Patents by Inventor Paul E. Logan

Paul E. Logan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6426565
    Abstract: An electronic package and method of making the electronic package is provided. An opening in the substrate of the electronic package is formed to substantially prevent adhesive which can bleed from under an electronic device from contacting conductive pads on the substrate. An electrical coupling is formed between the package's electronic device and conductive pads.
    Type: Grant
    Filed: March 22, 2000
    Date of Patent: July 30, 2002
    Assignee: International Business Machines Corporation
    Inventors: Ashwinkumar C. Bhatt, Paul E. Logan, Amarjit S. Rai