Abstract: Combinations comprising (or consisting essentially of) one or more compounds of formula (1) with one or more ancillary agents, to processes for preparing the combinations, and to various therapeutic uses of the combinations. Also provided are pharmaceutical compositions containing the combinations as well as a method of treatment of Duchenne muscular dystrophy, Becker muscular dystrophy or cachexia using the combinations.

Abstract: Embodiments are directed towards budgeting and forecasting of information technology and services. In at least one of the various embodiments, financial allocation models may include multiple cost objects and one or more allocation rules. In at least one of the various embodiments, allocation rules may determine how costs associated with cost objects may be allocated to other cost objects. In at least one of the various embodiments, costs corresponding to one or more selected cost objects may be traced within a financial allocation model. Also, costs associated with multiple cost line items from different cost objects may simultaneously traced for efficient cross-referencing of disparate cost line items. Further, in at least one of the various embodiments, a display of the cost traces may be rendered and displayed to provide a visualization of the traced costs.

Abstract: There are disclosed compound of Formula (1): A1, A2, A3 and A4 which may be the same or different, represent N or CR1, X is a divalent group selected from O, S(O)n, C?W, NR4, NC(?O)R5 and CR6R7, W is O, S, NR20, Y is N or CR8, one of R4, R5, R6, R8, R9 and NR20 represents -L-R3, in which L is a single bond or a linker group, additionally, R1, R3-R9, which may be the same or different, independently represent hydrogen or a substituent and R20 represents hydrogen, hydroxyl, alkyl optionally substituted by aryl, alkoxy optionally substituted by aryl, aryl, CN, optionally substituted alkoxy, optionally substituted aryloxy, optionally substitute alkanoyl, optionally substituted aroyl, NO2, NR30R31, in which R30 and R31, which may be the same or different, represent hydrogen, optionally substituted alkyl or optionally substituted aryl; additionally, one of R30 and R31 may represent optionally substituted alkanoyl or optionally substituted aroyl, n represents an integer from 0 to 2, in addition, when an adjacent pai

Abstract: Embodiments are directed towards budgeting and forecasting of information technology and services. In at least one of the various embodiments, financial allocation models may include multiple cost objects and one or more allocation rules. In at least one of the various embodiments, allocation rules may determine how costs associated with cost objects may be allocated to other cost objects. In at least one of the various embodiments, costs corresponding to one or more selected cost objects may be traced within a financial allocation model. Also, costs associated with multiple cost line items from different cost objects may simultaneously traced for efficient cross-referencing of disparate cost line items. Further, in at least one of the various embodiments, a display of the cost traces may be rendered and displayed to provide a visualization of the traced costs.

Abstract: Combinations comprising (or consisting essentially of) one or more compounds of formula (1) with one or more ancillary agents, to processes for preparing the combinations, and to various therapeutic uses of the combinations. Also provided are pharmaceutical compositions containing the combinations as well as a method of treatment of Duchenne muscular dystrophy, Becker muscular dystrophy or cachexia using the combinations.

Abstract: Various embodiments are directed towards automating business processes and assets. A generated application may have entity propagation rules that allocate costs among objects in a model. Entity propagation rules may define how resources may be allocated and distributed among objects in a model. In at least one of the various embodiments, entity propagation rules may be defined to allocate resources based on formulas. in at least one of the various embodiments, the formulas used to allocate resources may include filters and matching rules. Further, in at least one of the various embodiments, matching rules may be based database referential matches. Entity propagation rules may distribute resources using formulas that may have terms based on multiple properties from the participating objects. In at least one of the various embodiments, the filter and matching formulas may be used to select the source items and the destination items if allocating resources between objects.

Abstract: Various embodiments are directed towards a platform for rapid development of applications. A data processing application may be generated by applying templates, work streams, change entries, and user modifications to generate data processing applications. In at least one of the various embodiments, the applications may be generated based project initial instructions and by receiving and processing example data in combination with templates, change entries, and work streams. Further, in at least one of the various embodiments, modifications made to the generated applications may be preserved as change entries associated with a work stream. In at least one of the various embodiments, separate applications may be generated based on the work streams and/or change streams of other applications. In at least one of the various embodiments, if a generated application may be modified a new revision number may be associated with the modified version of the application.

Abstract: Combinations comprising (or consisting essentially of) one or more compounds of formula (1) with one or more ancillary agents, to processes for preparing the combinations, and to various therapeutic uses of the combinations. Also provided are pharmaceutical compositions containing the combinations as well as a method of treatment of Duchenne muscular dystrophy, Becker muscular dystrophy or cachexia using the combinations.

Abstract: There are disclosed compound of Formula (I) or (II) wherein A1, A2, A3, A4 and A5, which may be the same or different, represent N or CR1, R9 represents -L-R3, in which L is a single bond or a linker group and R3 represents hydrogen or a substituent and in addition, when an adjacent pair of A1-A4 each represent CR1, then the adjacent carbon atoms, together with their substituents may form a ring B, when A5 represents CR1, then A5 and N—R9, together with their substituents may form a ring C, or a pharmaceutically acceptable salt thereof, in the manufacture of a medicament for the therapeutic and/or prophylactic treatment of Duchenne muscular dystrophy, Becker muscular dystrophy or cachexia.

Abstract: There are disclosed compound of Formula (1): A1, A2, A3 and A4 which may be the same or different, represent N or CR1, X is a divalent group selected from O, S(O)n, C?W, NR4, NC(?O)R5 and CR6R7, W is O, S, NR20, Y is N or CR8, one of R4, R5, R6, R8, R9 and NR20 represents -L-R3, in which L is a single bond or a linker group, additionally, R1, R3-R9, which may be the same or different, independently represent hydrogen or a substituent and R20 represents hydrogen, hydroxyl, alkyl optionally substituted by aryl, alkoxy optionally substituted by aryl, aryl, CN, optionally substituted alkoxy, optionally substituted aryloxy, optionally substitute alkanoyl, optionally substituted aroyl, NO2, NR30R31, in which R30 and R31, which may be the same or different, represent hydrogen, optionally substituted alkyl or optionally substituted aryl; additionally, one of R30 and R31 may represent optionally substituted alkanoyl or optionally substituted aroyl, n represents an integer from 0 to 2, in addition, when an adjacent pai

Abstract: A semiconductor substrate (1) comprises first and second silicon wafers (2,3) directly bonded together with interfacial oxide and interfacial stresses minimised along a bond interface (5), which is defined by bond faces (7) of the first and second wafers (2,3). Interfacial oxide is minimised by selecting the first and second wafers (2,3) to be of relatively low oxygen content, well below the limit of solid solubility of oxygen in the wafers. In order to minimise interfacial stresses, the first and second wafers are selected to have respective different crystal plane orientations. The bond faces (7) of the first and second wafers (2,3) are polished and cleaned, and are subsequently dried in a nitrogen atmosphere. Immediately upon being dried, the bond faces (7) of the first and second wafers (2,3) are abutted together and the wafers (2,3) are subjected to a preliminary anneal at a temperature of at least 400° C. for a time period of a few hours.

Abstract: A semiconductor substrate (1) comprising an SOI (2) formed therein. The semiconductor substrate (1) comprises first and second wafers (4,6) which are directly bonded together along a bond interface (9). Prior to bonding the wafers (4,6), a portion (15) of the second wafer (6) is ion implanted to form a p+ region for facilitating selective etching thereof to form a buried cavity (16), in which a buried insulating layer is subsequently formed under a portion (10) of the first wafer (4) for forming the SOI (2). After bonding of the first and second wafers (4,6) a communicating opening (20) is etched through the first wafer (4) to the bond interface (9), and the selectively etchable portion (15) is etched through the communicating opening (20) to form the buried cavity (16). The buried cavity (16) is then filled with deposited oxide to form the buried insulating layer (11).

Abstract: An encryption device includes a card with a grid comprising multiple rows and columns defining boxes for receiving individual characters. One of the columns or rows contains a master password or code character string. Other columns or rows contain encrypted character strings. The individual characters of the master password can be offset with respect to corresponding, individual characters of the encrypted character strings. A sleeve slidably, reciprocably receives the card and assists with aligning the characters of the master password and the characters of the encrypted character strings, which are visible through a window in the sleeve. A method of storing, encrypting and retrieving character strings utilizes the encryption device.

Abstract: A semiconductor substrate (1) comprises first and second silicon wafers (2,3) directly bonded together with interfacial oxide and interfacial stresses minimised along a bond interface (5), which is defined by bond faces (7) of the first and second wafers (2,3). Interfacial oxide is minimised by selecting the first and second wafers (2,3) to be of relatively low oxygen content, well below the limit of solid solubility of oxygen in the wafers. In order to minimise interfacial stresses, the first and second wafers are selected to have respective different crystal plane orientations. The bond faces (7) of the first and second wafers (2,3) are polished and cleaned, and are subsequently dried in a nitrogen atmosphere. Immediately upon being dried, the bond faces (7) of the first and second wafers (2,3) are abutted together and the wafers (2,3) are subjected to a preliminary anneal at a temperature of at least 400° C. for a time period of a few hours.

Abstract: A method for bonding a pair of silicon wafers (2,3) together to form a semiconductor wafer (1) wherein an interface surface (5) of one of the silicon wafers (3) is pretreated by an ion implantation or diffusion process prior to bonding of the silicon wafers (2,3). The method includes subjecting the pretreated interface surface (5) to an initial anneal step at approximately 700° C. for 60 minutes for recrystallising the interface surface, and then subjecting both interface surfaces (4,5) to two cleaning steps with respective first and second cleaning solutions, neither of which contain sulphuric acid. The first cleaning solution comprises hydrogen peroxide, ammonia and water, while the second cleaning solution comprises hydrofluoric acid and water. The respective interface surfaces (4,5) are rinsed with water after each cleaning step, and the silicon wafers (2,3) are bonded by anneal bonding at a temperature of the order of 1,150° C. for approximately 60 minutes.

Abstract: A bicycle seat is shown which includes a shell (11) formed from plastics material which has two buttock support portions (12 and 14) separated by a slot (16). The shell (11) includes a nose portion (18) and the transition between the support portions (12 and 14) and the nose portions (18) formes hinges (20 and 22) for allowing the support portions (12 and 14) to move independently with respect to one another in arcuate fashion during pedalling motion of the bicycle. A support rail (40) is coupled to the underside of the shell (11) and may have free ends (145) which act as stops to limit the amount of movement of the support portions (12 and 14). Springs (184, 190) may be provided between the mounting rail (40) and the shell (11). In other embodiments, FIGS. 42 to 80, the seat may include chambers for receiving air to cushion and provide support for a rider.

Abstract: A bicycle seat is shown which includes a shell (11) formed from plastics material which has two buttock support portions (12 and 14) separated by a slot (16). The shell (18) includes a nose portion (18) and the transition between the support portions (12 and 14) and the nose portions (18) forms hinges (20 and 22) for allowing the support portions (12 and 14) to move independently with respect to one another in arcuate fashion during pedalling motion of the bicycle. A support rail (40) is coupled to the underside of the shell (18) and may have free ends (145) which act as stops to limit the amount of movement of the support portions (12 and 14). Springs (184, 190) may be provided between the mounting rail (40) and the shell (11). In other embodiments (FIGS. 42 to 80), the seal may include chambers for receiving air to cushion and provide support for a rider.