Abstract: The present invention is a chemical compound of formula (I) 1

Abstract: A chemical compound of formula (I), wherein n is 1, 2 or 3; R1 and R2 are independently selected from hydrogen and alkyl; R3 is alkyl; R4 to R7 are independently selected from hydrogen, halogen, hydroxy, alkyl, aryl, alkoxy, aryloxy, alkylthio, arylthio, alkylsulfoxyl, alkylsulfonyl, arylsulfoxyl, arylsulfonyl, amino, monoalkylamino, dialkylamino, nitro, cyano, carboxaldehyde, alkylcarbonyl, arylcarbonyl, aminocarbonyl, monoalkylaminocarbonyl, dialkylaminocarbonyl, alkoxycarbonylamino, aminocarbonyloxy, monoalkylaminocarbonyloxy, dialkylaminocarbonyloxy, monoalkylaminocarbonylamino and dialkylaminocarbonylamino, or R5 and R6 together form a carbocyclic or heterocyclic ring, and pharmaceutically acceptable salts and prodrugs thereof, and the use thereof in therapy, particularly for the treatment of disorders of the central nervous system; damage to the central nervous system; cardiovascular disorders; gastrointestinal disorders, diabetes insipidus, and sleep apnea, and particularly for the treatment of obesity

Abstract: A particle size distribution analysis sample dilution apparatus in which a sample consisting of a batch of a slurry of particles is deposited on an inclined plate of a progressive sample delivery system from which a continuous supply of water progressively washes off the sample and dilutes it. The initially diluted sample is further diluted with water continuously supplied in a funnel from which the further diluted sample passes under gravity along a conduit to a particle size distribution analyzer through which the diluted sample flows continuously. The conduit may include a mixing chamber to which water is continuously supplied to further dilute the sample prior to analysis.

Abstract: A container for transporting material, comprises an outer container having first and second container openings therein, and a container liner having first and second liner openings therein. The first liner opening is sufficiently small to be passed through the second container opening and is adapted for connection to the first container opening. The second liner opening is adapted for attachment to the second container opening.

Abstract: A method for reducing the reaction with metal surfaces of a coupled, filled polyolefin comprising the step of including in the formulation of said coupled, filled polyolefin from about 0.01 to about 1.0 weight percent of an organomodified polysiloxane.

Abstract: A beverage containing system comprises a sealed drink can 1 having located therein both a liquid 11 to be consumed and a sealed compartment 13. The system includes means 33 for rupturing a wall 23 of the compartment to put its interior in fluid communication with a further compartment 15. A compressed fluid is located in one of the compartments whereby, after the rupturing of the wall, the fluid is confined within the compartments.

Abstract: A duct for extending through an aperture in a wall or partition and comprising a sleeve and outwardly extending flanges to overlie the opposed outer surfaces of the wall or partition at the opposite ends of the sleeve and at least one of the flanges being constructed to be pushed onto an end of the sleeve to lockingly engage the sleeve end.

Abstract: A method and apparatus are disclosed whereby integrated optical circuits having waveguide ends of lens geometry are formed which improve the waveguide's optical coupling to light sources and detectors. A channel waveguide is formed on a substrate and the waveguide ends are shaped into lens form by etching to form a protrusion and heating the waveguide to or above the softening temperature of core material of the waveguide resulting in surface tension in the core material that functions to shape the protrusion into a substantially cone-shaped lens end having a smooth surface.

Abstract: An apparatus for applying interconnect bumps to an integrated circuit comprising a wedge bonder assembly (10) including a bonding tool (14) adapted to be selectively moved relative to the integrated circuit (42) and to transmit ultrasonic force to bond wire or ribbon (62) located between the bonding tool (14) and the integrated circuit (42) to the integrated circuit and form an interconnect bump (63), the bonding tool (14) defining a passage (44) through which wire or ribbon (50) is passed to be brought into contact with the integrated circuit (42) and an edge (38) positioned and adapted to weaken wire or ribbon (50) as the bonding tool (14) is moved to the point at which the bonding tool (14) is closest to the integrated circuit (42), the wedge bonder assembly being adapted to move the bonding tool (14) so as to separate the interconnect bump (63) from the wire or ribbon (50) proximal of the bump.