Abstract: A method is used for forming sliders for use in a disc drive actuation system. The method comprises providing a wafer formed of a substrate having a base coat and an overcoat. Wafer-level notch lanes having a first width extend across the wafer in a first direction. The overcoat is removed from the wafer-level notch lanes. The wafer is sliced along a portion of the wafer-level lanes through the base coat to form a channel. The wafer is mechanically sliced through the substrate along slice lanes that extend across the wafer in the first direction to differentiate the wafer into bars. The bars are cut in a second direction substantially perpendicular to the first direction to form the sliders.

Abstract: A method is used for forming sliders for use in a disc drive actuation system. The method comprises providing a wafer formed of a substrate having a base coat and an overcoat. Wafer-level notch lanes having a first width extend across the wafer in a first direction. The overcoat is removed from the wafer-level notch lanes. The wafer is sliced along a portion of the wafer-level lanes through the base coat to form a channel. The wafer is mechanically sliced through the substrate along slice lanes that extend across the wafer in the first direction to differentiate the wafer into bars. The bars are cut in a second direction substantially perpendicular to the first direction to form the sliders.

Abstract: A method is used for aligning a slider on a gimbal. The gimbal includes a slider opposing face with a flex circuit material on the slider opposing face and a flex on suspension (FOS) bond pad is disposed on the flex circuit material. The slider has a gimbal opposing face and a disc opposing face. Both faces are bounded by a leading edge and a trailing edge. The slider has a forward face along the trailing edge extending between the gimbal opposing face and the disc opposing face. An extended bond pad is formed on the forward face of the slider. A notch is formed on the slider in the forward face adjacent the gimbal opposing face. The slider is placed on the flex circuit material such that the extended bond pad is positioned relative to the FOS bond pad to improve bond strength and static attitude.