Abstract: In one aspect, a method includes heating a wafer chuck, heating a first wafer, depositing a first epoxy along at least a portion of a surface of the first wafer disposed on the wafer chuck, spinning the wafer chuck to spread the first epoxy at least partially across the first wafer, placing a second wafer on the first epoxy disposed on the first wafer and bonding the second wafer to the first epoxy under vacuum to form a two-wafer-bonded structure.

Abstract: An optical sensor (10) comprises an optical cavity defined by a dielectric body and responsive to one or more physical environmental conditions, and a waveguide (70) having a terminal end spaced apart from the optical cavity such that light is optically coupled from the terminal end of the waveguide (70) to the optical cavity. The waveguide (70) is arranged such that, in use, it is maintained at a first temperature that would not damage the optical coupling to the optical cavity when the dielectric body is maintained at a second temperature sufficient to damage the optical coupling to the optical cavity.

Abstract: A method is performed at a touch sensing system that includes a two-dimensional capacitive sense array. The process measures the capacitance of the capacitive sensors, and identifies a first sensor whose measured capacitance is a local peak. The local peak is within a local rectangular array. The process computes column sums for each column of the rectangular array and determines whether to apply a smoothing algorithm. When the smoothing algorithm is not applied, the process computes an x-coordinate of a touch using a plurality of the column sums. When applying the smoothing algorithm, the process computes the x-coordinate of the touch as an average of two x-coordinate calculations. Each of the two x-coordinate calculations conditionally performs a horizontal shift of the local rectangular array based on comparing the peak measured capacitance to an adjacent measured capacitance and computes a respective x-coordinate using a respective plurality of the column sums.

Abstract: An optical sensor (10) comprises an optical cavity defined by a dielectric body and responsive to one or more physical environmental conditions, and a waveguide (70) having a terminal end spaced apart from the optical cavity such that light is optically coupled from the terminal end of the waveguide (70) to the optical cavity. The waveguide (70) is arranged such that, in use, it is maintained at a first temperature that would not damage the optical coupling to the optical cavity when the dielectric body is maintained at a second temperature sufficient to damage the optical coupling to the optical cavity.

Abstract: An optical sensor (10) comprises an optical cavity defined by a dielectric body and responsive to one or more physical environmental conditions, and a waveguide (70) having a terminal end spaced apart from the optical cavity such that light is optically coupled from the terminal end of the waveguide (70) to the optical cavity. The waveguide (70) is arranged such that, in use, it is maintained at a first temperature that would not damage the optical coupling to the optical cavity when the dielectric body is maintained at a second temperature sufficient to damage the optical coupling to the optical cavity.

Abstract: An optical sensor (10) comprises an optical cavity defined by a dielectric body and responsive to one or more physical environmental conditions, and a waveguide (70) having a terminal end spaced apart from the optical cavity such that light is optically coupled from the terminal end of the waveguide (70) to the optical cavity. The waveguide (70) is arranged such that, in use, it is maintained at a first temperature that would not damage the optical coupling to the optical cavity when the dielectric body is maintained at a second temperature sufficient to damage the optical coupling to the optical cavity.

Abstract: In certain embodiments, a system may include a sensor platform, a cold shield, and a support system. The sensor platform supports a sensor system. The cold shield allows first radiation to reach the sensor system and prevents second radiation from reaching the sensor system. The support system is coupled to the cold shield and the platform, and supports the cold shield and maintains a separation between the cold shield and the platform.

Abstract: According to one embodiment, an optical device comprises a housing. A structure is disposed within the housing. The structure has an optical entrance whereby radiation may enter. An aperture is located between the optical entrance and a radiation detector. At least one brace is rigidly coupled to the structure and the housing.

Abstract: In certain embodiments, a system may include sensor platform, a cold shield, and a support system. The sensor platform supports a sensor system. The cold shield allows first radiation to reach the sensor system and prevents second radiation from reaching the sensor system. The support system is coupled to the cold shield and the platform, and supports the cold shield and maintains a separation between the cold shield and the platform.

Abstract: According to one embodiment, an optical device comprises a housing. A structure is disposed within the housing. The structure has an optical entrance whereby radiation may enter. An aperture is located between the optical entrance and a radiation detector. At least one brace is rigidly coupled to the structure and the housing.

Abstract: An optical sensor (10) comprises an optical cavity defined by a dielectric body and responsive to one or more physical environmental conditions, and a waveguide (70) having a terminal end spaced apart from the optical cavity such that light is optically coupled from the terminal end of the waveguide (70) to the optical cavity. The waveguide (70) is arranged such that, in use, it is maintained at a first temperature that would not damage the optical coupling to the optical cavity when the dielectric body is maintained at a second temperature sufficient to damage the optical coupling to the optical cavity.

Abstract: A method of cleaning a contact surface on an integrated circuit module using a slotted, complementary-dual-housing mechanical cleaning apparatus. The cleaning apparatus includes a spring-actuated device and a replaceable cleaning cloth.

Abstract: A method of fabricating an integrated device on a chip comprising first and second features (A, B), the second feature, B, having greater dimension and/or being of coarser design than the first feature A. The method involves the steps of: depositing a resist onto the chip, the resist being of a type that forms a thinner deposit on larger or coarser features than on smaller or finer features; treating the resist in dependence upon the thickness thereof to render it susceptible to a subsequent etching step, the thicker areas of resist being treated for a longer period of time or by a more intense treatment than the thinner areas of resist; and etching the treated areas of the resist to form a mask for use in the fabrication of said first and second features (A, B), on the chip.

Abstract: A method of producing an optical grating component including only a single continuous grating field formed in a longitudinal waveguide rib, the method including the steps of defining a grating in an optic chip including a portion thereof through which the longitudinal waveguide rib is to extend, and then defining the lateral edges of the longitudinal rib in the optic chip, whereby any portion of the grating extending laterally beyond the lateral width of the rib is removed in the step of defining the lateral edges of the rib leaving a single continuous grating field that has straight lateral grating boundaries that are laterally aligned with the straight lateral edges of the rib.

Abstract: An arrangement of an integrated optical waveguide (1) relative to a V-groove (2) for receiving an optical fibre (5) which is to be optically coupled with an end of the waveguide (1) is described. A waveguide (1) is formed in a crystalline optical substrate (3), and a V-groove (2) formed therein beneath an elongate parallel sided window in the substrate with a centre line (2A) of the V-groove (2) aligned with an end (1A) of the waveguide (1). The parallel sides (2B, 2C) of the window at the end of the V-groove (2) aligned with the waveguide (1) terminate out of alignment with each other in a direction along the length of the V-groove whereby the V-groove undercuts a portion (3A) of the optically conducting layer (3) beneath said end of the waveguide (1). The end of the waveguide (1) therefore overhangs the end of the V-groove (2) to enable the end of an optical fibre (5) to be located in close proximity thereto.

Abstract: The present invention is a phase loss protector for a three phase motor supplied by a three phase power source. A three phase motor has three main power legs, L1, L2 and L3, going in. Two of the three legs power the stepdown transformer that supplies a controller. The controller ensures power does not reach the three phase motor when L3 is not operating. If L3 loses power, a controller relay will not supply power to a power coil that supplies generally open contact points, shutting down power to the three phase motor. If L1 loses power, the transformer will not provide power for the controller to operate. If L2 loses power, the transformer will not provide power to the controller and the controller relay will not supply power to the power coil, again shutting down power to the three phase motor.

Abstract: A rib waveguide structure comprising a layer (4) of light conductive material defined between two planar faces with a rib (9) formed on one of the faces and an optical component e.g. a tapered waveguide (6) optically coupled to the other face. An inverted rib waveguide comprising a light conductive layer (11) and a rib (10) that projects from the light conductive layer (11) into a substrate (4,8) is also described as well as other optical devices comprising a light conductive layer separated from a substrate by a non-planar layer (3) of light confining material and optical devices comprising two or more layers (2, 3; 18, 19, 20) of light confining material buried within a rib with a light conducting component (10; 17; 22) at least a part of which is formed between planes defined by the two layers of light confining material. A method of forming such devices is also described.