Abstract: A folded slab waveguide laser having a hybrid waveguide-unstable resonator cavity. Multiple slab waveguides of thickness ‘t’ supporting vertical waveguide modes are physically arranged above one another in a stack and optically arranged in series through one or more cavity folding assemblies with curved mirrors. A gain medium such as a gas is arranged in each slab. Each cavity folding assembly is designed to redirect the radiation beam emitted from one slab waveguide into the next waveguide and also at the same time to provide a focus for the radiation beam so that a selected vertical waveguide mode (or modes) is (or are) coupled efficiently into the next slab.

Abstract: Embodiments are disclosed for crash detection on one or more mobile devices (e.g., smartwatch and/or smartphone). In some embodiments, a method comprises: detecting, with at least one processor, a crash event on a crash device; extracting, with the at least one processor, multimodal features from sensor data generated by multiple sensing modalities of the crash device; computing, with the at least one processor, a plurality of crash decisions based on a plurality of machine learning models applied to the multimodal features; and determining, with the at least one processor, that a severe vehicle crash has occurred involving the crash device based on the plurality of crash decisions and a severity model.

Abstract: The present disclosure generally relates to displaying information related to a physical activity. In some embodiments, methods and user interfaces for managing the display of information related to a physical activity are described.

Abstract: A method of making a crimp connection comprises sliding a crimp ring over a female end of a pipe or tube, the crimp ring having an oval shape; inserting a male end of a fitting into the female end of the pipe or tube; sliding the crimp ring toward the fitting such that the crimp ring at least partly overlaps the inserted male end of the fitting; and applying a compressive force to an exterior surface of the crimp ring. Prior to applying the compressive force, the crimp ring has a first inner diameter and a second inner diameter transverse to the first inner diameter. The first inner diameter is greater than the second inner diameter. The first inner diameter is greater than an outer diameter of the pipe or tube. The second inner diameter is less than the outer diameter of the pipe or tube.

Abstract: In one embodiment, a polishing apparatus (10) includes a retaining ring (12), a pressure ring (16), a first seal (18), and a second seal (20). The retaining ring (12) is movably attached to the pressure ring (16) to create a uniform pressure distribution across the retaining ring (12). In addition a positive fluid pressure is applied to the first seal (18) and the second seal (20) to create the uniform pressure distribution across the retaining ring (12). The uniform pressure distribution across the retaining ring (16) allows a semiconductor substrate (51), polished with the polishing apparatus (10), to have a reduced edge exclusion, and thus increased die yield.

Abstract: A structure for chemical vapor deposition processing includes a substrate carrier (10) having a streamlined shape. When placed in a mainstream flow (21), the substrate carrier (10) maintains a laminar boundary layer over a substrate (17) under high gas flow rate conditions. In a further embodiment, the substrate carrier (10) includes a device (27) for directly injecting a reactant gas stream (33) into the boundary layer.

Abstract: A structure for chemical vapor deposition processing includes a substrate carrier (10) having a streamlined shape. When placed in a mainstream flow (21), the substrate carrier (10) maintains a laminar boundary layer over a substrate (17) under high gas flow rate conditions. In a further embodiment, the substrate carrier (10) includes a device (27) for directly injecting a reactant gas stream (33) into the boundary layer.

Abstract: An axially rotating circular polishing pad is conditioned by a rotating end effector that has an abrasion disc in contact with a polishing surface of the pad. The end effector moves along a radius of the polishing pad surface at a velocity that varies to compensate for locations on the polishing pad surface having linear velocities that are directly related to their respective radii. A desired contact force is maintained between the end effector and the polishing pad surface.

Abstract: An improved semiconductor wafer carrier provides gimballing motion of the wafer to dynamically align the wafer to a polishing platen. This gimballing motion is achieved by providing a conical receptacle which has a spring friction fit with a spherical button. A torque plate with spring fingers provides the spring friction fit between the conical receptacle on the rotating shaft and the spherical button on the drive plate of the wafer carrier.

Abstract: A filter assembly (10) for removing particulate matter from air forced therethrough comprises two pairs of oppositely charged woven electrostatic filtering material. Each pair of electrostatic filtering material comprises a positively charged and a negatively charged layer (22, 24, 28 and 30). An open cell foam layer (26) is disposed between the two pairs. Metal grids (20,32) enclose the filtering elements.

Abstract: A filtering unit (10) has four filter holders (20) arranged in a rectangle around a blower (36). Each filter holder holds up to two filter elements (11). The blower draws air through the filter elements (11) and outputs filtered air through a vent (40). Refillable filter frames (16) are provided to allow the user to change the filter material (18). In one embodiment, glass chips are used as the filter material (18).