Patents by Inventor Paul E. Collander

Paul E. Collander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip module package with insulating tape having electrical leads and solder bumps
    Patent number: 5872700
    Abstract: The invention relates to microcircuit packaging techniques, and more particularly to the packaging of a structure compiled of several microcircuits. In an arrangement according to the invention, unpackaged components (2) are mounted on a substrate (20), and to the substrate (20) there is attached a tape (4); on the side of the tape directed away from the substrate, there are formed solder bumps (10). By the solder bumps (10), the whole structure can be mounted to a circuit board by applying conventional surface-mounting techniques. The connections between the solder bumps (10) and the I/O lines of the substrate are realised by conductive patterns formed on the tape, and by leads (14) provided at the edges of the tape.
    Type: Grant
    Filed: July 7, 1997
    Date of Patent: February 16, 1999
    Assignee: Nokia Mobile Phones Limited
    Inventor: Paul E. Collander