Patents by Inventor Paul Dryer

Paul Dryer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220226817
    Abstract: A liquid biological sample test cartridge is disclosed. The cartridge can include a tray. The cartridge can also include a chemical reaction pad supported by the tray. The cartridge can further include a chemical reaction pad cover disposed over the chemical reaction pad and coupled to the tray. The chemical reaction pad cover can have a sample opening to facilitate depositing a liquid biological sample at a predetermined location on the chemical reaction pad. In addition, the cartridge can include an outer cover operable to at least partially form an enclosure about the chemical reaction pad.
    Type: Application
    Filed: January 16, 2022
    Publication date: July 21, 2022
    Inventors: Dylan Horvath, Charlie Man, Andrew Lowe, David Dempster, Parth Jain, Aaron Adler, Bryan Bartley, Paul Dryer, Timothy Quinn, Avram Bar-Cohen, Mike Gavin, Jordan Seville, Darby McChesney, Frank M. LaDuca, Mohit Verma
  • Publication number: 20220228956
    Abstract: A heating device for testing a biological sample is disclosed. The heating device can include a heat source operable to generate heat. In addition, the heating device can include a controller in communication with the heat source and operable to control heat generation by the heat source to heat a biological sample at less than or equal to about 2 degrees C./s. Furthermore, a heating device for testing a biological sample is disclosed that can include a heat source operable to generate heat to heat a biological sample. The biological sample can be at least partially contained within a removable enclosure distinct from the heating device. Additionally, the heating device can include an enclosure interface associated with the heat source. The enclosure interface can be configured to interface with the enclosure such that heat is transferred from the heat source to the enclosure by conduction.
    Type: Application
    Filed: January 16, 2022
    Publication date: July 21, 2022
    Inventors: Dylan Horvath, Charlie Man, Andrew Lowe, David Dempster, Parth Jain, Aaron Adler, Bryan Bartley, Paul Dryer, Timothy Quinn, Avram Bar-Cohen, Mike Gavin, Frank M. LaDuca, Mohit Verma
  • Publication number: 20140203114
    Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.
    Type: Application
    Filed: March 26, 2014
    Publication date: July 24, 2014
    Applicant: FUNAI ELECTRIC CO., LTD.
    Inventors: David BERNARD, Paul DRYER, Bart MANSDORF, Xiaoming WU
  • Patent number: 8785524
    Abstract: A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: July 22, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: Xiaoming Wu, Paul Dryer, David Rhine, Anna Pearson, Jeanne Marie Saldanha Singh, Richard Wells, Joel Provence
  • Patent number: 8742976
    Abstract: A method and apparatus for providing power management for a device including a radar unit and an ad hoc network node are presented. The present invention involves various individual components of the device being turned on and off in various sequences in order to minimize power draw of the device. This involves starting individual components ahead of when they are required so they are fully functional when needed.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: June 3, 2014
    Assignee: Raytheon BBN Technologies Corp.
    Inventors: Steven V. Weeks, Paul Dryer, Dale G. Robertson
  • Patent number: 8728715
    Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: May 20, 2014
    Assignee: Funai Electric Co., Ltd.
    Inventors: David Bernard, Paul Dryer, Bart Mansdorf, Xiaoming Wu
  • Patent number: 8638253
    Abstract: Embodiments disclosed herein include a radar sensor device for detecting movement and velocity of external objects within or around a particular radar sensor field. The radar sensor field can use an array or cluster or radar sensors, including compact (portable by hand) radar sensors that function as network nodes within a wireless, low-energy ad hoc network. Radar sensor devices can use vibration as a means of communicating power status, functionality, and progress of installation of a particular radar unit. Such a vibration can be executed at a particular predefined cadence, rhythm, or other pattern, to indicate a powered-on state, active network connectivity, and other device states. Such a radar sensor device provides silent and non-visible status indication for quick and efficient deployment.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: January 28, 2014
    Assignee: BBN Technologies Corp.
    Inventor: Paul Dryer
  • Publication number: 20130183450
    Abstract: A method of forming a patterned photoresist layer having a hydrophobic surface is provided. The method includes forming a photoresist layer on a substrate and image patterning. The photoresist layer may comprise a polymeric material. The imaged photoresist layer may then undergo a two-stage post-exposure bake. A surface treatment may be performed on the photoresist layer in between the two-stage post-exposure bake. The surface treatment may include applying a siloxane solution on a partially post-exposure baked photoresist layer. The post-exposure baked photoresist layer may then be developed to form the patterned photoresist layer. The method may be used to form a hydrophobic photoimageable nozzle plate of a micro-fluid ejection head having improved mechanical properties and stable hydrophobic properties.
    Type: Application
    Filed: January 13, 2012
    Publication date: July 18, 2013
    Inventors: David BERNARD, Paul DRYER, Bart MANSDORF, Xiaoming WU
  • Patent number: 8422649
    Abstract: Techniques are disclosed for using Ethernet Layer 1 as a means for transporting audio, control, and status signals between telephones and an aggregator device in a telephone system. Techniques are also disclosed for using the aggregator to determine whether a telephone supports only Ethernet Layer 1, and for using the aggregator to communicate with the telephone using an appropriate protocol based on the results of the determination.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: April 16, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Frank J. Cannata, Paul Dryer
  • Publication number: 20130048601
    Abstract: A method for improving adhesion between polymeric materials is provided. The method includes treating a surface of a first polymeric material with plasma of oxygen gas and hydrogen-containing gas. The first polymeric material may be a fully cured polymeric material. A second polymeric material may then be deposited on the plasma treated surface of the first polymeric material. The second polymeric material may be an uncured polymeric material. This plasma treatment may be used in improving the adhesion between polymeric components of an inkjet printer. It provides good adhesion between the polymeric components of the inkjet printer even after long exposure to ink.
    Type: Application
    Filed: August 31, 2011
    Publication date: February 28, 2013
    Inventors: Paul Dryer, David Bernard, David Rhine, Xiaoming Wu, Jing X. Sun, Gary Williams
  • Publication number: 20110318882
    Abstract: A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 29, 2011
    Inventors: Xiaoming Wu, Paul Dryer, David Rhine, Anne Pearson, Jeanne Marie Saldanha Singh, Richard Wells, Joel Provence
  • Publication number: 20110319513
    Abstract: A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 29, 2011
    Inventors: Xiaoming Wu, Paul Dryer, David Rhine, Anna Pearson, Jeanne Marie Saldanha Singh, Richard Wells, Joel Provence
  • Publication number: 20110142038
    Abstract: Techniques are disclosed for using Ethernet Layer 1 as a means for transporting audio, control, and status signals between telephones and an aggregator device in a telephone system. Techniques are also disclosed for using the aggregator to determine whether a telephone supports only Ethernet Layer 1, and for using the aggregator to communicate with the telephone using an appropriate protocol based on the results of the determination.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 16, 2011
    Inventors: Frank J. Cannata, Paul Dryer
  • Patent number: 7916843
    Abstract: Techniques are disclosed for using Ethernet Layer 1 as a means for transporting audio, control, and status signals between telephones and an aggregator device in a telephone system. Techniques are also disclosed for using the aggregator to determine whether a telephone supports only Ethernet Layer 1, and for using the aggregator to communicate with the telephone using an appropriate protocol based on the results of the determination.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: March 29, 2011
    Assignee: Hewlett-Packard Company
    Inventors: Frank J. Cannata, Paul Dryer, Mike McCormack
  • Publication number: 20080273040
    Abstract: Methods and systems are provided for efficiently selectively updating multiple-region flexible displays. In an embodiment, multiple regions of a display material each have a common conductor along a first surface and a patterned set of conductors along a second surface. A control circuit includes a separate conductive trace to each common conductor, such that the control circuit can selectively apply known voltages to the common conductors, as well as a single set of driver lines to all of the patterned sets of conductors, such that any sets of signals sent to any of the patterned sets of conductors are received by all of the patterned sets of conductors. The control circuit is used to selectively apply electric fields between the common conductor and the patterned set of conductors of a subset of the regions, so as to selectively update an appearance of the subset of the regions.
    Type: Application
    Filed: May 1, 2007
    Publication date: November 6, 2008
    Applicant: 3COM CORPORATION
    Inventors: Paul Dryer, Dale Robertson, Bryce Xiaobo Xue
  • Publication number: 20070201444
    Abstract: Techniques are disclosed for using Ethernet Layer 1 as a means for transporting audio, control, and status signals between telephones and an aggregator device in a telephone system. Techniques are also disclosed for using the aggregator to determine whether a telephone supports only Ethernet Layer 1, and for using the aggregator to communicate with the telephone using an appropriate protocol based on the results of the determination.
    Type: Application
    Filed: February 10, 2006
    Publication date: August 30, 2007
    Inventors: Frank Cannata, Paul Dryer, Mike McCormack
  • Patent number: 7076053
    Abstract: The PBX system includes an analog to digital, and digital to analog, (A/D) conversion where the sample size and the sample rate are selectively adjustable. The A/D structure includes registers which hold values indicating the sample size and the sample rate for the conversion. When the A/D structure is configured, the A/D structure reads the values in the register and configures itself to the sample rate and sample size indicated by the registers. When the sample size and sample rate is to be changed, the values in the registers are changed and the A/D structure is reconfigured.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: July 11, 2006
    Assignee: 3Com Corporation
    Inventors: Michael S. McCormack, Paul Dryer
  • Patent number: 6963829
    Abstract: A bridge board connects a TMS470 processor evaluation module and a TMS320C54XX processor evaluation module. The bridge board performs translation of signal formats on both of the boards and also synchronizes the signal formats on both boards so that both boards are able to operate together. With this bridge board, and its specific connections to both of the evaluation modules, a single workstation, preferably connected to the TMS470 module is able to not only control the TMS470 module but also the TMS320 module. Software for the TMS320 can be loaded from the workstation through the TMS470 module, through the bridge board and into the TMS320 module. The software in both of the evaluation modules can then operate and interact with each other through the bridge board.
    Type: Grant
    Filed: February 8, 2001
    Date of Patent: November 8, 2005
    Assignee: 3Com Corporation
    Inventors: Angel Pino, Paul Dryer, Michael S. McCormack
  • Patent number: 6854015
    Abstract: A card, particularly a digital line card is provided for use with a chassis having a slot for receiving the digital line card. The chassis has an Ethernet bus for receiving packets from the line card and has a power supply and power strip for supplying power to the line card. The line card includes a public switched telephone network (PSTN) digital line input/output interface for sending digital signals over the PSTN and for receiving digital signals from PSTN. A line card control processor is connected to the digital line input/output interface. An Ethernet input/output is provided for sending packets over a local network corresponding to signals received from the telephone line and for receiving packets from the local network and forwarding received signals to the digital line input/output interface.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: February 8, 2005
    Assignee: 3Com Corporation
    Inventors: Michael S. McCormack, Paul Dryer, Steve Weeks
  • Patent number: 6735297
    Abstract: A programmable telephone system including system software and system hardware. The system software includes instructions for operating the telephone system, and requires license information to operate. The system hardware includes a system specific memory and a system board. The system board executes the instructions of the system software. The system specific memory store is the license information and is separately replaceable from the system board in the system hardware.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: May 11, 2004
    Assignee: 3Com Corporation
    Inventors: Michael S. McCormack, Paul Dryer