Patents by Inventor Paul Douglas, Jr.

Paul Douglas, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP polisher substrate removal control mechanism and method
    Patent number: 6824448
    Abstract: A slurry removal control mechanism for a CMP polisher is provided. After slurry dispense has been terminated, a high pressure fluid spray removes the slurry from the polishing pad, while the plated causes the pad to rotate at a high rpm rate, thus clearing the slurry from contact with the wafer. Additionally, there is provided a slurry dispense bar including high pressure spray nozzles for providing a high pressure spray upon slurry dispense termination.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: November 30, 2004
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Landon B. Vines, Parker A. Wood, Paul Douglas, Jr., Jesse Guzman