Patents by Inventor Paul Davidson
Paul Davidson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240301971Abstract: Disclosed is a retaining device comprising a pair of complementary members (1?) arranged such that when placed adjacent to each other. the retaining device is substantially annular and relatively elongate and comprises towards a first end thereof an inner circumferential ridge and an outer circumferential projection. and towards a second end thereof. means for connecting the pair of members, wherein adjacent said second end thereof there is provided a threaded portion (110) for receiving a nut.Type: ApplicationFiled: October 14, 2020Publication date: September 12, 2024Inventor: Paul Davidson
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Publication number: 20240019048Abstract: According to various, but not necessarily all, embodiments there is provided an apparatus for supporting an object, the apparatus comprising: a support surface; a first retainer and a second retainer, the first retainer being for coupling at least in part by the support surface to the second retainer, or being coupled at least in part by the support surface to the second retainer, wherein at least one of the first and second retainers comprises a stop; a fastener, comprising: an outer part including an internal surface that comprises a threaded portion; an inner part including an external thread arranged to enable the outer part to threadably rotate around the inner part, and at least one slot having a non-circular cross section in a plane perpendicular to the screw axis of the external thread, the at least one slot being shaped to receive the first and second retainers, such that the first and second retainers are rotatably fixed relative to the at least one slot and the stop prevents the retainers from exitType: ApplicationFiled: November 24, 2021Publication date: January 18, 2024Inventors: David FURNESS, Mark FURNESS, Paul DAVIDSON
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Patent number: 11541471Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.Type: GrantFiled: January 30, 2020Date of Patent: January 3, 2023Assignee: Seagate Technology LLCInventors: Aaron Collins, Paul Davidson, Ralph Smith
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Publication number: 20220412484Abstract: A support (10) apparatus suitable for supporting a cable or a pipe (12), wherein the support apparatus once installed to a suitable supporting surface, is arranged to provide an accommodation space which is at least partially open at an opening such that the cable or pipe may be introduced into the accommodation space through the opening.Type: ApplicationFiled: October 5, 2020Publication date: December 29, 2022Inventor: Paul Davidson
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Publication number: 20210215281Abstract: A mounting apparatus for mounting together a first pipe and a second pipe end to end. The mounting apparatus a first abutment member mountable on the first pipe at a predetermined distance from the end of the first pipe and a second abutment member mountable on the second pipe at a predetermined distance from the end of the second pipe. The apparatus further includes a sealing member locatable between the ends of the pipes and a tightening arrangement for urging the first and second abutment members mounted on the first and second pipes towards one another and thereby providing a seal between the pipes.Type: ApplicationFiled: March 29, 2019Publication date: July 15, 2021Inventors: Christopher Jon Massey, Paul Davidson, Robert David Sankey
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Publication number: 20200164453Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.Type: ApplicationFiled: January 30, 2020Publication date: May 28, 2020Inventors: Aaron Collins, Paul Davidson, Ralph Smith
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Patent number: 10646943Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.Type: GrantFiled: November 28, 2016Date of Patent: May 12, 2020Assignee: Seagate Technology LLCInventors: Aaron Michael Collins, Scott Daemon Matzke, Paul Davidson, Christopher R. Libby
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Patent number: 10643645Abstract: An apparatus includes a slider which includes a slider body with a leading edge and a trailing edge and a plurality of slider bond pads disposed at the trailing edge. The slider bond pads are configured to align opposite to suspension trace bond pads on a suspension to form a solderable gap between the slider bond pads and the suspension trace bond pads.Type: GrantFiled: September 24, 2018Date of Patent: May 5, 2020Assignee: SEAGATE TECHNOLOGY LLCInventors: Paul Davidson, Scott Damon Matzke, Christopher Unger, Aaron Collins
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Publication number: 20200098388Abstract: An apparatus includes a slider which includes a slider body with a leading edge and a trailing edge and a plurality of slider bond pads disposed at the trailing edge. The slider bond pads are configured to align opposite to suspension trace bond pads on a suspension to form a solderable gap between the slider bond pads and the suspension trace bond pads.Type: ApplicationFiled: September 24, 2018Publication date: March 26, 2020Inventors: Paul Davidson, Scott Damon Matzke, Christopher Unger, Aaron Collins
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Patent number: 10600436Abstract: An apparatus includes a slider body with a first portion formed of a first insulating material and a second portion formed of a second insulating material that is different from the first insulating material. The second portion of the slider body is at a trailing edge of the slider body and the second portion includes a bearing surface and a top surface opposite the bearing surface. A plurality of bond pads are disposed on the top surface of the second portion such that an entire bottom surface of each of the plurality bond pads is attached to the top surface of the second portion.Type: GrantFiled: January 4, 2019Date of Patent: March 24, 2020Assignee: Seagate Technology LLCInventors: Paul Davidson, Aaron Collins, Scott D. Matzke
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Patent number: 10556284Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.Type: GrantFiled: August 24, 2015Date of Patent: February 11, 2020Assignee: Seagate Technology LLCInventors: Aaron Collins, Paul Davidson, Ralph Smith
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Publication number: 20200038982Abstract: Implementations described and claimed herein address the foregoing problems by providing a soldering method including mixing a plurality of spheres in a bond-head hopper wherein a first number of the plurality of the spheres have a diameter that is at least fifty (50) percent larger than the rest of the plurality of spheres.Type: ApplicationFiled: August 1, 2018Publication date: February 6, 2020Inventors: Jonathan Paul Robelia, Paul Davidson, Amy Jo Bergerud
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Publication number: 20190122694Abstract: A magnetic recording head including a trailing surface and a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, and a top edge extending between the two side edges. The head further includes at least one solder dam including a nonwettable, electrically conductive solder material positioned adjacent to the top edge of at least one of the bond pads.Type: ApplicationFiled: October 20, 2017Publication date: April 25, 2019Inventors: Paul Davidson, Scott Damon Matzke, Aaron Michael Collins
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Publication number: 20190078704Abstract: Disclosed is a fastener assembly (100) for use with a generally elongate member (1) having formed therein a plurality of recesses (10), the fastener assembly (100) comprising: an engaging member (2A, 2B), having a generally tapered portion, arranged to receive the generally elongate member (1); a container (3, 203, 303, 403, 503) arranged to substantially enclose the engaging member (2A, 2B); and a retaining member (4) for securing the engaging member (2A, 2B) and container (3, 203, 303, 403, 503) on the generally elongate member (1), wherein the generally tapered portion of the engaging member (2A, 2B) has at least one projection (20) arranged, in use, to enter at least one of the plurality of recesses (10) of the generally elongate member (1).Type: ApplicationFiled: March 23, 2017Publication date: March 14, 2019Inventor: Paul Davidson
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Publication number: 20180147646Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.Type: ApplicationFiled: November 28, 2016Publication date: May 31, 2018Inventors: Aaron Michael Collins, Scott Daemon Matzke, Paul Davidson, Christopher R. Libby
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Patent number: 9835269Abstract: Disclosed is an apparatus for suspending an object from an anchor point positioned, in use, above it, comprising: an elongate rod (200) having at least one waisted portion (220); a rod-engaging member (400); and a lock member (300), wherein the rod-engaging member (400) comprises: a substantially cylindrical main body (410) having a longitudinal slot (460) running along its entire length; a circumferential ridge (420) disposed around the cylindrical main body (410), arranged to engage with a complementary recess (130) provided in the object to be suspended; and a portion (430) comprising at least one elongate element having an inwardly facing projection (470), arranged to engage with the waisted portion (220) of the elongate rod (200).Type: GrantFiled: July 22, 2014Date of Patent: December 5, 2017Assignee: JCCO 330 LIMITEDInventor: Paul Davidson
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Publication number: 20170056995Abstract: A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere until it falls from the exit orifice toward the connection area between the first and second components, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.Type: ApplicationFiled: August 24, 2015Publication date: March 2, 2017Inventors: Aaron Collins, Paul Davidson, Ralph Smith
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Publication number: 20160215903Abstract: Improvements in and relating to Pipe Clips and Supports Disclosed is a pipe attachment (100), comprising first and second elements (110, 120), each comprising an inner sub-element (122) and an outer sub-element (121), the inner and outer sub-elements being rotatable relative to each other, wherein in a first configuration, the first and second elements are separate and positionable to surround the pipe, and in a second configuration, they are locked together, wherein the locking together is achieved by relative rotation of the respective inner and outer sub-elements such that the inner sub-element of the first element at least partially engages with the outer sub-element of the second element, and the inner sub-element of the second element at least partially engages with the outer sub-element of the first element.Type: ApplicationFiled: July 23, 2014Publication date: July 28, 2016Inventor: Paul Davidson
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Publication number: 20160208959Abstract: Disclosed is an apparatus for suspending an object from an anchor point positioned, in use, above it, comprising: an elongate rod (200) having at least one waisted portion (220); a rod-engaging member (400); and a lock member (300), wherein the rod-engaging member (400) comprises: a substantially cylindrical main body (410) having a longitudinal slot (460) running along its entire length; a circumferential ridge (420) disposed around the cylindrical main body (410), arranged to engage with a complementary recess (130) provided in the object to be suspended; and a portion (430) comprising at least one elongate element having an inwardly facing projection (470), arranged to engage with the waisted portion (220) of the elongate rod (200).Type: ApplicationFiled: July 22, 2014Publication date: July 21, 2016Inventor: Paul Davidson
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Publication number: 20160153593Abstract: Disclosed is a pipe coupling for connecting the ends of two tubular conduits, comprising:—a pair of casing elements (200), each comprising an outer part (210) and a pair of inner parts (220), the inner and outer parts being rotatable relative to each other, wherein—in a first configuration, the pair of casing elements (200) are separate and positionable to surround the ends of the tubular conduits and, in a second configuration, they are locked together, wherein the locking together is achieved by relative rotation of the respective inner (220) and outer (210) parts such that the inner parts (210) of one casing element (200) at least partially engage with the outer part (210) of the other casing element (200).Type: ApplicationFiled: July 18, 2014Publication date: June 2, 2016Applicant: UCCO 331 LIMITEDInventor: Paul Davidson