Abstract: A coated glazing includes at least the following layers in sequence: a transparent glass substrate, a layer based on an oxide of a metal and/or a layer based on an oxide of a metalloid, and a further layer, wherein either the layer based on an oxide of a metal or the layer based on an oxide of a metalloid is adjacent the transparent glass substrate. The layer that is adjacent the transparent glass substrate has a surface that, prior to a coating of the surface, has an arithmetical mean height of the surface value, Sa, of at least 4.0 nm when tested in accordance with ISO 25178-2:2012, and the coated glazing exhibits an average haze value of at least 0.47% when tested in accordance with ASTM D1003-13.

Abstract: A coated glazing comprising at least the following layers in sequence: a transparent glass substrate, a layer based on an oxide of a metal and/or a layer based on an oxide of a metalloid, and a further layer, wherein either said layer based on an oxide of a metal or said layer based on an oxide of a metalloid is adjacent said transparent glass substrate, wherein said layer that is adjacent said transparent glass substrate comprises a surface that, prior to a coating of said surface, has an arithmetical mean height of the surface value, Sa, of at least 4.0 nm when tested in accordance with ISO 25178-2:2012, and wherein the coated glazing exhibits an average haze value of at least 0.47% when tested in accordance with ASTM D1003-13.

Abstract: A process for the production of an optoelectronic device, such as a photovoltaic cell or a light emitting diode is disclosed. The process comprises providing a substrate having a conductive coating on at least one surface, the conductive coating having an initial roughness and at least one or more spikes, and applying a functional component to the coated surface of the substrate. The surface of the substrate having the conductive coating has been subjected to a polishing step using at least one brush to reduce the height of the spikes inherent to the conductive coating and to give the conductive coating a final roughness. By reducing the spikes there is less potential for the optoelectronic device to suffer from electrical shunts which reduce the efficiency of the device.

Abstract: A process for the production of an optoelectronic device, such as a photovoltaic cell or a light emitting diode is disclosed. The process comprises providing a substrate having a conductive coating on at least one surface, the conductive coating having an initial roughness and at least one or more spikes, and applying a functional component to the coated surface of the substrate. The surface of the substrate having the conductive coating has been subjected to a polishing step using at least one brush to reduce the height of the spikes inherent to the conductive coating and to give the conductive coating a final roughness. By reducing the spikes there is less potential for the optoelectronic device to suffer from electrical shunts which reduce the efficiency of the device.