Abstract: A structure and method of fabrication is provided for a micromechanical overrange protected pressure sensor. A pressure sensor having a silicon substrate is provided with a cavity and a deformable diaphragm wherein deflection of the diaphragm in response to pressure is limited by a forward pressure stop. A method is provided for electrodepositing a metal layer which is attached to the substrate adjacent to the diaphragm to provide a reverse pressure stop in response to pressure supplied to the underside of a diaphragm. The metal layer has a relatively low thermal coefficient of expansion and is patterned through use of a photo-resist layer. A previously deposited precision spacer between the diaphragm and reverse pressure stop is removed to provide a precision gap between the reverse pressure stop and the diaphragm.

Abstract: A planar winding assembly includes first and second windings, each winding having an axis and a pair of insulative sheet layers, laminated together, with at least one of each of the pairs of insulative sheets having a hole. Each winding further includes a metal strip conductor that is wound about the axis of its winding and is sealed between the laminated insulative sheet layers. The metal strip conductor has a portion projecting into the hole. The metal strip conductor of the first winding is electrically connected to the metal strip conductor of the second winding through the holes of the insulative sheets.

Abstract: A multi-deck power converter module assembly for connection with a substrate (e.g., a host board) having connection regions disposed on its surface includes a second circuit board positioned over a first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board. At least two rail members are positioned over the second circuit board, each rail member having a first and a second plurality of holes. A pair of spacers are disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of one of the rail members. Terminal pins are attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate.

Abstract: A multi-deck power converter module assembly for connection with a substrate (e.g., a host board) having connection regions disposed on its surface includes a second circuit board positioned over a first circuit board, the second circuit board having apertures extending from an upper surface to a lower surface of the second circuit board. At least two rail members are positioned over the second circuit board, each rail member having a first and a second plurality of holes. A pair of spacers are disposed between the first and second circuit boards, each spacer extending through one of the apertures of the second circuit board and received within one of the first plurality of holes of one of the rail members. Terminal pins are attached to the first circuit board, at least one terminal pin extending through the second circuit board and a corresponding one of the second plurality of holes for connection to one of the connection regions on the substrate.

Abstract: A planar winding assembly includes first and second windings, each winding having an axis and a pair of insulative sheet layers, laminated together, with at least one of each of the pairs of insulative sheets having a hole. Each winding further includes a metal strip conductor that is wound about the axis of its winding and is sealed between the laminated insulative sheet layers. The metal strip conductor has a portion projecting into the hole. The metal strip conductor of the first winding is electrically connected to the metal strip conductor of the second winding through the holes of the insulative sheets.

Abstract: A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

Abstract: A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

Abstract: A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.

Abstract: A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.

Abstract: A process for making additive multilayer circuit boards uses separately designed and fabricated composite structures each consisting of a patterned conductive metal foil supported by a photo-processible insulating film. The composite is bonded foil pattern side down to the substrate or pre-existing multilayer structure and selected areas of the insulating film are removed down to underlying metal sites for electroless plating. All of the apertures in the insulating film are then electrolessly plated full of metal flush to the upper surface. Additional patterned composites are applied and plated up as desired to create blind vias and new conductor patterns layer by layer. In an alternate process a foil clad composite is bonded to an existing substrate foil side up. The insulating layer is selectively etched through windows photoetched in the foil layer. The voids in the insulator layer expose copper sites on the underlying composite.

Abstract: A method for patterning a photoresist or insulating layer on a printed wiring board utilizes two photoreactive coatings comprising a photoprocessable ultraviolet (UV) sensitive layer overlaid with a thin, unexposed, undeveloped strip base silver film. A white light x-y plotter, preferably employing an octagonal aperture, is driven directly from a CAD system to expose the film on the board in the desired pattern without affecting the underlying UV sensitive layer. The film is then developed on the board and employed as an in situ mask for the underlying UV layer during exposure of the board to a UV flood lamp. After UV exposure the film is peeled off to allow conventional processing of the selectively polymerized layer. This technique produces high resolution, inspectable onboard masks in full registration using reliable low energy plotters.

Abstract: The adverse effects of the impedance of long varying impedance connecting lines used in pulse width modulated power amplifier are eliminated by means of a dual input differential amplifier that senses the line voltage drops in the connecting lines and combines them into a line voltage drop compensation signal that is applied across the power amplifier inputs. This line voltage drop compensation signal raises the output of the power amplifier by the amounts needed to null out the line voltage drops.