Patents by Inventor Paul E. Dumke

Paul E. Dumke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • External bus interface printed circuit board routing for a ball grid array integrated circuit package
    Patent number: 6011695
    Abstract: A top surface of the substrate may have a two-dimensional array of contact pads that are adapted to be connected to a two-dimensional array of contacts of the integrated circuit package. The contact pads may be connected to a staggered array of vias by a plurality of routing traces located on the top surface of the substrate.
    Type: Grant
    Filed: November 2, 1998
    Date of Patent: January 4, 2000
    Assignee: Intel Corporation
    Inventor: Paul E. Dumke