Abstract: An oscilloscope probe includes: a connector pod; a probe identification module disposed in the connector pod, the probe identification module having a cross-sectional area; and a resistor disposed in the connector pod, and in-line with the probe identification module and having a substantially identical cross-sectional area as the probe identification module.

Abstract: A cake icing system comprising a) a mould (100) comprising a mould wall (102) having a top end and a bottom end and a height defined therebetween, the mould wall having an inner surface (104) which defines the width and the length of the mould, the inner surface having a perimeter length, the mould wall having a support surface at the bottom end (106) of the mould, b) a base (200) with a width which is less than the width of the mould, a length which is less than the length of the mould, a top surface (202), a bottom surface (204), and a side surface (204) therebetween, wherein the height of the side surface (H2) is less than the height of the mould wall (H1) and the base is removable and insertable into the mould, c) a liner (300) having a thickness (T3), a height (H3) and a length (L3) greater than the perimeter length of the mould wall, wherein when the system is in use the base sits on the support surface of the mould, and the liner engaging the inner wall of the mould, such that that an icing composition

Abstract: An oscilloscope probe includes: a connector pod; a probe identification module disposed in the connector pod, the probe identification module having a cross-sectional area; and a resistor disposed in the connector pod, and in-line with the probe identification module and having a substantially identical cross-sectional area as the probe identification module.

Abstract: An oscilloscope probe includes: a connector pod; a probe identification module disposed in the connector pod, the probe identification module having a cross-sectional area; and a resistor disposed in the connector pod, and in-line with the probe identification module and having a substantially identical cross-sectional area as the probe identification module.

Abstract: An elongated rectangular Rochon polarizer, e.g., having a height to width or depth ratio of at least 2.5, is securely held in a non-adhesive mounting assembly. The mounting assembly includes a plurality of compression elements that press the Rochon polarizer against corresponding reference points to properly align the Rochon polarizer within the mounting assembly. Moreover, air gaps between the Rochon polarizer and the sidewalls of the mounting assembly are provided to minimize thermal conduction between the mounting assembly and the Rochon polarizer and to provide thermal convection to cool the Rochon polarizer, thereby reducing risk of catastrophic delamination of the Rochon polarizer due to thermal effects.

Abstract: An oscilloscope probe includes: a connector pod; a probe identification module disposed in the connector pod, the probe identification module having a cross-sectional area; and a resistor disposed in the connector pod, and in-line with the probe identification module and having a substantially identical cross-sectional area as the probe identification module.

Abstract: An elongated rectangular Rochon polarizer, e.g., having a height to width or depth ratio of at least 2.5, is securely held in a non-adhesive mounting assembly. The mounting assembly includes a plurality of compression elements that press the Rochon polarizer against corresponding reference points to properly align the Rochon polarizer within the mounting assembly. Moreover, air gaps between the Rochon polarizer and the sidewalls of the mounting assembly are provided to minimize thermal conduction between the mounting assembly and the Rochon polarizer and to provide thermal convection to cool the Rochon polarizer, thereby reducing risk of catastrophic delamination of the Rochon polarizer due to thermal effects.

Abstract: A system for substrate tilt and focus control in an inspection system includes a dynamically actuatable substrate stage assembly including a substrate stage for securing a substrate; a tilt-height detection system including: a height detection sub-system and a tilt detection sub-system. The system further includes a first actuator configured to selectably actuate the substrate along a direction perpendicular to the surface of the substrate at a location of the substrate stage assembly; and an additional actuator configured to selectably actuate the substrate along a direction substantially perpendicular to the surface of the substrate at an additional location of the substrate stage assembly; and a MIMO tilt-focus controller communicatively coupled to the height detection sub-system, the tilt detection sub-system, the first actuator and the additional actuator.

Abstract: Disclosed herein is an apparatus for providing passive correction for thermal effects on a mounted mechanical component. Further disclosed is a wafer inspection system employing the passive thermal effect correction apparatus.

Abstract: A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.

Abstract: A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor connecting a DC power source to the DDC/CEC ground node. The node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, where the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when a switching device is switched on. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

Abstract: A system for substrate tilt and focus control in an inspection system includes a dynamically actuatable substrate stage assembly including a substrate stage for securing a substrate; a tilt-height detection system including: a height detection sub-system and a tilt detection sub-system. The system further includes a first actuator configured to selectably actuate the substrate along a direction perpendicular to the surface of the substrate at a location of the substrate stage assembly; and an additional actuator configured to selectably actuate the substrate along a direction substantially perpendicular to the surface of the substrate at an additional location of the substrate stage assembly; and a MIMO tilt-focus controller communicatively coupled to the height detection sub-system, the tilt detection sub-system, the first actuator and the additional actuator.

Abstract: A circuit for detection of an HDMI source device to an HDMI sink device through an HDMI sink connector without regard for the activity state of the HDMI source device has a pull-up resistor having first and second terminals with the first terminal coupled to a DC power source. A switching device is coupled between the pull-up resistor's second terminal and ground at a circuit node. The switching device is switched on to couple the circuit node to ground when power is applied to a control terminal thereof from the HDMI sink connector power pin, and being switched off otherwise. The circuit node is coupled to a DDC/CEC GROUND pin of the HDMI sink connector. The circuit node is readable as a binary signal to indicate the presence of a source device to the HDMI sink connector, wherein the node exhibits a logic low signal when either the node is grounded by the DDC/CEC GROUND pin connection to a source device or when the switching device is switched on.

Abstract: Disclosed herein is an apparatus for providing passive correction for thermal effects on a mounted mechanical component. Further disclosed is a wafer inspection system employing the passive thermal effect correction apparatus.

Abstract: The present invention is directed to a high speed, spinning chuck for use in a semiconductor wafer inspection system. The chuck of the present disclosure is configured with a turbulence-reducing lip. Spinning of the chuck produces radial airflows proximal to a surface of the wafer and proximal to the bottom of the chuck. The turbulence-reducing lip of the chuck of the present disclosure directs the radial airflows off of the top surface of the wafer and the bottom surface of the chuck in a manner that minimizes the size of the low pressure zone formed between these radial airflows. The minimization of the low pressure zone reduces air turbulence about the periphery of the chuck and substrate, thereby reducing the possibility of contaminants in the system being directed onto the surface of the substrate by such air turbulence.

Abstract: A TV detects the capabilities of connected components to respond to various function commands. Subsequently, when a non-programmable remote control is used to select a component and then generate a function command, the TV determines if the component can respond to the command and if not, the TV dynamically alters the commanded function or the selected component.

Abstract: A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.

Abstract: An edge-handling chuck, a system for holding and rotating a test substrate at a high speed and a method for chucking a rotating substrate are disclosed. The Chuck includes a plate having a central axis, a fluid opening and a top surface with a varied topography characterized by symmetry about the central axis. The topography is such that a volume flow rate of fluid between the fluid opening and a periphery of the top surface sufficient to counteract substrate sagging is significantly less than a volume flow rate needed for a similar but flat-surfaced chuck to similarly counteract such sagging. The system may further include a spindle motor and a gas system that supplies gas through the fluid opening to a gap between the top surface and a back surface of the substrate. A radial velocity of the fluid through the gap is approximately constant.

Abstract: A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.

Abstract: An electronic book synchronizes visual segments in a visual file with the start of respective sentences in an audio file corresponding to the visual segments so that if the user switches from visual to audio the audio does not start mid-sentence. Visual segments in the video file may be linked to the start of a page in the audio file.