and preferably trapezoidal, sound reflecting panels arranged together as an assembly along adjacent long side edge margins in substantially abutting juxtaposed relation to form a forwardly open, arch-like configuration. The arch-like panel assembly is supported and held in place by a modular frame assembly formed from a plurality of pyramidal frame modules, each of which is associated with a respective one of the plurality of sound reflecting panels. The modular frame assembly further includes a number of cross members which connect the apexes of adjacent pyramidal frame modules to one another. In an alternate embodiment of the invention, the cross members are length-adjustable and thereby permit the arch-like curvature of the acoustical shell to be flattened or steepened as desired.Type: GrantFiled: November 23, 1994Date of Patent: June 11, 1996Assignee: R & A Acoustical StructuresInventors: Richard R. Atcheson, Paul D. Butterfield, Wilbert H. Rimper